JPS60145341A - 半導体機器のリ−ド材用銅合金 - Google Patents

半導体機器のリ−ド材用銅合金

Info

Publication number
JPS60145341A
JPS60145341A JP174284A JP174284A JPS60145341A JP S60145341 A JPS60145341 A JP S60145341A JP 174284 A JP174284 A JP 174284A JP 174284 A JP174284 A JP 174284A JP S60145341 A JPS60145341 A JP S60145341A
Authority
JP
Japan
Prior art keywords
heat resistance
copper alloy
alloy
lead material
plating adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP174284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0353375B2 (enrdf_load_html_response
Inventor
Shigeo Shinozaki
篠崎　重雄
Kiichi Akasaka
赤坂　喜一
Hirohisa Iwai
岩井　博久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP174284A priority Critical patent/JPS60145341A/ja
Publication of JPS60145341A publication Critical patent/JPS60145341A/ja
Publication of JPH0353375B2 publication Critical patent/JPH0353375B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
JP174284A 1984-01-09 1984-01-09 半導体機器のリ−ド材用銅合金 Granted JPS60145341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP174284A JPS60145341A (ja) 1984-01-09 1984-01-09 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP174284A JPS60145341A (ja) 1984-01-09 1984-01-09 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS60145341A true JPS60145341A (ja) 1985-07-31
JPH0353375B2 JPH0353375B2 (enrdf_load_html_response) 1991-08-14

Family

ID=11510014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP174284A Granted JPS60145341A (ja) 1984-01-09 1984-01-09 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS60145341A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61264144A (ja) * 1985-05-20 1986-11-22 Nippon Mining Co Ltd 半田耐熱剥離性に優れた高力高導電銅合金
JPH01312047A (ja) * 1988-06-13 1989-12-15 Yazaki Corp 高力高導電性銅合金の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123746A (ja) * 1982-01-18 1983-07-23 Furukawa Electric Co Ltd:The 曲げ加工性に優れた半導体機器リード材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123746A (ja) * 1982-01-18 1983-07-23 Furukawa Electric Co Ltd:The 曲げ加工性に優れた半導体機器リード材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61264144A (ja) * 1985-05-20 1986-11-22 Nippon Mining Co Ltd 半田耐熱剥離性に優れた高力高導電銅合金
JPH01312047A (ja) * 1988-06-13 1989-12-15 Yazaki Corp 高力高導電性銅合金の製造方法

Also Published As

Publication number Publication date
JPH0353375B2 (enrdf_load_html_response) 1991-08-14

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Legal Events

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