JPS60158691A - Method of producing electric insulating board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing an electrically insulating substrate in which the adhesive strength between a conductive material and an insulating layer and between an insulating layer and a metal material for heat dissipation is greatly improved.

Conventionally, electrically insulating substrates have been known in which a film made of glass cloth impregnated with epoxy resin is used as an insulating layer and an adhesive layer, and is sandwiched between a conductive material and a metal material for heat dissipation, but the adhesive strength is not necessarily sufficient. Ta.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing an electrically insulating substrate in which the adhesive strength between a conductive material and an insulating layer and between an insulating layer and a metal material for heat dissipation is greatly improved.

That is, in the present invention, an insulating layer forming resin is electrodeposited on a conductive material (or a heat dissipating metal material) and semi-cured or completely cured.
Next, a metal material for heat dissipation (or a conductive material) is overlaid on the semi-cured resin layer with or without an adhesive and completely cured, or a metal material for heat dissipation is layered on the fully cured resin layer with an adhesive. The present invention relates to a method for manufacturing an electrically insulating substrate characterized by bonding materials (or conductive materials).

According to the present invention, as described above, an electrically insulating substrate having excellent adhesive strength can be obtained by bonding a conductive material and a heat dissipating metal material using an electrodeposited film of an insulating layer-forming resin as a medium.

Conventionally, the conductive material and the insulating layer, and the insulating layer and the heat dissipating metal material were both bonded using adhesives, so there were two risks due to adhesive peeling. However, according to the present invention, there is no need to use an adhesive in the case of semi-curing and subsequent complete curing, so there is no risk of adhesive peeling due to the adhesive. Further, even in the case of complete curing and subsequent bonding with an adhesive, there is a feature that there is only one risk of adhesive peeling.

Therefore, it greatly contributes to improving the stability of the product.

In the present invention, any metal material for heat dissipation can be used, such as ordinary aluminum plates, various corrosion-resistant aluminum plates, iron plates, steel plates, copper plates, nickel plates, stainless steel plates, brass plates, silicon steel plates, duralumin plates, or surface materials. Examples include various plated metal plates, such as galvanized aluminum plates. The thickness of this metal plate is usually preferably 0.31 or more, particularly preferably about 0.5 to 51, from the viewpoint of self-retainability.

Next, various types of electrodepositing resins can be used to form the insulating layer, including anionic and cationic electrodepositable resins such as acrylic resins and acrylic-dipoxy resins. The thickness of the insulating layer depends on insulation properties, heat dissipation properties, etc., but is usually preferably about 150 μm or less, particularly preferably about 50 to 100 μM.

Various types of conductive materials can be used, but conductive materials such as copper foil, aluminum foil, and nickel foil are preferred from the viewpoint of etching properties, electrical conductivity, ease of plating, and the like. The thickness of the conductive material is usually preferably about 1 to 150 μm, particularly about 5 to 50 μm, considering the etching accuracy during processing of the obtained substrate.
is suitable.

The electrically insulating substrate of the present invention is composed of a conductive material A, an insulating layer B, and a heat dissipating metal material C. For example, a resin for forming B is electrodeposited on A and semi-cured, and then this resin layer is coated with an adhesive. Alternatively, the electrical insulating substrate of the present invention can be obtained by overlapping C without using it (by completely curing the j1 resin.Also, in this case, the same effect can be obtained by replacing A and C.Furthermore, the electrically insulating substrate of the present invention can be obtained by superimposing resin for forming B on A. It can be obtained by electrocoating and completely curing, and then adhering C to this I (fat layer) using an adhesive. In this case, the same effect can be obtained even if A and C are replaced.

In the electrodeposition coating, a known electrodeposition coating method can be used by using the B-forming resin as an aqueous electrodeposition varnish such as a water-dispersible or water-soluble electrodeposition varnish. Conditions for achieving a semi-cured state or a fully cured state, such as heating temperature and heating time, vary depending on the type of resin used, the presence or absence of a curing agent, etc., and are therefore preferably determined appropriately. Various types of adhesives can be used, but those with heat resistance are particularly preferred.
R73286), epoxy-nylon type (3M Company, A
F-42), imide type (Sanji Hishiga Daigakusha, BF Resin), etc. can be used.

