JPS60130670U - Printed circuit board circuit surface protection adhesive tape - Google Patents

Printed circuit board circuit surface protection adhesive tape

Info

Publication number
JPS60130670U
JPS60130670U JP1901884U JP1901884U JPS60130670U JP S60130670 U JPS60130670 U JP S60130670U JP 1901884 U JP1901884 U JP 1901884U JP 1901884 U JP1901884 U JP 1901884U JP S60130670 U JPS60130670 U JP S60130670U
Authority
JP
Japan
Prior art keywords
adhesive tape
surface protection
circuit board
printed circuit
protection adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1901884U
Other languages
Japanese (ja)
Inventor
西口　強
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1901884U priority Critical patent/JPS60130670U/en
Publication of JPS60130670U publication Critical patent/JPS60130670U/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ、　ｂはそれそ−れ本考案の第１、第２の実施
例を示す斜視図、第２図はシュアルインライン型ＩＣが
ハンダ固定された状態のプリント基板回路面の斜視図、
第３図は本考案の粘着テープを使用中の斜視図である。 １．１′・・・・・・テープの本体、２，２′・・・・
・・粘着テープ、３・・・・・・穴、４・・・・・・プ
リント基板、４ａ・・・・・・回路面、５・品・・ハン
ダランド、６・・・・・・ハンダ付ケされた後の電気部
品のリード、７・・・・・・回路パターン、８・・・・
・・フラックス等の汚れ、ＬＨＩ−’２ｔ　１１〜１５
・・・・・・穴ピツチ間隔、Ｄｌ・・・・・・穴径、Ｄ
２・・・・・・ランド径、Ｍ１９Ｍ２・・・・・・リー
ド線ピッチ間隔。Figures 1a and 1b are perspective views showing the first and second embodiments of the present invention, respectively, and Figure 2 is a perspective view of the printed circuit board circuit surface with a true in-line IC fixed by solder. ,
FIG. 3 is a perspective view of the adhesive tape of the present invention in use. 1.1'... Main body of the tape, 2,2'...
...adhesive tape, 3...hole, 4...printed circuit board, 4a...circuit surface, 5.item...solder land, 6...solder Leads of electrical components after being attached, 7...Circuit pattern, 8...
・・Dirty flux etc., LHI-'2t 11~15
...... Hole pitch interval, Dl... Hole diameter, D
2... Land diameter, M19M2... Lead wire pitch interval.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 裏面に接着層を有し、所定の間隔で複数個の穴が形成さ
れた耐熱性材料からなるプリント基板回路面保護粘着テ
ープ。A printed circuit board circuit surface protection adhesive tape made of a heat-resistant material with an adhesive layer on the back side and a plurality of holes formed at predetermined intervals.
JP1901884U 1984-02-13 1984-02-13 Printed circuit board circuit surface protection adhesive tape Pending JPS60130670U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1901884U JPS60130670U (en) 1984-02-13 1984-02-13 Printed circuit board circuit surface protection adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1901884U JPS60130670U (en) 1984-02-13 1984-02-13 Printed circuit board circuit surface protection adhesive tape

Publications (1)

Publication Number Publication Date
JPS60130670U true JPS60130670U (en) 1985-09-02

Family

ID=30508199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1901884U Pending JPS60130670U (en) 1984-02-13 1984-02-13 Printed circuit board circuit surface protection adhesive tape

Country Status (1)

Country Link
JP (1) JPS60130670U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396247U (en) * 1990-01-22 1991-10-01
JP2014232801A (en) * 2013-05-29 2014-12-11 富士通株式会社 Restoration member for circuit board, process of manufacturing circuit board, and process of manufacturing restoration member for circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396247U (en) * 1990-01-22 1991-10-01
JP2014232801A (en) * 2013-05-29 2014-12-11 富士通株式会社 Restoration member for circuit board, process of manufacturing circuit board, and process of manufacturing restoration member for circuit board

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