JPS60152093A - 電子部品の取付け方法 - Google Patents
電子部品の取付け方法Info
- Publication number
- JPS60152093A JPS60152093A JP59008057A JP805784A JPS60152093A JP S60152093 A JPS60152093 A JP S60152093A JP 59008057 A JP59008057 A JP 59008057A JP 805784 A JP805784 A JP 805784A JP S60152093 A JPS60152093 A JP S60152093A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- acrylate
- soldering
- methacrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59008057A JPS60152093A (ja) | 1984-01-19 | 1984-01-19 | 電子部品の取付け方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59008057A JPS60152093A (ja) | 1984-01-19 | 1984-01-19 | 電子部品の取付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60152093A true JPS60152093A (ja) | 1985-08-10 |
| JPH0475676B2 JPH0475676B2 (https=) | 1992-12-01 |
Family
ID=11682698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59008057A Granted JPS60152093A (ja) | 1984-01-19 | 1984-01-19 | 電子部品の取付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60152093A (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620008A (en) * | 1979-07-27 | 1981-02-25 | Mitsui Toatsu Chem Inc | Adhesive resin |
-
1984
- 1984-01-19 JP JP59008057A patent/JPS60152093A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620008A (en) * | 1979-07-27 | 1981-02-25 | Mitsui Toatsu Chem Inc | Adhesive resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0475676B2 (https=) | 1992-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3806738C1 (https=) | ||
| US4208005A (en) | Method for mounting parts on circuit boards | |
| DE69606396T2 (de) | Klebstoff, klebstofffilm und metallfolie, die auf ihrer rückseite mit klebstoff vorsehen ist | |
| EP0150674A2 (de) | Verfahren zur Herstellung von heisshärtbaren Klebefilmen | |
| DE60101910T2 (de) | Monocarbonsäuresalze von imidazolreaktionsprodukten, verfahren zur herstellung der salze, und oberflächenbehandlungen, zusätze für harze und harzzusammensetzungen welche diese enthalten | |
| US20090155597A1 (en) | Conductive adhesive precursor, method of using the same, and article | |
| JPH0358493A (ja) | 電子部品の実装方法およびこの方法に用いる接着剤 | |
| EP0661324B1 (de) | Lichtinitiiert kationisch härtende Epoxidmasse und ihre Verwendung | |
| US4398660A (en) | Method of mounting electronic components | |
| EP0688804A2 (de) | Mehrkomponentige, kationisch härtende Epoxidmassen sowie Verfahren zu ihrer Härtung | |
| JPS60152093A (ja) | 電子部品の取付け方法 | |
| US20020120031A1 (en) | Photothermosetting component | |
| JP2854749B2 (ja) | 紫外線・熱併用硬化性ソルダーレジストインキ組成物 | |
| JPH0384026A (ja) | 電子部品封止用硬化型樹脂組成物 | |
| JPH061906A (ja) | 感光性樹脂組成物 | |
| JPS6139759B2 (https=) | ||
| JP3339697B2 (ja) | エポキシ樹脂硬化性組成物 | |
| JPH02199179A (ja) | 塗料の硬化方法 | |
| JPS63251416A (ja) | 樹脂組成物及びソルダ−レジスト用樹脂組成物 | |
| WO2009082005A1 (ja) | 表面反応性支持体、それを用いた配線基板及びそれらの製造方法 | |
| KR20020064958A (ko) | 활성 에너지선 경화성 수지조성물 | |
| JPS59223775A (ja) | チツプ部品用接着剤 | |
| JPS59213780A (ja) | 紫外線硬化型ソルダレジストインキ | |
| JPS63154780A (ja) | 接着剤組成物及びその接着剤としての使用方法 | |
| JPH02218472A (ja) | 熱硬化性固形樹脂層の形成方法、硬化樹脂層の形成方法及び印刷配線基板の電磁シールド化方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |