JPS60116156A - アルミニウム合金パッケ−ジ - Google Patents
アルミニウム合金パッケ−ジInfo
- Publication number
- JPS60116156A JPS60116156A JP58224635A JP22463583A JPS60116156A JP S60116156 A JPS60116156 A JP S60116156A JP 58224635 A JP58224635 A JP 58224635A JP 22463583 A JP22463583 A JP 22463583A JP S60116156 A JPS60116156 A JP S60116156A
- Authority
- JP
- Japan
- Prior art keywords
- package
- aluminum alloy
- glass
- terminal
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58224635A JPS60116156A (ja) | 1983-11-29 | 1983-11-29 | アルミニウム合金パッケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58224635A JPS60116156A (ja) | 1983-11-29 | 1983-11-29 | アルミニウム合金パッケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60116156A true JPS60116156A (ja) | 1985-06-22 |
| JPH04597B2 JPH04597B2 (enExample) | 1992-01-08 |
Family
ID=16816796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58224635A Granted JPS60116156A (ja) | 1983-11-29 | 1983-11-29 | アルミニウム合金パッケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116156A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2642257A1 (fr) * | 1989-01-20 | 1990-07-27 | Dassault Electronique | Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants |
-
1983
- 1983-11-29 JP JP58224635A patent/JPS60116156A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2642257A1 (fr) * | 1989-01-20 | 1990-07-27 | Dassault Electronique | Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants |
| US5538527A (en) * | 1989-01-20 | 1996-07-23 | Dassault Electronique | Method of sealing glass to aluminum, particularly for electrical feed-through connectors |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04597B2 (enExample) | 1992-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4656499A (en) | Hermetically sealed semiconductor casing | |
| US4542259A (en) | High density packages | |
| US4784974A (en) | Method of making a hermetically sealed semiconductor casing | |
| US3020454A (en) | Sealing of electrical semiconductor devices | |
| US4266090A (en) | All metal flat package | |
| KR20000069623A (ko) | 직접 접촉 다이 부착 방법 및 장치 | |
| US5105258A (en) | Metal system for semiconductor die attach | |
| JP3816821B2 (ja) | 高周波用パワーモジュール基板及びその製造方法 | |
| JPS62209843A (ja) | 電子回路のハウジング | |
| US3451122A (en) | Methods of making soldered connections | |
| JPS60116156A (ja) | アルミニウム合金パッケ−ジ | |
| EP0100817B1 (en) | A hermetically sealed casing of an electrical device and process of manufacturing | |
| US3553828A (en) | Lead assembly structure for semiconductor devices | |
| US3039175A (en) | Sealing of electrical semiconductor devices | |
| JPS6083356A (ja) | 半導体装置 | |
| JPS63287038A (ja) | パッケ−ジ構造 | |
| JPS60165745A (ja) | 樹脂封止型半導体装置 | |
| KR810001418Y1 (ko) | 반도체 장치 | |
| JPS5927537A (ja) | 半導体装置 | |
| JPH085563Y2 (ja) | 高電力ハイブリッドic用金属パッケージ | |
| JPH0140514B2 (enExample) | ||
| JPS58123744A (ja) | リ−ドフレ−ム及び半導体装置の製造方法 | |
| JPH03285347A (ja) | ハイブリッドicおよび金属容器 | |
| JPH03285348A (ja) | ハイブリッドic | |
| JPS6273648A (ja) | 気密ガラス端子 |