JPS60142531A - 回路基板等の検査装置 - Google Patents
回路基板等の検査装置Info
- Publication number
- JPS60142531A JPS60142531A JP25015683A JP25015683A JPS60142531A JP S60142531 A JPS60142531 A JP S60142531A JP 25015683 A JP25015683 A JP 25015683A JP 25015683 A JP25015683 A JP 25015683A JP S60142531 A JPS60142531 A JP S60142531A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- probe
- contact probe
- support plate
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 title 1
- 239000000523 sample Substances 0.000 claims abstract description 129
- 239000000463 material Substances 0.000 claims abstract description 6
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 238000012360 testing method Methods 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 2
- 235000009037 Panicum miliaceum subsp. ruderale Nutrition 0.000 claims 1
- 244000022185 broomcorn panic Species 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25015683A JPS60142531A (ja) | 1983-12-28 | 1983-12-28 | 回路基板等の検査装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25015683A JPS60142531A (ja) | 1983-12-28 | 1983-12-28 | 回路基板等の検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60142531A true JPS60142531A (ja) | 1985-07-27 |
JPH0249536B2 JPH0249536B2 (enrdf_load_stackoverflow) | 1990-10-30 |
Family
ID=17203652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25015683A Granted JPS60142531A (ja) | 1983-12-28 | 1983-12-28 | 回路基板等の検査装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60142531A (enrdf_load_stackoverflow) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56148071A (en) * | 1980-04-21 | 1981-11-17 | Nippon Denshi Zairyo Kk | Multiple needle type probe |
JPS587835A (ja) * | 1981-06-30 | 1983-01-17 | インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン | プロ−ブ・アツセンブリ− |
JPS5880847A (ja) * | 1981-11-02 | 1983-05-16 | ジヨセフ・クバトロニツク | マトリクス・テスト・ヘッド装置 |
-
1983
- 1983-12-28 JP JP25015683A patent/JPS60142531A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56148071A (en) * | 1980-04-21 | 1981-11-17 | Nippon Denshi Zairyo Kk | Multiple needle type probe |
JPS587835A (ja) * | 1981-06-30 | 1983-01-17 | インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン | プロ−ブ・アツセンブリ− |
JPS5880847A (ja) * | 1981-11-02 | 1983-05-16 | ジヨセフ・クバトロニツク | マトリクス・テスト・ヘッド装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0249536B2 (enrdf_load_stackoverflow) | 1990-10-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11415600B2 (en) | Probe card for high frequency applications | |
KR860000227B1 (ko) | 소형회로 프로세싱 장치 및 이 장치에 사용하기 위한 매트릭스 테스트 헤드(matrix test head) | |
JP3124762B2 (ja) | 検査治具 | |
KR102164373B1 (ko) | 스크럽 제어 및 밴딩방향 제어가 가능한 수직형 프로브 카드용 니들 | |
JP4863466B2 (ja) | 基板検査用治具の製造方法 | |
KR101164011B1 (ko) | 프로브 카드 | |
JP3849948B1 (ja) | 基板検査用治具及び検査用プローブ | |
US7928749B2 (en) | Vertical probe comprising slots and probe card for integrated circuit devices using the same | |
US4177425A (en) | Multiple contact electrical test probe assembly | |
JPS587835A (ja) | プロ−ブ・アツセンブリ− | |
JPH0731211B2 (ja) | 回路試験用探針装置 | |
EP2859361B1 (en) | Probe card for an apparatus for testing electronic devices | |
KR20040013135A (ko) | 접촉자 | |
US20200124664A1 (en) | Electrical test apparatus having adjustable contact pressure | |
US6917212B2 (en) | Test fixture for printed circuit board assembly | |
US6130547A (en) | Test apparatus for printed circuit board and assembly kit therefor | |
US11585832B2 (en) | Probe card and probe module thereof | |
JPH01143977A (ja) | 印刷回路基板の電子検査装置用アダプタ | |
JP2001208777A (ja) | メンブレン・プローブ・カード | |
JPS60142531A (ja) | 回路基板等の検査装置 | |
JP7511325B2 (ja) | 垂直プローブと垂直プローブ用治具 | |
US20050083071A1 (en) | Electronic circuit assembly test apparatus | |
JPH1019991A (ja) | 回路基板検査装置のテストヘッド | |
EP2060922A1 (en) | Microstructure testing head | |
KR102828935B1 (ko) | 니들 팁의 길이조절을 위한 스페이서의 재세팅이 용이한 니들블럭 |