JPS60119793A - スル−ホ−ル形成方法 - Google Patents
スル−ホ−ル形成方法Info
- Publication number
- JPS60119793A JPS60119793A JP22677083A JP22677083A JPS60119793A JP S60119793 A JPS60119793 A JP S60119793A JP 22677083 A JP22677083 A JP 22677083A JP 22677083 A JP22677083 A JP 22677083A JP S60119793 A JPS60119793 A JP S60119793A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- etching
- forming
- holes
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22677083A JPS60119793A (ja) | 1983-12-02 | 1983-12-02 | スル−ホ−ル形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22677083A JPS60119793A (ja) | 1983-12-02 | 1983-12-02 | スル−ホ−ル形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60119793A true JPS60119793A (ja) | 1985-06-27 |
| JPH04600B2 JPH04600B2 (enExample) | 1992-01-08 |
Family
ID=16850334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22677083A Granted JPS60119793A (ja) | 1983-12-02 | 1983-12-02 | スル−ホ−ル形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60119793A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6318697A (ja) * | 1986-07-11 | 1988-01-26 | 日本電気株式会社 | 多層配線基板 |
-
1983
- 1983-12-02 JP JP22677083A patent/JPS60119793A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6318697A (ja) * | 1986-07-11 | 1988-01-26 | 日本電気株式会社 | 多層配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04600B2 (enExample) | 1992-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5509200A (en) | Method of making laminar stackable circuit board structure | |
| US4357203A (en) | Plasma etching of polyimide | |
| US20040126547A1 (en) | Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom | |
| JPH0714113B2 (ja) | シロキサンポリイミドのラミネートの形成方法 | |
| US4805683A (en) | Method for producing a plurality of layers of metallurgy | |
| US4834835A (en) | Producing viaholes in plastic sheets and application of the method | |
| US20090169837A1 (en) | Package substrate and manufacturing method thereof | |
| TWI873155B (zh) | 製造印刷電路板的方法及依照該方法製造之印刷電路板 | |
| JPS6396923A (ja) | ヴァイア形成方法 | |
| US4089766A (en) | Method of passivating and planarizing a metallization pattern | |
| JPS60119793A (ja) | スル−ホ−ル形成方法 | |
| US6150074A (en) | Method of forming electrically conductive wiring pattern | |
| JPH06268378A (ja) | 多層配線基板のビアホールの形成方法 | |
| JPH01290289A (ja) | 導体パターン形成方法 | |
| JPS63293996A (ja) | 多層配線基板の製造方法 | |
| JP2919645B2 (ja) | 多層配線基板の製造方法 | |
| JPS60214594A (ja) | 印刷配線板の製造方法 | |
| JPH07249867A (ja) | 絶縁膜の表面処理方法 | |
| JP7433461B2 (ja) | 配線基板 | |
| JPS63205992A (ja) | 配線板の形成方法 | |
| TW202345662A (zh) | 製造電路板的方法及堆疊結構 | |
| JP2998238B2 (ja) | 多層配線基板の製造方法 | |
| JPS61131596A (ja) | 多層配線板の製造法 | |
| JPS6163087A (ja) | 多層配線板の製造方法 | |
| JPS6185896A (ja) | 多層配線板 |