JPS60140714A - Composite part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a composite component constructed by laminating a thick film resistor on the front or back surface of a sintered multilayer capacitor.

Conventional configurations and their problems In general, in composite parts constructed by laminating a thick film resistor on the front or back surface of a sintered multilayer capacitor, when forming a resistor on the surface of the capacitor, it is difficult to assemble the capacitor. If a resistor is directly formed on the dielectric surface of the capacitor, a capacitance component will occur between the internal electrode of the capacitor and the resistor on the surface of the capacitor, which may cause problems depending on the circuit used. In order to improve these drawbacks, a low dielectric layer is often provided between the capacitor and the resistor formed on the surface of the capacitor. In this case, a glass layer with a low dielectric constant is conventionally provided, and this glass layer has been formed as a uniform layer.・However, when adjusting the resistance value of a resistor formed on the surface of the glass layer by cutting it with a laser beam in a composite part formed using a conventional homogeneous glass layer, there is a sudden increase in the resistance caused by the laser beat. There are problems in which cracks occur in the glass layer due to changes in temperature, etc., and these cracks can also cause cracks in the resistor or induce cracks in the dielectric layer used as a capacitor.)
is.

Moreover, cracks in the glass layer cause a decrease in adhesive strength between the capacitor portion and the resistor, and deterioration in moisture absorption characteristics.

Conventionally, in a laminated composite component formed on a sintered dielectric layer or a ceramic/reflective substrate, a glass layer is formed as a low dielectric layer used for the purpose of reducing capacitive coupling with the substrate surface. In this case, a material is used that also serves as a bond between the substrate and the resistor and is designed with smoothness in mind. for example,
The glass layer used has a composition that takes into account the firing temperature of the resistor, pb〇-8102-A12o3-ZnO, Cab,
Tio2. Insulating crystallized glass doped with MgO2 is used. A powder mixture having these compositions or a paste dispersed in an organic compound solution is used as the material for the glass layer. These form devitrified crystalline glasses. For example, S 10240-60.
MgO10-30, Ti○27-1o, A120310
The glass materials mixed at a ratio of ~36 are heated and melted at about 950°C to form a glass layer. Although these compositions differ in terms of dielectric constant and electrical properties depending on the amount of additives, the formed glass layer has a uniform surface and internal structure.

Conventionally, the glass layer could not be used reliably unless the internal structure was homogeneous in the process of forming it. For this reason,
It had a two-layer structure in which a crystallized glass layer was provided as a lower layer, and an amorphous glass layer was further provided on top of this layer. However, in this case, it was said that if bubbles were generated in the amorphous glass layer, this would greatly affect the reliability. As a result, manufacturing methods have been adopted that pursue conditions to minimize air bubbles, and manufacturing has been carried out under extremely narrow tolerance conditions.

Purpose of the Invention The purpose of the present invention is to provide a composite part that can prevent the occurrence of cracks without having to have a two-layer glass layer structure and without being greatly influenced by the allowable width. shall be.

Structure of the Invention In order to achieve the above object, the composite component of the present invention has a low dielectric material made of a glassy material with fine air bubbles generated inside between a sintered multilayer capacitor and a thick film resistor. It is characterized by the interposition of a body layer.

DESCRIPTION OF EMBODIMENTS FIGS. 1 and 2 show an embodiment of the present invention.
1 and 2, a low dielectric layer 3 made of glass is provided on the surface of a sintered multilayer capacitor 1 having internal electrodes 2, and a thick film resistor 6 is disposed on the low dielectric layer 3.
is formed.

This thick film resistor 6 is led out to the outside through a conductor electrode 6 provided on the low dielectric layer 3, and its resistance value is adjusted by a laser beam. 7 shows the cutting part for adjusting the resistance value. The main body of the composite component made of the thick film resistor 6 is protected by an overcoat layer 8.

Here, the low dielectric layer 3 provided on the surface of the sintered multilayer capacitor 1 in order to compose the thick film resistor 6 has fine air bubbles 4 formed therein. The size of these bubbles is larger than the pores in the crystal grains of the polycrystalline body formed by molding and sintering the general powder described above, and is from 0.5 microns to 2 microns.
It is about 0 micron. The occurrence of such bubbles greatly increases the tolerance of the glass firing temperature setting conditions, and when changing the heating temperature suddenly or making the glass material into a paste form and printing on the dielectric surface, It is best to print under conditions that take into account the inclusion of air bubbles. Compared to conventional temperature setting conditions, printing conditions, and firing conditions, these manufacturing conditions have a wider allowable range and can improve manufacturing efficiency. A conductor electrode 5 is provided on the surface of such a low dielectric layer 3 made of glass, and after a thick film resistor 6 is formed, the resistance value of the thick film resistor 6 is finely adjusted. At this time, the thick film resistor 6 is cut by a laser beam to adjust the resistance value.

A method of adjusting the resistance value using a laser beam is applied as a resistance value adjustment method, but in the case of the conventional structure, the laser beam reaches the surface of the underlying glass layer at the same time as the resistor 6 is cut, and at this time, the glass layer is heated by the laser beam. Although large racks were generated within the layer, in the case of the φ example, since air bubbles were generated inside the glass layer in advance, the air bubbles could suppress the generation of cracks. For this reason,
Even when adjusting the resistance value using a laser beam, high-speed processing adjustment is possible, and manufacturing efficiency can be greatly improved.

Specifically, a commercially available insulating glass paste, such as PH4575 (trade name of DuPont, Japan Limited), was screen printed on the surface of the BaT i○3 sintered body as a dielectric, dried at 160±1°C, and then 850±20°C. The glass layer manufactured by firing the glass layer becomes a layer with cellular properties, and can fully exhibit the effect mentioned in this example.

Effects of the Invention As described above, according to the present invention, when a thick film resistor is laminated on the surface of a sintered multilayer capacitor, a glass material with fine air bubbles inside is used as an undercoat of the thick film resistor. Since the low dielectric layer is provided, it has the advantage of being able to prevent cracks from occurring when adjusting the resistance value of the thick film resistor using a laser beam.

[Brief explanation of drawings]

Fig. 1 is a sectional view of a composite part showing an embodiment of the present invention, and Fig. 2 is a partially cutaway perspective view of the same composite part. internal electrode,
3...Low dielectric layer, 4...Bubble provided in the glass layer, 6...Conductor electrode, 6...
resistor layer.

Claims (1)

[Claims] A sintered multilayer capacitor is constructed with a thick film resistor laminated on the front or back surface, and a low dielectric material made of glass with fine bubbles generated inside is placed between the capacitor and the thick film resistor. A composite part characterized by having a body layer interposed therein.