JPS60140761U - マグネトロンスパツタリング装置 - Google Patents

マグネトロンスパツタリング装置

Info

Publication number
JPS60140761U
JPS60140761U JP2715784U JP2715784U JPS60140761U JP S60140761 U JPS60140761 U JP S60140761U JP 2715784 U JP2715784 U JP 2715784U JP 2715784 U JP2715784 U JP 2715784U JP S60140761 U JPS60140761 U JP S60140761U
Authority
JP
Japan
Prior art keywords
magnetron sputtering
sputtering equipment
shield member
target surface
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2715784U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342035Y2 (cg-RX-API-DMAC7.html
Inventor
坂本　充則
晃 八巻
加藤　訓弘
牛田　昭二
Original Assignee
ホ−ヤ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ホ−ヤ株式会社 filed Critical ホ−ヤ株式会社
Priority to JP2715784U priority Critical patent/JPS60140761U/ja
Publication of JPS60140761U publication Critical patent/JPS60140761U/ja
Application granted granted Critical
Publication of JPH0342035Y2 publication Critical patent/JPH0342035Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2715784U 1984-02-29 1984-02-29 マグネトロンスパツタリング装置 Granted JPS60140761U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2715784U JPS60140761U (ja) 1984-02-29 1984-02-29 マグネトロンスパツタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2715784U JPS60140761U (ja) 1984-02-29 1984-02-29 マグネトロンスパツタリング装置

Publications (2)

Publication Number Publication Date
JPS60140761U true JPS60140761U (ja) 1985-09-18
JPH0342035Y2 JPH0342035Y2 (cg-RX-API-DMAC7.html) 1991-09-03

Family

ID=30523839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2715784U Granted JPS60140761U (ja) 1984-02-29 1984-02-29 マグネトロンスパツタリング装置

Country Status (1)

Country Link
JP (1) JPS60140761U (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413868A (ja) * 1990-05-02 1992-01-17 Anelva Corp スパッタリング装置
JP2014062282A (ja) * 2012-09-20 2014-04-10 Ulvac Japan Ltd ターゲット装置、スパッタ装置、及び、ターゲット装置の製造方法
JP2014141720A (ja) * 2013-01-25 2014-08-07 Toray Ind Inc Ｄｃマグネトロン型反応性スパッタリング装置および方法
CN110241390A (zh) * 2018-03-07 2019-09-17 夏普株式会社 成膜装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579872A (en) * 1980-06-19 1982-01-19 Oki Electric Ind Co Ltd Evaporation source for sputtering

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579872A (en) * 1980-06-19 1982-01-19 Oki Electric Ind Co Ltd Evaporation source for sputtering

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413868A (ja) * 1990-05-02 1992-01-17 Anelva Corp スパッタリング装置
JP2014062282A (ja) * 2012-09-20 2014-04-10 Ulvac Japan Ltd ターゲット装置、スパッタ装置、及び、ターゲット装置の製造方法
JP2014141720A (ja) * 2013-01-25 2014-08-07 Toray Ind Inc Ｄｃマグネトロン型反応性スパッタリング装置および方法
CN110241390A (zh) * 2018-03-07 2019-09-17 夏普株式会社 成膜装置
JP2019157144A (ja) * 2018-03-07 2019-09-19 シャープ株式会社 成膜装置

Also Published As

Publication number Publication date
JPH0342035Y2 (cg-RX-API-DMAC7.html) 1991-09-03

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