JPS60149139A - リ−ドフレ−ム収納具 - Google Patents
リ−ドフレ−ム収納具Info
- Publication number
- JPS60149139A JPS60149139A JP16248384A JP16248384A JPS60149139A JP S60149139 A JPS60149139 A JP S60149139A JP 16248384 A JP16248384 A JP 16248384A JP 16248384 A JP16248384 A JP 16248384A JP S60149139 A JPS60149139 A JP S60149139A
- Authority
- JP
- Japan
- Prior art keywords
- guide grooves
- lead frame
- symmetrically
- groove
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003860 storage Methods 0.000 claims description 13
- 239000000956 alloy Substances 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 238000004512 die casting Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Extrusion Of Metal (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16248384A JPS60149139A (ja) | 1984-07-31 | 1984-07-31 | リ−ドフレ−ム収納具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16248384A JPS60149139A (ja) | 1984-07-31 | 1984-07-31 | リ−ドフレ−ム収納具 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13296681A Division JPS5835015A (ja) | 1981-08-25 | 1981-08-25 | リ−ドフレ−ム収納具の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60149139A true JPS60149139A (ja) | 1985-08-06 |
JPH0220143B2 JPH0220143B2 (enrdf_load_stackoverflow) | 1990-05-08 |
Family
ID=15755469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16248384A Granted JPS60149139A (ja) | 1984-07-31 | 1984-07-31 | リ−ドフレ−ム収納具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60149139A (enrdf_load_stackoverflow) |
-
1984
- 1984-07-31 JP JP16248384A patent/JPS60149139A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0220143B2 (enrdf_load_stackoverflow) | 1990-05-08 |
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