JPS60117731A - Developing device for wafer - Google Patents

Developing device for wafer

Info

Publication number
JPS60117731A
JPS60117731A JP22624083A JP22624083A JPS60117731A JP S60117731 A JPS60117731 A JP S60117731A JP 22624083 A JP22624083 A JP 22624083A JP 22624083 A JP22624083 A JP 22624083A JP S60117731 A JPS60117731 A JP S60117731A
Authority
JP
Japan
Prior art keywords
wafer
developer
rinsing liquid
cup
ejecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22624083A
Other languages
Japanese (ja)
Inventor
Yoshiki Iwata
岩田　義樹
Nobuo Kawase
信雄 川瀬
Keitoku Tanaka
田中　佳徳
Takashi Miyake
隆 三宅
Hiroshi Kawaura
廣 川浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Canon Marketing Japan Inc
Original Assignee
Canon Inc
Canon Hanbai KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Canon Hanbai KK filed Critical Canon Inc
Priority to JP22624083A priority Critical patent/JPS60117731A/en
Publication of JPS60117731A publication Critical patent/JPS60117731A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Abstract

PURPOSE:To obtain the flatness of the back of a wafer without the adhesion of a developer on the back of the wafer by ejecting a rinsing liquid against the back of the wafer during the development of the wafer. CONSTITUTION:A wafer 1 is developed by ejecting a developer from a nozzle, and there are an outer cup 3 and an inner cup 4 in order to prevent the scattering of the developer. The inner cup 4 is held in the outer cup 3. Jets 5 for ejecting a rinsing liquid such as pure water against the lower surface of the wafer 1 are arranged opposed to the peripheral section of the back of the wafer 1 at one position or a plurality of positions of the outer cup 3. The developer creeping and adhering to the back of the wafer 1 is washed away by the rinsing liquid, and discharged by a discharge port 6 for the inner cup 4.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は回転しているウェハーに現像液を与え現像する
ウェハー現像装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a wafer developing apparatus that applies a developer to a rotating wafer to develop it.

〔従来技術〕[Prior art]

従来のウェハー現像装置は現像液がウニノ・−裏面に巻
り込んで付着し、この現像液が縦向しウェハー裏面の平
面性が損なわれるため、次工程で不都合が生じていた。In conventional wafer developing apparatuses, the developer gets caught up and adheres to the back surface of the wafer, and the developer is oriented vertically, impairing the flatness of the back surface of the wafer, causing problems in the next process.

ホトレジストをウェハーに塗布する回転塗布装置ｉ’ｆ
の分野（（おいては、特公昭５６−７７４４に示される
如くウェハーの裏面を覆う飛沫防止板によってウェハー
の裏面にホトレジストが付着するのを防止する方法、又
実開昭４８−８４８５７に示される如くウェハーの裏面
にガスをふき付けることによって、ホトレジストの裏面
への巻り込みを防止する方法等が知られている。Rotary coating device i'f that applies photoresist to a wafer
In this field, there is a method of preventing photoresist from adhering to the back side of a wafer by using a splash prevention plate covering the back side of the wafer, as shown in Japanese Patent Publication No. 56-7744, and a method of preventing photoresist from adhering to the back side of a wafer, as shown in Japanese Utility Model Publication No. 48-84857. There is a known method of preventing the photoresist from being rolled into the back surface of the wafer by blowing gas onto the back surface of the wafer.

ウェハーの回転速度が速く、又、粘度の高いホトレジス
トを使用する回転塗布機の場合はこの方法が有効である
が、ウニノ・−の回転速度も低く、又、粘度の低い現像
液の場合この方法はあまり有スリＣはない。This method is effective when the rotation speed of the wafer is high and a rotary coater uses photoresist with high viscosity, but this method is effective when the rotation speed of the wafer is slow and a developer with low viscosity is used. There are not many pickpockets.

