JPS60136908A - Welding method - Google Patents

Abstract

PURPOSE:To enable welding with a simple stage by pressing a substrate stuck respectively with specific different metallic films on the surface in a laminated state and the other substrate to each other with these metallic films on the inside and welding the substrate thereby increasing the thickness of the adhered layer and improving the adhesive strength and weatherability. CONSTITUTION:An alloy film 9 is formed on a substrate 8 and an SiO2 film 10 thereon by vapor deposition and further a PbO film 11 is formed thereon. An alloy film 9' is formed on the other substrate 8' as well and an SiO2 film 10' thereon by vapor deposition. The PbO film 11 of one substrate and the SiO2 film 10' of the other substrate are positioned to face each other and are welded by the chemical reaction of PbO and SiO2 by heating and pressurizing from the arrow direction. The adhered layer between the substrates is thus made thin in the stage of adhering the substrates and the temp. during the welding is made relatively low. Since the intrication of the structure of the substrates is averted, the less stage is required and the substantial adhesive strength and weatherability are provided.

Description

[Detailed description of the invention] Technical fields> The present invention relates to an improved method for welding two substrates together.

<Prior Art> Conventionally, a resin-based organic adhesive has generally been used to bond the surfaces of substrates together. However, if this organic adhesive is applied to the substrate surface and then bonded under pressure within a few hundred degrees, the thickness of the adhesive layer will be several tens of μlη or more, making it difficult to maintain a good bonding surface. Furthermore, the adhesive layer made of organic adhesive has problems in abrasion resistance and weather resistance.

On the other hand, as another method for bonding the surfaces of the substrates together, grooves 2, 2 are provided on the side surfaces of the substrates 1, 1, as shown in FIG. There is a welding method for filling. However, this method does not require grooves to be formed on the sides of the substrates 1, 1 in order to reinforce the area to be bonded from the surrounding area, and further requires polishing to prepare the bonding surface after melting and filling the grooves with low-melting glass 3. There was a problem in that it required a complicated process.

<Purpose> The present invention has been made in order to eliminate the above-mentioned conventional drawbacks, and it is possible to control the thickness of the adhesive layer to be extremely thin, improve adhesive strength and weather resistance, and achieve it in a simple process. The object of the present invention is to provide a welding method that can perform welding.

<Example> An example of the welding method according to the present invention will be described in detail below with reference to the drawings. The embodiment will be explained using the manufacturing process of a magnetic head core constructed using a seven-dust alloy film.

FIG. 2 is an external perspective view of a magnetic herad core constructed using a Sendust alloy film. In the figure, 4 and 4' are photosensitive glass substrates, and a Sendust alloy film 5 is placed between the substrates 4 and 4'.
It has a sandwiched structure, and an enamelled copper wire 7 is wound through a hole 6 formed in the center. θ indicates the azimuth angle. The magnetic head core shown in the figure is formed by coating one or both of the substrates 4, 4' with a sendust alloy film 5, and then welding the two together. In this way magnetic”%
Welding is often used in the production of 7-dore cores, and the welding method according to the present invention is extremely suitable for this welding.

A manufacturing process for welding the two substrates of the magnetic held core using the welding method according to the present invention will be described below.

FIG. 3(a) shows the structure of one of the substrates, 8
is a flat crystalline glass substrate, and a sendust alloy film 9 with a thickness of 5 μm is deposited on the crystalline glass substrate 8 by vapor deposition.
is formed, and then a 5i02 film 10 is formed with a thickness of 0.3 μm by sputter deposition (electron beam deposition, CVD, etc.). ) by 1.09μm
The PbO film 11 is formed with a film thickness of .

FIG. 3(b) shows the structure of the other substrate, 8
' is a flat crystalline glass substrate, and on the crystalline glass substrate 8', a sendust alloy film 9t with a thickness of 5 μm is formed by vapor deposition (for multilayering the sendust alloy film), and then sputtering is further applied on top of the sendust alloy film 9t. 5 with a film thickness of 0.3 μm by vapor deposition.
An i02 film 10' is formed.

