JPS60158215A - Epoxy resin composition for laminate - Google Patents

Epoxy resin composition for laminate

Info

Publication number
JPS60158215A
JPS60158215A JP1348684A JP1348684A JPS60158215A JP S60158215 A JPS60158215 A JP S60158215A JP 1348684 A JP1348684 A JP 1348684A JP 1348684 A JP1348684 A JP 1348684A JP S60158215 A JPS60158215 A JP S60158215A
Authority
JP
Japan
Prior art keywords
epoxy resin
acid group
resin composition
flame
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1348684A
Other languages
Japanese (ja)
Inventor
Tatsuya Fujimura
達也 藤村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP1348684A priority Critical patent/JPS60158215A/en
Publication of JPS60158215A publication Critical patent/JPS60158215A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Abstract

PURPOSE:The titled resin composition which can prevent a flame retarding filler from being settled, has good wettability with a resin and can form a laminate excellent in measling resistance, and soldering-heat resistance, prepared by mixing an epoxy resin with a curing agent, a flame-retarding filler and a surface treating agent at a specified ratio. CONSTITUTION:An epoxy resin (A) (e.g., bisphenol A glycidyl ether) is mixed with a curing agent (b) (e.g., dicyandiamide), a flame retarding filler (c) (e.g., aluminum hydroxide or antimony trioxide) and a surface treating agent (D) comprising an organic titanate of formula I or II (wherein X is an alkoxy, carboxylic acid, sulfonic acid, phosphoric acid, phosphorous acid or metaphosphoric acid group). The mixing ratio is such that 5-50pts.wt. component C is present per 100pts.wt. total of components A and B, and component D is present in an amount of 0.01-1.5wt% based on component C.

Description

【発明の詳細な説明】 [発明の技術分野] 本発明は、樹脂と充填剤との濡れ性に優れた積層板用エ
ポキシ樹脂組成物に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an epoxy resin composition for laminates that has excellent wettability between resin and filler.

[発明の技術的背景とその問題点] エポキシ樹脂積層板は、回路基板もしくは構造材料とし
て電子機器等で広く利用されているが、印刷配線板加工
工程の合理化、電子機器の小形化による実装密度の増大
、難燃化規制等により、耐ミーズリング性や半田耐熱性
の優れ、しかも難燃性を有する積層板が要求されるよう
になったきた。
[Technical background of the invention and its problems] Epoxy resin laminates are widely used as circuit boards or structural materials in electronic devices, etc., but due to the rationalization of printed wiring board processing processes and the miniaturization of electronic devices, packaging density has increased. Due to the increase in metallurgy and flame retardant regulations, there has been a demand for laminates that have excellent measling resistance and soldering heat resistance as well as flame retardancy.

難燃化のためには、エポキシ樹脂に難燃性の充填剤を配
合する方法や難燃性の樹脂成分を用いる方法或いはそれ
らの併用方法などいろいろな方法がある。
There are various methods for making the resin flame retardant, such as adding a flame retardant filler to the epoxy resin, using a flame retardant resin component, or using a combination of these.

従来、上記各種難燃化の方法のうち、最も経済的な方法
としてM燃性充填剤を配合する方法が採られているが、
難燃剤ど樹脂とのなじみ性等の問題がある。 即ち、難
燃性充填剤を配合したエポキシ樹脂組成物は、この組成
物を基材に含浸塗布(るために溶剤で希釈して使われる
が、その場合に組成物中の充填剤が沈降しやすく、また
充填剤とエポキシ樹脂との濡れ性が悪くなる欠点がある
Conventionally, among the various flame retardant methods mentioned above, the most economical method has been to incorporate M flammable filler.
There are problems such as compatibility with flame retardants and resins. In other words, an epoxy resin composition containing a flame-retardant filler is used by diluting it with a solvent in order to impregnate and coat the base material, but in this case, the filler in the composition may settle. This has the disadvantage that the wettability between the filler and the epoxy resin deteriorates.

そしてこの組成物を用いた積層板は耐ミーズリング性や
半田耐熱性が劣るという欠点もあった。
Laminated plates using this composition also have the disadvantage of poor measling resistance and soldering heat resistance.

[発明の目的] 本発明の目的は、上記の欠点を解消するためになされた
もので、難燃性充填剤の沈降が防止されるとともに樹脂
との濡れ性がよく、耐ミーズリング性及び半田耐熱性に
優れた積層板を得ることかできるエポキシ樹脂組成物を
提供しようとするものである。
[Object of the Invention] The object of the present invention was to solve the above-mentioned drawbacks, and it is possible to prevent the sedimentation of the flame retardant filler, have good wettability with resin, and improve measling resistance and solder resistance. The object of the present invention is to provide an epoxy resin composition from which a laminate with excellent heat resistance can be obtained.

