JPS60125745U - semiconductor unit - Google Patents
semiconductor unitInfo
- Publication number
- JPS60125745U JPS60125745U JP1430484U JP1430484U JPS60125745U JP S60125745 U JPS60125745 U JP S60125745U JP 1430484 U JP1430484 U JP 1430484U JP 1430484 U JP1430484 U JP 1430484U JP S60125745 U JPS60125745 U JP S60125745U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor unit
- lead
- switching element
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Power Conversion In General (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体ユニットを実装構造を示す側面図
、第２図ａは本考案の一実施例の実装構造の側面図、第
２図すは放熱体の平面図である。
図において、１・・・ＧＴｏ、 ２． ３・・・放熱体
、３Ｂ・・・リード孔、４・・・スナバダイオード、４
ａ、４ｂ・・・リード、５・・・放熱体、６・・・スナ
バコンデンサ。FIG. 1 is a side view showing a conventional semiconductor unit mounting structure, FIG. 2a is a side view of a mounting structure according to an embodiment of the present invention, and FIG. 2 is a plan view of a heat sink. In the figure, 1...GTo, 2. 3... Heat sink, 3B... Lead hole, 4... Snubber diode, 4
a, 4b... Lead, 5... Heat sink, 6... Snubber capacitor.
Claims (1)
はさむ一対の放熱体、該放熱体の一方と第３の他の放熱
体とｉこはざまれだスナバダイオードからなる半導体ス
タックとスナバコンデンサを具える半導体ユニットにお
いて、上記一方の放熱体の各フィン基部にほぼ同一線上
に並ぶリード孔を形成しスナバコンデンサの一方リード
を上記リード孔を順次通して配線することを特徴とする
半導体ユニット。A semiconductor unit comprising a semiconductor switching element, a pair of heat radiators sandwiching the semiconductor switching element, a semiconductor stack consisting of a snubber diode sandwiched between one of the heat radiators and a third other heat radiator, and a snubber capacitor, A semiconductor unit characterized in that lead holes arranged substantially on the same line are formed in each fin base of the one heat radiator, and one lead of the snubber capacitor is wired sequentially through the lead holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1430484U JPS60125745U (en) | 1984-02-02 | 1984-02-02 | semiconductor unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1430484U JPS60125745U (en) | 1984-02-02 | 1984-02-02 | semiconductor unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60125745U true JPS60125745U (en) | 1985-08-24 |
Family
ID=30499101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1430484U Pending JPS60125745U (en) | 1984-02-02 | 1984-02-02 | semiconductor unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60125745U (en) |
-
1984
- 1984-02-02 JP JP1430484U patent/JPS60125745U/en active Pending
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