JPS60130131A - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS60130131A
JPS60130131A JP58237807A JP23780783A JPS60130131A JP S60130131 A JPS60130131 A JP S60130131A JP 58237807 A JP58237807 A JP 58237807A JP 23780783 A JP23780783 A JP 23780783A JP S60130131 A JPS60130131 A JP S60130131A
Authority
JP
Japan
Prior art keywords
bonding
axis
carrier
tool
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58237807A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224378B2 (OSRAM
Inventor
Hideaki Miyoshi
秀明 三好
Tadashi Takano
忠 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Marine Instr Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP58237807A priority Critical patent/JPS60130131A/ja
Publication of JPS60130131A publication Critical patent/JPS60130131A/ja
Publication of JPH0224378B2 publication Critical patent/JPH0224378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—

Landscapes

  • Wire Bonding (AREA)
JP58237807A 1983-12-19 1983-12-19 ボンデイング装置 Granted JPS60130131A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58237807A JPS60130131A (ja) 1983-12-19 1983-12-19 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58237807A JPS60130131A (ja) 1983-12-19 1983-12-19 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60130131A true JPS60130131A (ja) 1985-07-11
JPH0224378B2 JPH0224378B2 (OSRAM) 1990-05-29

Family

ID=17020697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58237807A Granted JPS60130131A (ja) 1983-12-19 1983-12-19 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60130131A (OSRAM)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748243A (en) * 1980-09-06 1982-03-19 Shinkawa Ltd Wire bonding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748243A (en) * 1980-09-06 1982-03-19 Shinkawa Ltd Wire bonding apparatus

Also Published As

Publication number Publication date
JPH0224378B2 (OSRAM) 1990-05-29

Similar Documents

Publication Publication Date Title
US5465899A (en) Method and apparatus for fine pitch wire bonding using a shaved capillary
EP0724776B1 (en) Method for stitch bonding of wires to integrated circuit bonding pads
JP2001144134A (ja) ボンディング装置のボンディングヘッドにおける振動子ブロックの支持方法
US7320424B2 (en) Linear split axis wire bonder
US5040293A (en) Bonding method
JPS60130131A (ja) ボンデイング装置
US5223063A (en) Method for bonding semiconductor elements to a tab tape
CN100587932C (zh) 导线键合的方法和装置
JP2590252B2 (ja) ダイボンデイング装置
US6808102B1 (en) Wire-bonding apparatus with improved XY-table orientation
JP2006294710A (ja) 傾き補正方法、ワイヤボンディング方法及びワイヤボンディング装置
JPS59117226A (ja) ボンデイング装置
JP2701174B2 (ja) バンプ付け方法
JP2550905B2 (ja) ワイヤボンディング装置
JPS6249986B2 (OSRAM)
JPS63124430A (ja) ワイヤボンデイング装置
JP2921164B2 (ja) リードのボンディング装置
JPS58161333A (ja) 半導体製造装置
JPH0611066B2 (ja) ワイヤボンデイング装置
JPH088276B2 (ja) ワイヤボンディング方法
JPS6348126Y2 (OSRAM)
JPH01241138A (ja) 半導体装置のワイヤボンディング方法
JPH0462944A (ja) インナーリードボンディング方法
JPS62248240A (ja) バンプ形成方法
JPH0563011A (ja) ダイボンダー・ヘツドの構造