[発明の概要] 本発明は、上記の目的を達成すべく鋭意研究を重ねた結
果、表面処理剤を添加することにより、難燃性充填剤の
沈降が防止され、そして樹脂との濡れ性も改良されるこ
とを見い出したものである。
[Summary of the Invention] As a result of intensive research to achieve the above objects, the present invention has been developed to prevent the sedimentation of the flame retardant filler and improve its wettability with the resin by adding a surface treatment agent. It has been found that this can be improved.

即ち、本発明は、 (a)エポキシ樹脂 (b)硬化剤 (c)難燃性充填剤 (d )表面処理剤 を主成分とし、前記(C)難燃性充填剤を、樹脂分[(
a ) + (b )’] 100重量部に対し5〜5
0!量部、また前記(d )表面処理剤を、前記(C)
難燃性充填剤に対し0.01〜1.5重量%配合するこ
とを特徴とする積層板用エポキシ樹脂組成物である。
That is, the present invention has (a) an epoxy resin, (b) a curing agent, (c) a flame-retardant filler, and (d) a surface treatment agent as its main components, and the flame-retardant filler (C) is a resin component [(
a) + (b)'] 5 to 5 per 100 parts by weight
0! Quantity of the surface treatment agent (d) above (C)
This is an epoxy resin composition for a laminate, characterized in that it is blended in an amount of 0.01 to 1.5% by weight based on the flame retardant filler.

本発明に用いる(a )エポキシ樹脂としては、1分子
中に2個以上のエポキシ基を有するエポキシ樹脂はすべ
て使用することができる。 例えば、ビスフェノールA
のグリシジルエーテル、ハロゲン化ビスフェノールへの
グリシジルエーテル、ノボラックのグリシジルエーテル
のようなグリシジル系エポキシ樹脂、エポキシ化ポリオ
レフィン、エポキシ化大豆油のような非グリシジル系エ
ポキシ樹脂などが挙げられる。 これらのエポキシ樹脂
は1種又は2種以上の混合系で用いることができる。
As the epoxy resin (a) used in the present invention, any epoxy resin having two or more epoxy groups in one molecule can be used. For example, bisphenol A
Examples include glycidyl epoxy resins such as glycidyl ether of , glycidyl ether of halogenated bisphenol, glycidyl ether of novolac, non-glycidyl epoxy resins such as epoxidized polyolefin, and epoxidized soybean oil. These epoxy resins can be used alone or in a mixed system of two or more.

本発明に用いる(b)硬化剤としては、一般に用いられ
ているエポキシ樹脂硬化剤ならばすべてのものが使用で
きる。 例えば、ジシアンジアミド、71ノールノボラ
ツク樹脂、酸無水物、ポリアミン等が挙げられ、これら
は1種又は2種以上の混合物として用いることができる
As the curing agent (b) used in the present invention, any commonly used epoxy resin curing agent can be used. Examples include dicyandiamide, 71-nol novolak resin, acid anhydride, polyamine, etc., and these can be used alone or in a mixture of two or more.

本発明に用いる(C)難燃性充填剤としては、水酸化ア
ルミニウム、三酸化アンチモン等が挙げられ、これらは
1種又は2種以上の混合系として用いることができる。
Examples of the flame-retardant filler (C) used in the present invention include aluminum hydroxide, antimony trioxide, and the like, and these can be used alone or as a mixture of two or more.

 この充填剤の配合部としては、樹脂分[(a )+ 
(b )] 1oo重量部に対して5〜50重量部であ
ることが必要である。 充填剤の配合部が5重口部未満
では難燃性に効果がなく、また50重量部を超えると樹
脂組成物の基材への含浸性が悪くなり好ましくない。
The blending portion of this filler is the resin component [(a)+
(b)] It is necessary that the amount is 5 to 50 parts by weight per 10 parts by weight. If the proportion of the filler is less than 5 parts by weight, there is no effect on flame retardancy, and if it exceeds 50 parts by weight, the impregnation of the resin composition into the base material becomes undesirable.

