JPS60130638U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS60130638U JPS60130638U JP1984017943U JP1794384U JPS60130638U JP S60130638 U JPS60130638 U JP S60130638U JP 1984017943 U JP1984017943 U JP 1984017943U JP 1794384 U JP1794384 U JP 1794384U JP S60130638 U JPS60130638 U JP S60130638U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- metal substrate
- semiconductor element
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１゛図は従来の半導体装置主要部の縦断面図、第２図
および第３図は別の従来の半導体装置主要部の縦断面図
、第４図はこの考案による半導体装置の縦断面図である
。 １・・・・・・金属基板、２・・・・・・半導体素子、
３・・・・・・ハンダ、４ｄ・・・・・・塗装。
および第３図は別の従来の半導体装置主要部の縦断面図
、第４図はこの考案による半導体装置の縦断面図である
。 １・・・・・・金属基板、２・・・・・・半導体素子、
３・・・・・・ハンダ、４ｄ・・・・・・塗装。
Claims (1)
- 金属基板の上面に半導体素子をハンダ付けにより取付け
、前記半導体素子の外周縁部近傍の前記金属基板上に、
前記ハンダ広がり防止用の塗装を施したことを特徴とす
る半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984017943U JPS60130638U (ja) | 1984-02-10 | 1984-02-10 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984017943U JPS60130638U (ja) | 1984-02-10 | 1984-02-10 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60130638U true JPS60130638U (ja) | 1985-09-02 |
Family
ID=30506117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984017943U Pending JPS60130638U (ja) | 1984-02-10 | 1984-02-10 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130638U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS546068B2 (ja) * | 1975-04-03 | 1979-03-24 |
-
1984
- 1984-02-10 JP JP1984017943U patent/JPS60130638U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS546068B2 (ja) * | 1975-04-03 | 1979-03-24 |
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