JPS5468840A - Adhesive for copper-lined laminate - Google Patents

Adhesive for copper-lined laminate

Info

Publication number
JPS5468840A
JPS5468840A JP13529877A JP13529877A JPS5468840A JP S5468840 A JPS5468840 A JP S5468840A JP 13529877 A JP13529877 A JP 13529877A JP 13529877 A JP13529877 A JP 13529877A JP S5468840 A JPS5468840 A JP S5468840A
Authority
JP
Japan
Prior art keywords
adhesive
resin
epoxy
epoxy resin
aluminum hydroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13529877A
Other languages
Japanese (ja)
Other versions
JPS5549640B2 (en
Inventor
Nobuo Uozu
Shin Takanezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP13529877A priority Critical patent/JPS5468840A/en
Publication of JPS5468840A publication Critical patent/JPS5468840A/en
Publication of JPS5549640B2 publication Critical patent/JPS5549640B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: A polyvinyl butyral, phenolic resin and epoxy resin are used as adhesive organic materials and a specific amount of aluminum hydroxide is incorporated thereto to produce title adhesive with high resistance to heat on soldering and good antitracking property.
CONSTITUTION: To 100 parts by wt of an adhesive organic material consisting of polyvinyl butyral, phenolic resin and epoxy resin are added 5W150 parts of aluminum hydroxide preferably with an average particle size of less than 3 microns and they are dispersed in a solvent such as methyl ethyl ketone to prepare said adhesive. The amount of the epoxy resin added is about 3W30 wt% in which about 30W70 wt% of the resin is a cyclic apliphatic epoxy one and the epoxy equivalent is at a level of 100W1500.
COPYRIGHT: (C)1979,JPO&Japio
JP13529877A 1977-11-11 1977-11-11 Adhesive for copper-lined laminate Granted JPS5468840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13529877A JPS5468840A (en) 1977-11-11 1977-11-11 Adhesive for copper-lined laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13529877A JPS5468840A (en) 1977-11-11 1977-11-11 Adhesive for copper-lined laminate

Publications (2)

Publication Number Publication Date
JPS5468840A true JPS5468840A (en) 1979-06-02
JPS5549640B2 JPS5549640B2 (en) 1980-12-12

Family

ID=15148422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13529877A Granted JPS5468840A (en) 1977-11-11 1977-11-11 Adhesive for copper-lined laminate

Country Status (1)

Country Link
JP (1) JPS5468840A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472241A (en) * 1977-11-22 1979-06-09 Hitachi Chem Co Ltd Adhesive for copper-plated laminate
JPS5885593A (en) * 1981-11-16 1983-05-21 鐘淵化学工業株式会社 Paper substrate material metal foil-covered laminated board
JPS60158215A (en) * 1984-01-30 1985-08-19 Toshiba Chem Corp Epoxy resin composition for laminate
JPS61126187A (en) * 1984-11-22 1986-06-13 Hitachi Chem Co Ltd Adhesive for copper-clad laminate
JPH03264350A (en) * 1990-03-15 1991-11-25 Showa Denko Kk Copper clad laminate
EP0592937A2 (en) * 1992-10-12 1994-04-20 Nitto Denko Corporation Tracking resistant material and circuit substrate using the material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS535235A (en) * 1976-07-05 1978-01-18 Matsushita Electric Ind Co Ltd Flame-retardant adhesives
JPS548643A (en) * 1977-06-21 1979-01-23 Matsushita Electric Ind Co Ltd Flame-retardant adhesive

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS535235A (en) * 1976-07-05 1978-01-18 Matsushita Electric Ind Co Ltd Flame-retardant adhesives
JPS548643A (en) * 1977-06-21 1979-01-23 Matsushita Electric Ind Co Ltd Flame-retardant adhesive

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472241A (en) * 1977-11-22 1979-06-09 Hitachi Chem Co Ltd Adhesive for copper-plated laminate
JPS5724826B2 (en) * 1977-11-22 1982-05-26
JPS5885593A (en) * 1981-11-16 1983-05-21 鐘淵化学工業株式会社 Paper substrate material metal foil-covered laminated board
JPH0219995B2 (en) * 1981-11-16 1990-05-07 Kanegafuchi Chemical Ind
JPS60158215A (en) * 1984-01-30 1985-08-19 Toshiba Chem Corp Epoxy resin composition for laminate
JPS61126187A (en) * 1984-11-22 1986-06-13 Hitachi Chem Co Ltd Adhesive for copper-clad laminate
JPH0437870B2 (en) * 1984-11-22 1992-06-22 Hitachi Chemical Co Ltd
JPH03264350A (en) * 1990-03-15 1991-11-25 Showa Denko Kk Copper clad laminate
EP0592937A2 (en) * 1992-10-12 1994-04-20 Nitto Denko Corporation Tracking resistant material and circuit substrate using the material
EP0592937A3 (en) * 1992-10-12 1997-03-05 Nitto Denko Corp Tracking resistant material and circuit substrate using the material

Also Published As

Publication number Publication date
JPS5549640B2 (en) 1980-12-12

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