本発明に用いる(d )表面処理剤としては、一般式 %式%[] (但し、式中Xは、アルコキシ基、カルボン酸基、スル
ホン酸基、リン酸基、亜リン酸基又はメタリン酸基を表
わす)で示される有機チタネートで、例えば、イソプロ
ピルトリイソステ・アロイルチタネート、イソプロピル
トリドデシルベンゼンスルホニルチタネート、イソプロ
ピルトリス(ジオクチルパイロホスフェート)チタネー
ト、テトライソプロピルビス(ジオクチルホスファイト
)チタネート、テトラオクチルビス(ジトリデシルホス
ファイト)チタネート、テトラ(2,2−ジアリルオキ
シメチル−1−ブチル)ビス(ジトリデシル)ホスファ
イトチタネート、ビス(ジオクチルパイロホスフェート
)オキシアセテートチタネート、ビス(ジオクチルパイ
ロホスフェート)エチレンチタネート等が挙げられ、こ
れらは1種又は2種以上混合して用いることができる。
The surface treatment agent (d) used in the present invention has the general formula % [] (where X is an alkoxy group, a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, a phosphorous acid group, or a metaphosphoric acid group). isopropyl triisoste aroyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl) bis(ditridecyl) phosphite titanate, bis(dioctyl pyrophosphate) oxyacetate titanate, bis(dioctyl pyrophosphate) ethylene titanate, etc. These can be used alone or in combination of two or more.

 この表面処理剤の配合量は、前記(C)難燃性充填剤
の0.01〜1.5重量%配合することが必要である。
The amount of this surface treatment agent is required to be 0.01 to 1.5% by weight of the flame retardant filler (C).

配合量が0.01重量%未満では濡れ性に効果なく、一
方1.5重量%を超えても効果は変わらないし、またコ
スト高となり好ましくないためである。
This is because if the blending amount is less than 0.01% by weight, there is no effect on wettability, whereas if the blending amount exceeds 1.5% by weight, the effect will not change and the cost will increase, which is not preferable.

[発明の効果] 本発明の積層板用エポキシ樹脂組成物は、表面処理剤を
添加することによって、難燃性充填剤の沈降もなく、ま
た樹脂との濡れ性もよく、この組成物を使用した積層板
は耐ミーズリング性及び半田耐熱性に優れたものが得ら
れる。
[Effects of the Invention] By adding a surface treatment agent, the epoxy resin composition for laminates of the present invention does not cause sedimentation of the flame retardant filler and has good wettability with the resin. The resulting laminate has excellent measling resistance and soldering heat resistance.

[発明の実施例] 次に本発明の実施例について説明するが本発明は実施例
に限定されるものではない。 以下実施例および比較例
において1部」とは「重量部」を意味する。
[Examples of the Invention] Next, Examples of the present invention will be described, but the present invention is not limited to the Examples. In the following Examples and Comparative Examples, "1 part" means "part by weight."

実施例 臭素化ビスフェノールA型エポキシ樹脂100部、ジシ
アンジアミド3.5部、水酸化アルミニウム30部、お
よび表面処理剤としてテトラオクチルビス(ジトリデシ
ルホスファイト)チタネート0.45部(難燃性充填剤
に対して1.5重量%)を配合し、さらに2−エチル−
4−メチル−イミダゾール0.1部およびアセトンを加
えて積層板用エポキシ樹脂組成物のワニスとした。
Examples 100 parts of brominated bisphenol A epoxy resin, 3.5 parts of dicyandiamide, 30 parts of aluminum hydroxide, and 0.45 parts of tetraoctyl bis(ditridecyl phosphite) titanate as a surface treatment agent (as a flame retardant filler) 2-ethyl-
0.1 part of 4-methyl-imidazole and acetone were added to prepare a varnish for an epoxy resin composition for laminates.

次いでこのワニスを厚さ0.1g、m1Ilのガラス布
に含浸塗布乾燥し、樹脂分40.5重量%のプリプレグ
を得た。 このプリプレグ8枚とその表裏に厚さ35μ
の銅箔を重ねて170℃、60分間、40kg/ am
2の条件で加熱加圧一体に積層成形し、厚さ1 、61
111の銅張積層板を得た。 この積層板について半田
耐熱性、耐ミーズリング性、および耐燃性の試験を行な
ったので、その結果を第1表に示した。
Next, this varnish was impregnated and coated on a glass cloth of 0.1 g in thickness and ml, and dried to obtain a prepreg with a resin content of 40.5% by weight. 8 sheets of prepreg and a thickness of 35μ on the front and back sides.
40kg/am for 60 minutes at 170℃
Laminated and molded together under heat and pressure under the conditions of 2, thickness 1.61
A copper clad laminate of No. 111 was obtained. This laminate was tested for solder heat resistance, measling resistance, and flame resistance, and the results are shown in Table 1.

