JPS60146351U - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPS60146351U JPS60146351U JP3501684U JP3501684U JPS60146351U JP S60146351 U JPS60146351 U JP S60146351U JP 3501684 U JP3501684 U JP 3501684U JP 3501684 U JP3501684 U JP 3501684U JP S60146351 U JPS60146351 U JP S60146351U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit device
- package
- bonding surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は、従来の混成集積回路装置の概略断面図を示す
ものであり、第２図はこの考案の一実施例を示すもので
、ａは混成集積回路装置の概略断面図、ｂはその概略斜
視図である。図中、１および１′は混成集積回路基板、
２および２′は外部接続用り一下、３および３′は混成
集積回路用パッケージである。
ものであり、第２図はこの考案の一実施例を示すもので
、ａは混成集積回路装置の概略断面図、ｂはその概略斜
視図である。図中、１および１′は混成集積回路基板、
２および２′は外部接続用り一下、３および３′は混成
集積回路用パッケージである。
Claims (1)
- パッケージ封止型の混成集積回路装置において、それぞ
れのパッケージ内に混成集積回路基板を収納し、−側に
開口接合面を有する同一寸法形状の２個の混成集積回路
用パッケージの開口接合面を向い合せに合致させ、前記
接合面相互間を封止して構成したことを特徴とする混成
集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3501684U JPS60146351U (ja) | 1984-03-12 | 1984-03-12 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3501684U JPS60146351U (ja) | 1984-03-12 | 1984-03-12 | 混成集積回路装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60146351U true JPS60146351U (ja) | 1985-09-28 |
Family
ID=30538921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3501684U Pending JPS60146351U (ja) | 1984-03-12 | 1984-03-12 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60146351U (ja) |
-
1984
- 1984-03-12 JP JP3501684U patent/JPS60146351U/ja active Pending
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