JPS60157287A - Flexible electronic circuit board - Google Patents

Flexible electronic circuit board

Info

Publication number
JPS60157287A
JPS60157287A JP1234784A JP1234784A JPS60157287A JP S60157287 A JPS60157287 A JP S60157287A JP 1234784 A JP1234784 A JP 1234784A JP 1234784 A JP1234784 A JP 1234784A JP S60157287 A JPS60157287 A JP S60157287A
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit board
flexible electronic
flexible
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1234784A
Other languages
Japanese (ja)
Inventor
大槻 一彦
谷口 信義
仁志 西村
大井戸 彦文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1234784A priority Critical patent/JPS60157287A/en
Publication of JPS60157287A publication Critical patent/JPS60157287A/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は小型、軽量のランオ、ビテオ、カメラ等の電子
機器の電気回路配線に用いる可とう性電気絶縁基材を使
用したフレキシブル電子回路基板に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a flexible electronic circuit board using a flexible electrically insulating base material used for electrical circuit wiring of small and lightweight electronic devices such as cameras, video cameras, etc. It is.

従来例の構成とその問題点 近年、電子機器の小型、軽量化が要望されてお9、その
一つの手段として可とう性電気絶縁基材を用いたフレキ
シブル電子回路基板されその用途は大きく拡大されてき
ている。
Structures of conventional examples and their problems In recent years, there has been a demand for electronic devices to be smaller and lighter9, and as one means of achieving this, flexible electronic circuit boards using flexible electrically insulating base materials have been widely used. It's coming.

以下図面を参照しながら従来のフレキシブル電子回路基
板について説明する。
A conventional flexible electronic circuit board will be described below with reference to the drawings.

第1図及び第2図、第3図は従来のフレキシブル電子回
路基板の両面接続構造の断面図であり、第1図はスルホ
ールによるもの、第2図はハトメによるもの、第3図は
接続部材によるもので、1はフレキシブル電気絶縁基材
、2a、2bは金属導体により形成された電気回路、3
a、3b、3cは各両面接続構造によって用いられる接
続導体で以上のように構成されたフレキシブル電子回路
ノ1(板についてその動作を以下に説明する。
Figures 1, 2, and 3 are cross-sectional views of conventional double-sided connection structures of flexible electronic circuit boards, with Figure 1 using through holes, Figure 2 using eyelets, and Figure 3 showing connecting members. 1 is a flexible electric insulating base material, 2a and 2b are electric circuits formed of metal conductors, and 3
Reference numerals a, 3b, and 3c denote connection conductors used in each double-sided connection structure, and the operation of the flexible electronic circuit No. 1 (board) constructed as described above will be described below.

第1図のスルホールでは基板の貫通孔4の内i−;;+
(に銀及び銅等の材料による導体3aを形成し両面の接
続を実現しており、第2図の7・トノでは同しく基板の
貫通孔4にハトメ3dを取りつけて両面の接続を行なっ
ている。第3図の接続部材によるものでは基板に剪断割
溝またはシボリ加工穴を設けこの加工穴に接続部材を挿
入し、両者を半田イ・」5等の手段によって電気的導通
を得ている。
In the through hole shown in Fig. 1, i-;;+
(A conductor 3a made of materials such as silver and copper is formed to achieve connection on both sides, and in the case of 7 in Figure 2, an eyelet 3d is similarly attached to the through hole 4 of the board to connect on both sides. In the case of the connection member shown in Fig. 3, the board is provided with a shear split groove or a grooved hole, and the connection member is inserted into this hole, and the two are electrically connected by means such as soldering. .

しかしながら、上記のような構成においては、加工の工
程が多く複雑でありコスト高くなる。また電気的導通の
信頼性が低いという問題点を有していた。
However, in the above-mentioned configuration, there are many processing steps, which is complicated and increases the cost. Another problem was that the reliability of electrical continuity was low.