［［］　的〕 従って、本発明の目的は、現像液がウニノ・−の＃、＋
ｊ＋ｉ　Ｋ付着することを有効に防止したウェハー現像
装置を提供することにある。そして、この目的は現像中
にウェハー裏面に純水等のリンス液を噴出する構成によ
って達成している。[[] Objective] Therefore, the objective of the present invention is to develop
An object of the present invention is to provide a wafer developing device that effectively prevents the adhesion of j+i K. This objective is achieved by a configuration in which a rinsing liquid such as pure water is jetted onto the back surface of the wafer during development.

〔実施例〕〔Example〕

第１図中、１は回転して（・るウェハーチャック２によ
って吸着されたウェハーである。このウェハーは不図示
のノズルからの現像液の噴出によつて現像されている。In FIG. 1, reference numeral 1 denotes a wafer that is rotated and sucked by a wafer chuck 2. This wafer is developed by jetting a developer from a nozzle (not shown).

６，４は現像液が飛散するのを防止するための外カップ
及び内カップである。Reference numerals 6 and 4 are an outer cup and an inner cup for preventing the developer from scattering.

内カップ４は不図示の部材によって外カッ７３内圧保持
されている。外カップ６の一個所若しくは複数個所には
純水等のリンス液をウェハー下面に噴出するための噴出
口５がウェハー裏面の周辺部に対向して配されて℃・る
。このリンス液によってウェハー裏面に巻り込もうとし
ている、若しくは付着した現像液は洗い流される。この
リンス液及び現像液は内カップ４の排出口乙によって排
出される。The internal pressure of the inner cup 4 and the outer cup 73 are maintained by a member (not shown). A spout 5 for spouting a rinsing liquid such as pure water onto the lower surface of the wafer is disposed at one or more locations on the outer cup 6 so as to face the periphery of the back surface of the wafer. This rinsing liquid washes away the developing solution that is about to get caught up or attached to the back surface of the wafer. The rinsing liquid and developer are discharged through a discharge port B of the inner cup 4.

〔効　果〕〔effect〕

本発明はウェハー現像中にウェハー裏面にリンス液を噴
出しているため、ウェハー裏面に現像液が付着すること
がないため、ウェハーの裏面の平面性が得られる等の効
果を有している。Since the present invention sprays a rinsing liquid onto the back surface of the wafer during wafer development, the developing solution does not adhere to the back surface of the wafer, so it has the effect of providing flatness of the back surface of the wafer.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明のウェハー現像装置を示す図である。 図中、１はウェハー、２はチャック、６は外カップ、４
は内カップ、５は噴出口、６は排出口である。FIG. 1 is a diagram showing a wafer developing apparatus of the present invention. In the figure, 1 is a wafer, 2 is a chuck, 6 is an outer cup, 4
5 is an inner cup, 5 is a spout, and 6 is a discharge port.

Claims (1)

【特許請求の範囲】[Claims] ウェハー下面に近接し設げられた覆部材の先端部にリン
ス液噴出口を設け、該噴出口よりリンス液をウェハー下
面に噴出することを特徴とするウェハー現像装置。A wafer developing device characterized in that a rinsing liquid spout is provided at the tip of a cover member provided close to the lower surface of the wafer, and the rinsing liquid is spouted from the spout onto the lower surface of the wafer.
JP22624083A 1983-11-30 1983-11-30 Developing device for wafer Pending JPS60117731A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22624083A JPS60117731A (en) 1983-11-30 1983-11-30 Developing device for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22624083A JPS60117731A (en) 1983-11-30 1983-11-30 Developing device for wafer

Publications (1)

Publication Number Publication Date
JPS60117731A true JPS60117731A (en) 1985-06-25

Family

ID=16842085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22624083A Pending JPS60117731A (en) 1983-11-30 1983-11-30 Developing device for wafer

Country Status (1)

Country Link
JP (1) JPS60117731A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02185032A (en) * 1989-01-11 1990-07-19 Nec Corp Etching method and etching device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511311A (en) * 1978-07-10 1980-01-26 Hitachi Ltd Method of photoresist developing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511311A (en) * 1978-07-10 1980-01-26 Hitachi Ltd Method of photoresist developing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02185032A (en) * 1989-01-11 1990-07-19 Nec Corp Etching method and etching device

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