JPS60146346U - Thick film hybrid integrated circuit - Google Patents
Thick film hybrid integrated circuitInfo
- Publication number
- JPS60146346U JPS60146346U JP1984034951U JP3495184U JPS60146346U JP S60146346 U JPS60146346 U JP S60146346U JP 1984034951 U JP1984034951 U JP 1984034951U JP 3495184 U JP3495184 U JP 3495184U JP S60146346 U JPS60146346 U JP S60146346U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- thick film
- hybrid integrated
- film hybrid
- coating agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の厚膜混成集積回路の断面図、第ぶ
２図は本考案の一実施例の断面図である（但し、 。
両図ではケースは省略しである）。
１・・・・・・基板、３・・・・・・導体、３・・・・
・・抵抗、４・・・・・・半導体チップ、５・・・・・
・電極引き出しリード、６・・・・・・保護ガラス、７
・・・・・・コーティング剤、８・・・・・・接着剤、
９，１０・・・・・・コーティング剤流れ出し止め枠。FIG. 1 is a sectional view of a conventional thick film hybrid integrated circuit, and FIG. 2 is a sectional view of an embodiment of the present invention (however, the case is omitted in both figures). 1...Substrate, 3...Conductor, 3...
...Resistance, 4...Semiconductor chip, 5...
・Electrode extraction lead, 6... Protective glass, 7
...Coating agent, 8...Adhesive,
9, 10... Frame to prevent coating agent from flowing out.
Claims (1)
で覆ってあり、そのコーティング剤の周縁が枠で囲んで
ある厚膜混成集積回路において、前記枠がガラス製であ
ることを特徴とする厚膜混成集積回路。A thick film hybrid integrated circuit in which a semiconductor chip and an electrode lead are covered with a coating agent, and a frame surrounds the periphery of the coating agent, wherein the frame is made of glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984034951U JPS60146346U (en) | 1984-03-12 | 1984-03-12 | Thick film hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984034951U JPS60146346U (en) | 1984-03-12 | 1984-03-12 | Thick film hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60146346U true JPS60146346U (en) | 1985-09-28 |
Family
ID=30538793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984034951U Pending JPS60146346U (en) | 1984-03-12 | 1984-03-12 | Thick film hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60146346U (en) |
-
1984
- 1984-03-12 JP JP1984034951U patent/JPS60146346U/en active Pending
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