比較例 実施例に於いて表面処理剤を加えない他はすべて実施例
と同様にしてワニスを調製し、次いで積層板を得た。 
得られた積層板について同様に半田耐熱性、耐ミーズリ
ング性、および耐燃性を試験したので、その結果を第1
表に示した。
Comparative Example A varnish was prepared in the same manner as in the Example except that no surface treatment agent was added, and then a laminate was obtained.
The obtained laminate was similarly tested for soldering heat resistance, measling resistance, and flame resistance, and the results are shown in the first section.
Shown in the table.

第1表 *1 ワニス約200m lをガラスシリンダーにとり
一昼夜放置後透明となった深さを測定した *2 J l5−C−6481に準じて、260℃、1
0分後の7タレの有無を調べた *3 8時間煮沸少260℃の半田に(資)秒浸漬した
後のフクレの有無を調べた *4 (JL方式 第1表から明らかなように本発明は、沈降性がなく、濡
れ性のよい積層板用エポキシ樹脂組成物であることがわ
かる。
Table 1 *1 Approximately 200ml of varnish was placed in a glass cylinder and left to stand for a day and night, and the depth at which it became transparent was measured *2 According to J15-C-6481, 260℃, 1
The presence or absence of sagging after 0 minutes was checked. It can be seen that the invention is an epoxy resin composition for laminates that has no sedimentation and has good wettability.

Claims (1)

【特許請求の範囲】 1 (a)エポキシ樹脂 (b)硬化剤 (c)暉燃性充填剤 (d )表面処理剤 を主成分とし、前記難燃性充填剤を樹脂分[(a>+(
b)] 100重礒部に対し5〜50重量部、また前記
表面処理剤を前記難燃性充填剤に対し0.01〜1.5
重量%配合することを特徴とする積層板用エポキシ樹脂
組成物。 2 表面処理剤が一般式 %式% [ (但し式中Xは、アルコキシ基、カルボン酸基、スルホ
ン酸基、リン酸基、亜リン酸基又はメタリン酸基を表わ
す)で示される有機チタネート化合物であることを特徴
とする特許請求の範囲第1項記載の積層板用エポキシ樹
脂組成物。
[Scope of Claims] 1 (a) an epoxy resin (b) a curing agent (c) a flame retardant filler (d) a surface treatment agent as a main component, the flame retardant filler being a resin component [(a>+ (
b)] 5 to 50 parts by weight per 100 parts by weight, and 0.01 to 1.5 parts of the surface treatment agent to the flame retardant filler.
An epoxy resin composition for laminates, characterized in that it is blended in a weight percent. 2. An organic titanate compound whose surface treatment agent is represented by the general formula % (where X represents an alkoxy group, a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, a phosphorous acid group, or a metaphosphoric acid group). The epoxy resin composition for a laminate according to claim 1, characterized in that:
JP1348684A 1984-01-30 1984-01-30 Epoxy resin composition for laminate Pending JPS60158215A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1348684A JPS60158215A (en) 1984-01-30 1984-01-30 Epoxy resin composition for laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1348684A JPS60158215A (en) 1984-01-30 1984-01-30 Epoxy resin composition for laminate

Publications (1)

Publication Number Publication Date
JPS60158215A true JPS60158215A (en) 1985-08-19

Family

ID=11834443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1348684A Pending JPS60158215A (en) 1984-01-30 1984-01-30 Epoxy resin composition for laminate

Country Status (1)

Country Link
JP (1) JPS60158215A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4836769A (en) * 1985-11-26 1989-06-06 Mitsubishi Denki Kabushiki Kaisha Water-cooled winding for electromagnetic stirrer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468840A (en) * 1977-11-11 1979-06-02 Hitachi Chem Co Ltd Adhesive for copper-lined laminate
JPS56147843A (en) * 1980-04-16 1981-11-17 Matsushita Electric Ind Co Ltd Resin composition
JPS591526A (en) * 1982-06-28 1984-01-06 Fujitsu Ltd Resin composition for use in nozzle plate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468840A (en) * 1977-11-11 1979-06-02 Hitachi Chem Co Ltd Adhesive for copper-lined laminate
JPS56147843A (en) * 1980-04-16 1981-11-17 Matsushita Electric Ind Co Ltd Resin composition
JPS591526A (en) * 1982-06-28 1984-01-06 Fujitsu Ltd Resin composition for use in nozzle plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4836769A (en) * 1985-11-26 1989-06-06 Mitsubishi Denki Kabushiki Kaisha Water-cooled winding for electromagnetic stirrer

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