JPS60130670U - Printed circuit board circuit surface protection adhesive tape - Google Patents
Printed circuit board circuit surface protection adhesive tapeInfo
- Publication number
- JPS60130670U JPS60130670U JP1901884U JP1901884U JPS60130670U JP S60130670 U JPS60130670 U JP S60130670U JP 1901884 U JP1901884 U JP 1901884U JP 1901884 U JP1901884 U JP 1901884U JP S60130670 U JPS60130670 U JP S60130670U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- surface protection
- circuit board
- printed circuit
- protection adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂはそれそ−れ本考案の第１、第２の実施
例を示す斜視図、第２図はシュアルインライン型ＩＣが
ハンダ固定された状態のプリント基板回路面の斜視図、
第３図は本考案の粘着テープを使用中の斜視図である。
１．１′・・・・・・テープの本体、２，２′・・・・
・・粘着テープ、３・・・・・・穴、４・・・・・・プ
リント基板、４ａ・・・・・・回路面、５・品・・ハン
ダランド、６・・・・・・ハンダ付ケされた後の電気部
品のリード、７・・・・・・回路パターン、８・・・・
・・フラックス等の汚れ、ＬＨＩ−’２ｔ １１〜１５
・・・・・・穴ピツチ間隔、Ｄｌ・・・・・・穴径、Ｄ
２・・・・・・ランド径、Ｍ１９Ｍ２・・・・・・リー
ド線ピッチ間隔。Figures 1a and 1b are perspective views showing the first and second embodiments of the present invention, respectively, and Figure 2 is a perspective view of the printed circuit board circuit surface with a true in-line IC fixed by solder. ,
FIG. 3 is a perspective view of the adhesive tape of the present invention in use. 1.1'... Main body of the tape, 2,2'...
...adhesive tape, 3...hole, 4...printed circuit board, 4a...circuit surface, 5.item...solder land, 6...solder Leads of electrical components after being attached, 7...Circuit pattern, 8...
・・Dirty flux etc., LHI-'2t 11~15
...... Hole pitch interval, Dl... Hole diameter, D
2... Land diameter, M19M2... Lead wire pitch interval.
Claims (1)
れた耐熱性材料からなるプリント基板回路面保護粘着テ
ープ。A printed circuit board circuit surface protection adhesive tape made of a heat-resistant material with an adhesive layer on the back side and a plurality of holes formed at predetermined intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1901884U JPS60130670U (en) | 1984-02-13 | 1984-02-13 | Printed circuit board circuit surface protection adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1901884U JPS60130670U (en) | 1984-02-13 | 1984-02-13 | Printed circuit board circuit surface protection adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60130670U true JPS60130670U (en) | 1985-09-02 |
Family
ID=30508199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1901884U Pending JPS60130670U (en) | 1984-02-13 | 1984-02-13 | Printed circuit board circuit surface protection adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130670U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396247U (en) * | 1990-01-22 | 1991-10-01 | ||
| JP2014232801A (en) * | 2013-05-29 | 2014-12-11 | 富士通株式会社 | Restoration member for circuit board, process of manufacturing circuit board, and process of manufacturing restoration member for circuit board |
-
1984
- 1984-02-13 JP JP1901884U patent/JPS60130670U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396247U (en) * | 1990-01-22 | 1991-10-01 | ||
| JP2014232801A (en) * | 2013-05-29 | 2014-12-11 | 富士通株式会社 | Restoration member for circuit board, process of manufacturing circuit board, and process of manufacturing restoration member for circuit board |
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