JPS60137434U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS60137434U
JPS60137434U JP1984026022U JP2602284U JPS60137434U JP S60137434 U JPS60137434 U JP S60137434U JP 1984026022 U JP1984026022 U JP 1984026022U JP 2602284 U JP2602284 U JP 2602284U JP S60137434 U JPS60137434 U JP S60137434U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
package
hybrid
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984026022U
Other languages
English (en)
Inventor
健 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1984026022U priority Critical patent/JPS60137434U/ja
Publication of JPS60137434U publication Critical patent/JPS60137434U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のＨＩＣの斜視図、第２図ａはその正面図
、第２図すはその断面側面図、第３図は本考案の一実施
例による混成集積回路の正面図、第一　４図は本考案の
他の実施例を示す正面図である。 １・・・ＨＩＣパッケージ、１ａ・・・ステッチ、２・
・・ＩＣチップ（集積回路ウェハ）、８・・・くぼみ。 なお図中同一符号は同−又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 集積回路ウェハをパッケージ内にダイレクトボンディン
    グしてなる混成集積回路において、パッケージのステッ
    チ内側面にくぼみを設けたことを特徴とする混成集積回
    路。
JP1984026022U 1984-02-23 1984-02-23 混成集積回路 Pending JPS60137434U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984026022U JPS60137434U (ja) 1984-02-23 1984-02-23 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984026022U JPS60137434U (ja) 1984-02-23 1984-02-23 混成集積回路

Publications (1)

Publication Number Publication Date
JPS60137434U true JPS60137434U (ja) 1985-09-11

Family

ID=30521641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984026022U Pending JPS60137434U (ja) 1984-02-23 1984-02-23 混成集積回路

Country Status (1)

Country Link
JP (1) JPS60137434U (ja)

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