One example of the manufacturing method of the electrically insulating substrate of the present invention is to use a conductive material laminated with a mask film on one side as one electrode, electrodeposit a resin for forming an insulating layer, and semi-cure ( or completely cured), and then the discharge metal material is overlaid and completely cured (or bonded). After the electrodeposition process, if necessary, the electrodeposition layer may be washed with water or
459, in order to improve the electrical insulation properties, mechanical properties, etc. of the electrodeposited baking layer, vapors of a specific solvent such as dimethylformamide (DMF) are applied to the electrodeposited layer prior to baking. It is also optional to contact with water vapor or high temperature steam of about 100 to 600°C.

According to the method of the present invention, it is possible to obtain an electrically insulating substrate having adhesive strength superior to that of the conventional method, and it is also possible to make the manufacturing process continuous, thereby reducing costs.

The electrically insulating substrate of the present invention is suitable for various integrated circuit boards, printed wiring boards, heat sinks, and others.

A detailed explanation will be given below using reference examples and examples.

Reference Example 1 To 100 parts by weight of a mixture having a monomer composition ratio of 50 mol% acrylonitrile, 40 mol% ethyl acrylate, and 10 mol% acrylic acid, 70% lauryl sulfate ester was added.
．． After adding 5 parts by weight and 0.2 parts by weight of persulfate in water at room temperature in a nitrogen stream for 4 hours,
Xylylene diamine was added in a proportion of 172 equivalents of the added acrylic acid to obtain an electrodeposition varnish. The pH of varnish is 6
．． 2. The solid content was 19%.

Example 1 300mm x 300 masked on one side with adhesive tape
#IN with a thickness of 35 μm was immersed in the above varnish, electrodeposited for 15 seconds at an electrodeposition voltage of 20 V, washed with water, removed the mask tape, heated at 120° C. for 5 minutes, and semi-cured (B - stage) copper foil with one side insulated was obtained.

Place this on a 30 On + m x 300 mm, 1.5 mm thick aluminum plate so that the insulating layer is in contact with the aluminum surface, and
A substrate was obtained by hot pressing at 00° C. for 10 minutes and a pressure of 55 kg/am 2 .

Example 2 Adhesive tape on one side? 300mm x 300
Using acrylic water-soluble thermosetting varnish AL, = 100 (manufactured by Honey Kasei) on an aluminum plate of 1ffm, thickness 1,5+on+, mold was deposited at an electrodeposition voltage of 80V for 2 minutes, washed with water, and mask tape was applied with a mask tape of ffL140. C. for 5 minutes to obtain an aluminum plate insulated on one side in a semi-cured (B-stage) state.

This is 30011IIIl×300111111. Copper foils having a thickness of 35 μm were stacked so that the insulating layer was in contact with the copper foils, and hot pressed under the same conditions as in Example 1 to obtain a substrate.

Example 3 300fim x 300m with one side masked with adhesive tape
n+.

Using acrylic water-dispersible thermosetting varnish V-551-20 (manufactured by Ryoden Kasei Co., Ltd.) on a copper foil with a thickness of 35μ, the copper foil was used as an anode and the dimethylformamide solution was applied at an electrodeposition voltage of 15V for about 20 seconds. After being immersed in water for 10 seconds, the silver foil was heated at 150° C. for 5 minutes to obtain a semi-cured (B-stage) silver foil insulated on one side.

This was hot pressed in the same manner as in Example 1 to obtain a substrate.

Example 4 In Example 3, instead of dimethylformamide, 2()0°C
After being immersed in a heated steam atmosphere for 5 minutes, the substrate was hot pressed in the same manner as in Example 3 to obtain a substrate.

