JPS60160153A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS60160153A
JPS60160153A JP1337484A JP1337484A JPS60160153A JP S60160153 A JPS60160153 A JP S60160153A JP 1337484 A JP1337484 A JP 1337484A JP 1337484 A JP1337484 A JP 1337484A JP S60160153 A JPS60160153 A JP S60160153A
Authority
JP
Japan
Prior art keywords
cooling chamber
coolant
cap
chip
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1337484A
Other languages
Japanese (ja)
Inventor
Naoyuki Hatanaka
畑中　直行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1337484A priority Critical patent/JPS60160153A/en
Publication of JPS60160153A publication Critical patent/JPS60160153A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To realize an IC device equipped with a high cooling efficiency by a method wherein the lower opening of a cooling chamber provided with an inlet and an outlet for coolant is stopped by a heat-dissipating plate constituted of a good thermal conductor, an IC chip is fixed immobile to the lower surface of said heat-dissipating plate, the IC is connected to leads by means of connecting lines, and the chip and the inner ends of the connecting lines are covered by a cap. CONSTITUTION:Two screws 12 for liquid coolant are provided on the surface of a cooling cap 11 with its lower end open. The open end of the cap 11 is stopped by a heat- dissipating plate 13 made of a metal of excellent thermal conductivity such as Al or Cu with the intermediary of a sealing agent 16 for the constitution of a cooling chamber. With the cooling chamber constructed as such, one of the screws 12 is used as a coolant inlet and the other as coolant outlet, and the coolant is forced to circulate in the cooling chamber. Next, to the lower surface of the heat-dissipating plate 13, an IC15 is fixed immobile by using Au paste 14. The wiring electrodes in the IC chip 15 are connected, by using connecting lines 18, to the inner ends of leads 17. Finally, another cap 19 is used to cover the chip 15, connector lines 18, and the inner ends of the leads 17, for the sealing of them all by means of a sealing material 16.

Description

【発明の詳細な説明】 〔発明の属する技術分野〕 本発明は半導体装置に関するものである。[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to a semiconductor device.

〔従来技術とその問題点〕[Prior art and its problems]

半導体装置の冷却方式として大電力用半導体装置におい
ては、例えば第１図のような冷媒の強制対流による冷却
方式がある。ｌは素子、２はポンプ、３は冷媒の流れを
示している。しかし、この様な支持基板自体を冷却する
方式は半導体装置を通常のプリント配線基板等に取り付
けるＩＣ（集積回路゛）には適用できない。As a cooling method for a semiconductor device, for a semiconductor device for high power use, there is, for example, a cooling method using forced convection of a coolant as shown in FIG. 1 indicates the element, 2 indicates the pump, and 3 indicates the flow of refrigerant. However, such a method of cooling the support substrate itself cannot be applied to an IC (integrated circuit) in which a semiconductor device is attached to a normal printed wiring board or the like.

一方、集積回路半導体装置においては、例えば第２図の
ような放熱板４空冷方式等があるが，十分な冷却効果は
得られない。On the other hand, in integrated circuit semiconductor devices, for example, there is a heat sink 4 air cooling method as shown in FIG. 2, but a sufficient cooling effect cannot be obtained.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、集積回路半導体装置の放熱効果を高め
ることにある。An object of the present invention is to improve the heat dissipation effect of an integrated circuit semiconductor device.

〔発明の概要〕[Summary of the invention]

前記目的を達成するため，本発明は、集積回路チップを
熱伝導性放熱板下に取りつけ，この放熱板に前記集積回
路チップの電極にボンディングワイヤを介して接続され
るリードを挟む形態で前記集積回路チップを密封する蓋
体を取りつけ、さらに放熱板を挟んで前記集積回路チッ
プと反対側に、冷媒の導入口と排出孔が設けられた冷却
用キャップを設けたことを特徴とするものである。In order to achieve the above object, the present invention provides a structure in which an integrated circuit chip is mounted under a thermally conductive heat sink, and leads connected to electrodes of the integrated circuit chip via bonding wires are sandwiched between the heat sink. A lid body for sealing the circuit chip is attached, and a cooling cap is provided on the opposite side of the integrated circuit chip with a heat sink in between, and is provided with a refrigerant inlet and a discharge hole. .

〔発明の効果〕〔Effect of the invention〕

この半導体装置は、装置自体が既に冷却可能な形態にな
っておυ、ボード等にｄ易に取り付は可能である。また
、冷媒の導入口と排出口が設けられているため、冷媒の
強制対流による冷却が可能であり、前記集積回路半導体
装置の冷却方式と比べて個々の半導体装置をくまなく冷
却することが可能であυ、その冷却効果も大きい。This semiconductor device is already in a coolable form and can be easily mounted on a board or the like. In addition, since a refrigerant inlet and outlet are provided, it is possible to cool the refrigerant by forced convection, and compared to the above-mentioned cooling method for integrated circuit semiconductor devices, it is possible to thoroughly cool each semiconductor device. And its cooling effect is also great.

〔発明の実施例〕[Embodiments of the invention]

発下、本発明を実施例により説明する。第３図は本発明
の実施例を示すもので、（ａ）は＠面図、（ｂ）は平面
図（上から見た）である。The present invention will now be explained by way of examples. FIG. 3 shows an embodiment of the present invention, in which (a) is a @ side view and (b) is a plan view (viewed from above).

１１は冷却用キャップ、１２は冷却液用ネジ、１３は銅
あるいはアルミニウムからなる放熱板、１４は集積回路
チップ接続用金ペースト膜、１５は金ペースト膜を介し
て放熱板に接続された集積回路チップ。11 is a cooling cap, 12 is a screw for cooling liquid, 13 is a heat sink made of copper or aluminum, 14 is a gold paste film for connecting an integrated circuit chip, and 15 is an integrated circuit connected to the heat sink via the gold paste film. Chip.