発明の目的 本発明の目的はフレキシブル電子回路両面基板の垂直方
向に電気的導通を得る目的で、スルホール穴加工及びノ
・トメ取付けかしめ作業や接続部材の挿入を加工の簡易
化や工程の省略等による大幅なコストダウン効果と信頼
性の高い電気的導通を得られる事を可能にした、フレキ
シブル電子回路基板を提供することである。
Purpose of the Invention The purpose of the present invention is to simplify the processing of through-hole drilling, attaching and caulking work, and inserting connecting members in order to obtain electrical continuity in the vertical direction of a double-sided flexible electronic circuit board. It is an object of the present invention to provide a flexible electronic circuit board that enables a significant cost reduction effect and highly reliable electrical continuity to be obtained.

発明の構成 本発明は可とう性電気絶縁基材の両面に金属導体回路を
形成したフレキシブル電子回路両面基板に剪断切り起こ
しによる加工穴を設は半田槽による電子回路部品の半田
付と同時にフレキシブル電子回路両面基板の垂直方向に
電気的導通を得る事を特徴とし、剪断切り起こし形状は
二つの舌片を基板に対し垂直に切り起こし、お互いの舌
片が平行になるように構成したものであり、これにより
半田槽による半田付時に溶融した半田が二つの舌片の両
壁にそって毛細管現象により上昇し、上面の金属導体に
達し表裏両面の電気的導通をなしうるものである。
Structure of the Invention The present invention is a flexible electronic circuit double-sided board in which metal conductor circuits are formed on both sides of a flexible electrically insulating base material. It is characterized by obtaining electrical continuity in the vertical direction of the double-sided circuit board, and the shear cut and raised shape is such that two tongue pieces are cut and raised perpendicularly to the board so that the tongue pieces are parallel to each other. As a result, the melted solder during soldering in the solder bath rises along both walls of the two tongues due to capillary action, reaches the metal conductor on the top surface, and can establish electrical continuity between the front and back surfaces.

実施例の説明 以下本発明の一実施例について、図面を参照しながら説
明する。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第4図は本発明の一実施例におけるフレキシブル電子回
路基板の剪断切り起こし部分の斜視図を示し、第5図は
半田付後の剪断切り起こし部の一部切欠斜視図を示すも
のである。第4図及び第5図において、1は可とう性電
気絶縁基材、2a及び2bは金属導体回路、5は半田で
あり、剪断切り起こしされた二つの舌片は基板に対し垂
直にすJシ起こし、お互いの舌片は平行に位置する。
FIG. 4 shows a perspective view of a sheared and raised portion of a flexible electronic circuit board according to an embodiment of the present invention, and FIG. 5 shows a partially cutaway perspective view of the sheared and raised portion after soldering. In Figures 4 and 5, 1 is a flexible electrically insulating base material, 2a and 2b are metal conductor circuits, 5 is solder, and the two sheared and raised tongue pieces are perpendicular to the board. Lift up and the tongues are parallel to each other.

以上のように構成された本実施例のフレキシブル電子回
路基板について以下その動作を説明する。
The operation of the flexible electronic circuit board of this embodiment configured as described above will be explained below.

フレキシブル電子回路両面基板に上記のような切り起こ
しを任意の位置に設け、チップ部品やディスクIJ −
ト部品を装着後、半田槽による半田付を実施すると、溶
融した半田は、切り起こされた二つの舌片の両壁にそっ
て毛細管現象により上昇し上面の金属導体回路に達し、
表裏両面の電気的導通が得られるものである。
A flexible electronic circuit double-sided board can be cut and raised at any desired position to create chip parts or disk IJ-
When soldering is performed using a solder bath after the parts are installed, the molten solder rises due to capillary action along both walls of the two cut-out tongues and reaches the metal conductor circuit on the top surface.
Electrical continuity between the front and back surfaces can be obtained.