Example 5 Example 3 except that the electrodeposition conditions were set to a voltage of 15 V for 15 seconds.
After obtaining single-sided insulation 1111M in the same manner as above, the aluminum plate and the above-mentioned single-sided insulated copper foil were laminated using adhesive tape (Vyralux LF 0100, manufactured by DuPont) as an adhesive, and hot pressed to obtain a substrate.

Example 6 Thickness: 1.5111ffl, 300n+n+X300II
The aluminum surface of a 1 m long Zn-plated aluminum plate was masked with adhesive tape, and the varnish used in Example 3 was used on the Zn-plated side, and electrodeposition was performed at a voltage of 15 V for 15 seconds using the Zn-plated aluminum plate as an anode.

Thereafter, it was post-treated and heated under the same conditions as in Example 3 to obtain a single-sided insulating Zn-plated aluminum plate, and hot pressed under the same conditions as in Example 3 to obtain a substrate.

Example 7 After electrodeposition under the same conditions as Example 5, it was immersed in a dimethylformamide solution, heated at 150°C for 5 minutes, and further heated at 200°C.
A single-sided insulated copper foil was obtained by heating at ℃ for 15 minutes. An adhesive film similar to that in Example 5 was inserted between the aluminum plate and the insulating copper foil,
A substrate was obtained by hot pressing.

Comparative Example 1 After electrodeposition under the same conditions as Example 3, immersed in dimethylformamide solution for 10 seconds, heated at 150°C for 5 minutes,
The electrodeposited film was further heated at 200° C. for 15 minutes to completely cure it, and then hot pressed in the same manner as in Example 3 to obtain a substrate.

Comparative Example 2 A 50 μm thick glass cloth impregnated with BP resin (manufactured by Mitsubishi Gas Chemical) was sandwiched between a 35 μm thick copper foil and a 1.5 mm thick aluminum plate and hot pressed to obtain a substrate. Ta.

Table 1 shows the physical properties of the substrates of Examples 1-7 and Comparative Examples 1-2. In the table, (1) using a brass cylindrical electrode with a weight of 500 g and an outer diameter of 25 mm (2) adhesion strength (medium 101) by 90° peeling method (3
) Both substrates had good adhesion direction by 90° peeling method after heating at 200° C. for 60 minutes, and hang heat resistance under conditions of 260° C. for 30 minutes.

Procedural Amendment Import and Distributor April 9, 1980 Patent Application No. 14042 of 1988 2, Title of invention Method for manufacturing electrically insulating substrates 3, Person making the amendment Relationship to the case Applicant (826) Inuichi Nippon Electric Cable Co., Ltd. Company 4, Agent Address: 1-2-8 Sonezaki, Kita-ku, Osaka 530 Maru Building Telephone (
16 (365) 0170 (Representative) (8153) Patent Attorney 1) Iwao Mura 5, Date of amendment order 78 Target of amendment Section 8 of “Detailed Description of the Invention” Contents of Amendment Contents of Circular Amendment attached with attached sheet 1. Correct the statement tlS4lS line 8, “Exist” to “Affected.”

2, page 6, line 2 Correct 1”BFJ to r13TJ.

3, page 11, line 8 Correct "rBP resin" to "BT resin".

(that's all)

Claims (2)

[Claims] (1) The resin for forming an insulating layer is electrodeposited on a conductive material (or metal material for heat dissipation), semi-cured or completely cured, and then the semi-cured resin layer is used for heat dissipation with or without adhesive. A method for manufacturing an electrically insulating substrate, characterized by stacking metal materials (or conductive materials) and completely curing them, or bonding a heat dissipating metal material (or conductive material) to a fully cured resin layer using an adhesive. . (2) The conductive material is a copper-based material, the heat-dissipating metal material is an aluminum-based material, and after the resin for forming an insulating layer is electrodeposited, it is semi-cured and overlapped with the other material without using an adhesive. The method according to claim 1, wherein the method is completely cured.