１６は封止用材、１７はリードで、個々のリードが別個
に取り付けられるのではなく、リードフレームとして一
体に取シ付けられ封止後においてリードフレームの不用
部分が切断除去されてはじめて各リードが他のリードか
ら切りはなされる。１８はリードの先端と集積回路チッ
プの電極とを相互に接続するコネクタ線、１９は封止用
キャップである。16 is a sealing material, and 17 is a lead.Individual leads are not attached separately, but are attached as a whole as a lead frame, and each lead is not attached until after the unnecessary parts of the lead frame are cut and removed after sealing. Cut from other leads. 18 is a connector wire that interconnects the tips of the leads and the electrodes of the integrated circuit chip, and 19 is a sealing cap.

この半導体装置は、熱良伝導性放熱板１３を用意し、リ
ードフレームを封止用剤１６を介して接着し、次いでチ
ップボンディング、ワイヤボンディングをした後、封止
用キャップ１９及びネジ孔を加工した冷却用キャップ１
１を封止用材１６を介して接着し。In this semiconductor device, a heat sink 13 with good thermal conductivity is prepared, a lead frame is bonded via a sealing agent 16, chip bonding and wire bonding are performed, and then a sealing cap 19 and screw holes are formed. Cooling cap 1
1 through a sealing material 16.

冷却液用ネジを取り付けることにより製造する。Manufactured by attaching coolant screws.

この半導体装置の使用時は冷却液用ネジをはずし、専用
のパイプ等を用いることにより冷媒を循環させることが
できる。かかる装置は、プリント基板（ボード）等に従
来同様高密度に配置することが素を強制対流させ冷却す
る。When using this semiconductor device, the coolant can be circulated by removing the coolant screw and using a dedicated pipe or the like. Such a device cools the elements by forced convection by disposing them on a printed circuit board (board) or the like in a high density manner as in the conventional case.

この実施例においては冷却用ネジが冷却用キャップの上
面に設けられているが、側面に設ける場合も考えられる
。冷却用ネジを上面に設けたものは、ボード等に高密度
に配置でき、ボードを重ねて用いたボードとボードの間
隔が問題となる場合等は、側面に設けたものを用いるこ
とができる。In this embodiment, the cooling screw is provided on the top surface of the cooling cap, but it is also possible to provide it on the side surface. Those with cooling screws provided on the top surface can be arranged in a high density on boards etc., and those provided on the side surfaces can be used when boards are stacked and the spacing between the boards is a problem.

何れにしても冷却室は上部に設けられるのでリードが不
用意に長くなるのが防止できる。In any case, since the cooling chamber is provided at the top, it is possible to prevent the leads from becoming unnecessarily long.

尚、この実施例においては、金属性の放熱板１３に封止
用材１６を介してリードを接着するので、短絡を防止す
るために、封止用材の厚さを必要なだけとシ、リードと
放熱板が接触しないようにすることが好ましい。In this embodiment, the leads are bonded to the metal heat sink 13 through the sealing material 16, so in order to prevent short circuits, the thickness of the sealing material is set to the required thickness, and the leads are bonded to the metal heat sink 13 through the sealing material 16. It is preferable that the heat sinks do not touch each other.

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図（ａ）、　（ｂ）は従来技術を説明す
る図、第３図（ａ）、（ｂ）は本発明の実施例を示すも
ので、（ａ）は断面図、（ｂ）は平面−である。 図において。 １１・・・冷却用キャップ、 １２・・・冷却用液ネジ。 １３・・・放熱板。 １４・・・金ペースト膜。 １５・・・集積回路チップ。 １６・・・封止用材。 １７・・・リード。 ｔＳ・・・コネクタ用ワイヤ。 １９・・・封止用キャップ。1 and 2 (a) and (b) are diagrams explaining the prior art, and FIGS. 3 (a) and (b) show an embodiment of the present invention; (a) is a sectional view; (b) is a plane. In fig. 11...Cooling cap, 12...Cooling liquid screw. 13... Heat sink. 14... Gold paste film. 15...Integrated circuit chip. 16... Sealing material. 17...Lead. tS...Wire for connector. 19...Sealing cap.

Claims (2)

【特許請求の範囲】[Claims] （１）冷媒の導入口と排出口が設けられた冷却室と、こ
の冷却室の裏側に取り付けられた集積回路チップと、前
記冷却室の下に取υ付けられ、前記集積回路チップを密
封する蓋体と、この蓋体と前記冷却室との間に狭まれた
前記集積回路と接続するリードとを有する半導体装置。(1) A cooling chamber provided with a refrigerant inlet and outlet, an integrated circuit chip attached to the back side of the cooling chamber, and a cooling chamber installed under the cooling chamber to seal the integrated circuit chip. A semiconductor device comprising a lid and a lead connected to the integrated circuit sandwiched between the lid and the cooling chamber. （２）導入口と排出口は冷却室の上面に設けられた事を
特徴とする特許 半導体装置。(2) A patented semiconductor device characterized in that the inlet and outlet are provided on the upper surface of the cooling chamber.
JP1337484A 1984-01-30 1984-01-30 Semiconductor device Pending JPS60160153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1337484A JPS60160153A (en) 1984-01-30 1984-01-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1337484A JPS60160153A (en) 1984-01-30 1984-01-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS60160153A true JPS60160153A (en) 1985-08-21

Family

ID=11831318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1337484A Pending JPS60160153A (en) 1984-01-30 1984-01-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS60160153A (en)

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