JPS60130639U - 半導体装置の製造装置 - Google Patents

半導体装置の製造装置

Info

Publication number
JPS60130639U
JPS60130639U JP1823784U JP1823784U JPS60130639U JP S60130639 U JPS60130639 U JP S60130639U JP 1823784 U JP1823784 U JP 1823784U JP 1823784 U JP1823784 U JP 1823784U JP S60130639 U JPS60130639 U JP S60130639U
Authority
JP
Japan
Prior art keywords
stirring
semiconductor device
device manufacturing
manufacturing equipment
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1823784U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02910Y2 (enrdf_load_stackoverflow
Inventor
三郎 木村
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1823784U priority Critical patent/JPS60130639U/ja
Publication of JPS60130639U publication Critical patent/JPS60130639U/ja
Application granted granted Critical
Publication of JPH02910Y2 publication Critical patent/JPH02910Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1823784U 1984-02-09 1984-02-09 半導体装置の製造装置 Granted JPS60130639U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1823784U JPS60130639U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1823784U JPS60130639U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPS60130639U true JPS60130639U (ja) 1985-09-02
JPH02910Y2 JPH02910Y2 (enrdf_load_stackoverflow) 1990-01-10

Family

ID=30506680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1823784U Granted JPS60130639U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPS60130639U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH02910Y2 (enrdf_load_stackoverflow) 1990-01-10

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