Next, as shown in FIG. 1, the Pb0 film 11 on one substrate and the Sio2 film 10' on the other substrate are placed facing each other and heated and pressurized in the direction of the arrow to weld them together by a chemical reaction between PbO and Si02. If the direction of the pressure changes during the thermal history, the adhesive layer may break during the cooling process after the chemical reaction between PbO and 5i02 is completed, making it impossible to control the thickness of the adhesive layer. To avoid this risk, a special jig as shown in FIG. 4 was used for the heating and pressurization. In the same figure, 12.13 is an Inconel block, and the substrate 8.1 shown in FIG. 3 is attached to the Inconel block 12.18.
8' is fixed. This Inconel block 12.13
is incorporated into the holding jig 14. The Inconel block 13 is provided with an elongated groove 15, and the function of the groove 15 causes the Inconel block 13 to have elasticity. Furthermore, since the Inconel block 13 is a metal body that can maintain its spring force even at high temperatures, elastic force is applied from the Inconel block 13 to the substrates 8 and 8' even when heated and pressurized at about 600°C. 16 is a screw, and by applying pressure to the screw 16, the above-mentioned Inconel block 1
An elastic force of 3 is applied to the substrates 8, 8'. Since the groove 15 of the above Inconel block 3 is formed into a long and narrow shape parallel to the bonding surface of the substrates 8 and 8', the direction of the pressing force is very conveniently applied to the bonding surface, and the direction of the pressure is 600°.
Even in a heated and pressurized state of about C, the direction of the pressing force can be applied to the adhesive surface without changing.

As an example, if the area of the adhesive surface of the substrates 8 and 8' is 2 mm
1O+m++, the diameter of screw +6 was 3 mmφ, and the torque applied to screw 16 was 1 to 2 kg (2), and a welding experiment was performed by holding it in a nitrogen atmosphere for 2 hours. The total thickness of the layers is 2.
The thickness of the adhesive layer after welding was 78 μm, but the thickness of the adhesive layer after welding was 18 μm.
It became extremely thin. This is due to a chemical reaction (vitrification) between Pb0 and 8102.

Note that there was no deterioration in the magnetic properties of the Sendust alloy film after welding. Furthermore, even when the welded substrate was cut with a diamond blade while cooling with water and polished with alumina coating, it still had sufficient strength and water resistance. In addition, a substrate with 5i02 and PbO deposited on crystalline glass before welding was
When measured by line diffraction method, the diffraction line was 5i02. Pb,
PbO was shown, but at 400°C to 600°C during the above welding.
The diffraction line of the adhesive surface after passing through each temperature history of °C is S i
02 and LeadSilicate, and it was found that Pb and Si are atomically bonded to form a glassy substance.

The magnetic herad core obtained through the above steps is made of Si with the sendust alloy film protected by 5i02.
Since welding was performed by a chemical reaction between O2 and Pb0, the magnetic properties of the Sendas alloy film were not deteriorated. In order to uniformly cover the entire surface of the substrate with the 5i02 film and to protect the sendust alloy film, the thickness of the 5i02 film is preferably 0.1 μm or more. Further, in order to make the adhesive layer thin and to obtain sufficient adhesive strength, the thickness of the Pb0 (Pb may also be used) film is preferably about 01 to 3 μm. The heating temperature during welding is preferably 350"C to 750C. Generally, when welding a sendust alloy film with low melting point glass, the constituent substances of the low melting point glass diffuse into the sendust alloy, degrading its magnetic properties. Furthermore, silver brazing welding the sendust alloy film involves welding at an extremely high temperature (approximately 900°C), which is also undesirable in that it deteriorates the magnetic properties of the sendust alloy film. The advantages of this welding method are significant.

In addition to the above embodiments, one substrate may have a glass substrate coated with a Sendust alloy film, a 5i02 film, and a Pb0 film, and the other substrate may have a glass substrate or a Sendust alloy film coated on a glass substrate. A substrate coated with a 5i02 film or a glass substrate coated with a SiO2 film may also be used. Note that metal films other than Sendust alloy, semiconductor films, etc. may be welded.

<Effects> According to the present invention as described above, when welding substrates together, the adhesive layer can be made very thin, and the temperature during welding can be kept relatively low. In addition, there is no need to complicate the structure of the board, so there are fewer steps and it is suitable for mass production.
Moreover, it is extremely beneficial in that it can provide sufficient adhesive strength and weather resistance.

[Brief explanation of the drawing]

Fig. 1 shows an embodiment of the welding method according to the present invention, and is a side view of two boards in a welded state, Fig. 2 is an external perspective view of the magnetic helad core, and Fig. 3 shows the state before welding. FIG. 4 shows a perspective view of the external appearance of the welding jig, and FIG. 5 shows a side view of the board welded by a conventional welding method. In the figure, l, 1: Substrate 2, 2: Side groove 3: Low melting point glass 4.4': Substrate 5: Sendust alloy film 6: Hole 7° enamelled copper, 1j18.8': Crystalline glass substrate 9
: Sendust alloy film 10: 5i02 film +1: Pb
0 membrane 12.13: Inconel Pro, Ri 14: Holding jig 15: Groove 16: Screw

Claims (1)

[Claims] 1. A 5i02 film and a PbO film (or Pb film) are adhered to the surface of the substrate in the form of a moss layer, and this substrate and another substrate are brought into contact with the 5i02 film and the Pb0 film (or Pb film) 1 inside. , a welding method characterized by welding by heating and pressurizing.