以上のように本実施例によれば剪断切り起こし構造にし
たことにより、電子回路部品の半田付と同時に信頼性の
高い両面の電気的導通を実現している。なお、上の実施
例では剪断切り起こしの方向を半田槽の半田面に対し上
方としだが舌片の切り起こし方向は上方に限定されるも
のではなく、下方であっても同等の機能を有するもので
ある。
As described above, according to this embodiment, by using the shear cut-and-raise structure, highly reliable electrical continuity between both sides can be realized at the same time as soldering of electronic circuit components. In the above embodiment, the direction of shearing and raising is upward with respect to the solder surface of the solder tank, but the direction of cutting and raising the tongue piece is not limited to the upper direction, and the same function can be achieved even if the tongue is cut and raised downward. It is.

発明の効果 以上の説明から明らかなように、本発明は剪断切り起こ
し形状を第4図のように二つの舌片を、基板に対し垂直
に切り起こし、お互いの舌片が平行に位置するように構
成しているので、加工が非常に簡単であり、従来例のご
とくスルホール加工及びハトメの取付カシメ作業や接続
部材の挿入といった事がなく、大幅なコストダウンが可
能である。また電気的導通の信頼性が高いという優れた
効果が得られる。
Effects of the Invention As is clear from the above explanation, the present invention has a shear cut and raised shape in which two tongue pieces are cut and raised perpendicularly to the substrate as shown in Fig. 4, so that the tongue pieces are positioned parallel to each other. Because of this structure, the processing is very simple, and there is no need for through-hole processing, eyelet installation caulking work, or insertion of connecting members as in the conventional example, making it possible to significantly reduce costs. Further, an excellent effect of high reliability of electrical continuity can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図及び第3図は従来のフレキシブル電子回
路基板の断面図、第4図及び第5図は本発明の一実施例
におけるフレキシブル電子回路基板の両面接続構造の斜
視図及び、半田伺後の一部切欠斜視図である。 1・・・・可とう性電気絶縁基材、2a、2b−・金属
導体回路、3a・・スルホール、3b −ハトメ、3C
・・・・・接続部材、4 ・ 基板貫通孔、5・・・・
・半田。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図 第4図 第5図
1, 2 and 3 are cross-sectional views of a conventional flexible electronic circuit board, and FIGS. 4 and 5 are perspective views of a double-sided connection structure of a flexible electronic circuit board according to an embodiment of the present invention, and FIG. 3 is a partially cutaway perspective view after soldering. 1...Flexible electrical insulating base material, 2a, 2b--metal conductor circuit, 3a...through hole, 3b-eyelet, 3C
... Connection member, 4 ・ Board through hole, 5 ...
·solder. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 4 Figure 5

Claims (1)

【特許請求の範囲】[Claims] 可とう性電気絶縁基材の両面に金属導体回路を形成した
フレキシブル電子回路両面基板に剪断切シ起こしによる
加工穴を設は半田槽による電子回路部品の半田付と同時
にフレキシブル電子回路両面基板の垂直方向に電気的導
通を得ることを特徴とするフレキシブル電子回路基板。
Holes are formed by shear cutting in a double-sided flexible electronic circuit board in which metal conductor circuits are formed on both sides of a flexible electrically insulating base material. At the same time as soldering of electronic circuit components using a solder bath, holes are formed vertically on the double-sided flexible electronic circuit board. A flexible electronic circuit board characterized by obtaining electrical continuity in a direction.
JP1234784A 1984-01-25 1984-01-25 Flexible electronic circuit board Pending JPS60157287A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1234784A JPS60157287A (en) 1984-01-25 1984-01-25 Flexible electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1234784A JPS60157287A (en) 1984-01-25 1984-01-25 Flexible electronic circuit board

Publications (1)

Publication Number Publication Date
JPS60157287A true JPS60157287A (en) 1985-08-17

Family

ID=11802746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1234784A Pending JPS60157287A (en) 1984-01-25 1984-01-25 Flexible electronic circuit board

Country Status (1)

Country Link
JP (1) JPS60157287A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198914A (en) * 1991-04-08 1993-08-06 Molex Inc Method of mounting electronic element to substrate and electric device thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198914A (en) * 1991-04-08 1993-08-06 Molex Inc Method of mounting electronic element to substrate and electric device thereof

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