JPS60116152A - Manufacture of sealed hybrid ic - Google Patents

Abstract

PURPOSE:To obtain a sealed hybrid IC which has uniform film and high reliability in moisture prevention and insulation by thermally contacting photocurable resin with the IC placing an electronic part and then curing by an ultraviolet ray. CONSTITUTION:As component of resin film, for example, methyl-methacrylate- acrylonitrile-acrylated gricydylacrylate copolymer, polymethylmethacrylate, epoxy acrylate, benzylmethylmethacrylate at the prescribed rate to form a film by a T-die method. A film is cut on a portion sealed with the hybrid IC substrate 2 placing a miniature molded transistor 1, the film is thermally softened and contacted with the substrate 1. Then, ultraviolet ray is emitted to cure the film. Thus, since the resin 3 is not introduced to the gap 4 which is not emitted by the light, uncured portion does not occur, and resin is not dropped to form irregular thickness.

Description

[Detailed Description of the Invention] [Technical Field] This invention relates to a sealed hybrid IC subjected to moisture-proof insulation treatment.
Concerning the manufacturing method.

[Background technology]

Hybrid ICs, in which the circuit is constructed on a substrate made of alumina ceramic, glass epoxy, paper phenol, etc., and various electronic components such as semicircular chips, transistors, and capacitors are mounted on this, are coated with resin. If the device is used in a harsh environment, moisture and flakes can easily cause undesirable phenomena such as poor insulation between circuits, corrosion of conductors, and deterioration of elements. In order to prevent these problems and to reinforce mounted electronic components, a moisture-proof coating is applied to the whole or a part of the hybrid IC to form a film-retaining film.

Conventionally, one-component or two-component resin phenos that are thermosetting, photocurable, or a combination of light and heat curing have been used as moisture-proof paints, but each has the following drawbacks. There is.

That is, when a thermosetting resin is used, it takes 30 minutes to 30 hours at a temperature of room temperature to 180° C. to cure the resin, resulting in very poor productivity.

In order to improve this point, an example in which a photocurable resin is used as a moisture-proof coating is disclosed in JP-A-58-42241 and other publications. When a photocurable resin is used, the resin can be cured by just irradiating it with ultraviolet light for a few seconds to a few minutes, which significantly improves productivity. However, on the other hand, as shown in FIG. 1, for example, the resin 3 gets into the gap between the mounted component l such as a transistor and the board 2, that is, the shadow part 4 where light cannot reach, and the resin does not harden. This problem has arisen.

Therefore, in order to solve the above problems, varnishes that are made thermosetting in addition to photocuring by using a thermal polymerization initiator are also used, but it takes a long time for thermosetting. Therefore, the advantage of quick curing that photocuring properties have is lost, and heat curing equipment is required in addition to photocuring equipment, which is uneconomical.

Furthermore, liquid thermosetting and photocuring resins have the following drawbacks in common. First of all, ■Liquid paints have a strange odor and often have a negative impact on the human body, making them a bad work environment.■Varnishes have the risk of flammability and explosion, so care must be taken when handling them. In addition to problems in terms of work and pollution, (1) varnish dripping causes unevenness in the thickness of the coating, making it impossible to achieve uniform coating.

[Object of the invention] This starting material J eliminates the above-mentioned drawbacks, has a fast curing speed,
The purpose of the present invention is to provide a method for manufacturing a sealed hybrid IC that is moisture-proof and insulated and has a uniform coating.

[Disclosure of the invention]

In order to achieve the above object, the method for manufacturing a sealed hybrid IC subjected to moisture-proof insulation according to the present invention includes heating and adhering a photocurable resin film to a hybrid IC to form a film, and curing the film by irradiating ultraviolet rays. By using a heat-softening photocurable resin film instead of liquid resin, partial sealing and single-sided sealing can be easily performed in a pollution-free process with a good working environment. The aim is to significantly shorten the time required for insulation treatment. This will be explained in detail below.

The heat-softening photocurable resin film used in this invention is polymerized and cured by irradiation with ultraviolet light (
Among the anti-fat materials, it is sufficient that the heat softening temperature is 50° to 150°C, and the thickness thereof is preferably about 0.1 to 3 cm. The components and various raw material examples of Kato-Ru resin film are shown below.

Resins capable of zero-component polymerization; those with a molecular weight of 500 to 10,000 that have a functional group or unsaturated group at the molecular end or side chain, such as epoxy acrylate, urethane acrylate, butadiene acrylate, polyester acrylate, unsaturated Polyester resin etc. ■ Linear polymer compound that is compatible with the resin described in ■ above.

Methacrylic resin, methacrylic-styrene copolymer, HoIJ styrene, ethyl cellulose, polycarbonate,
Hydrocarbon resin etc.

(2) Photopolymerizable monomers: Various monofunctional to tetrafunctional methacrylic monomers, such as trimethylolpropane triacrylate-1-21,6-hexanediol dialylate.

■Photopolymerization initiator; benzyl dimethyl ether, benzyl dimethyl ketal, benzophenone, etc.

■Thermal polymerization inhibitor; Hydroquinone, 'catechol, benzoquinone, etc.

In addition to the five ingredients listed above, add pigments if necessary.

It may contain dyes or fillers, etc.

The various raw materials mentioned above are mixed in advance using a mixer or a mixer, and then formed into a film or sheet by a known method such as T-die method, inflation method, calendar method, canuting method, etc. It is made into a film or sheet by such methods. The thickness of the film is 0. If it is less than Inη, the sealing ability and component holding ability will be low, and there is no need to specifically limit the thickness. degree is desirable.

Next, the softening temperature obtained as described above is 50° to 1
A method for manufacturing a sealed hybrid IC containing moisture-proof insulation using a 50° C. photocurable resin film will be described in 9J.

First, the part of the hybrid IC carrying electronic components that is to be sealed is cut out and placed, heated to melt the film in a softening bath, and adhered to the parts and substrate to form a uniform coating. After this, the film is cured by irradiation with ultraviolet light.

As the ultraviolet light source, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc lamp, a xenon arc lamp, a metal halide lamp can be used. The strength of the ultraviolet rays (1 W) is not particularly limited, but from the standpoint of curing work: 30 to 160 W/σ is preferable. If you irradiate ultraviolet rays from a distance of 10 to 20 crn per 1 piece of fat,
Curing is usually complete within a few seconds. Therefore, much faster curing is achieved compared to conventional methods using thermosetting hardeners.

In the resin sealing according to this invention, a highly viscous IW film is used, so as shown in FIG. Because I don't
There is no risk of uncured parts occurring. There is also no risk of l'il fat dripping and resulting in uneven coating film thickness.

By the way, when a metal paste board is used as the substrate 2, it is preferable that the metal surface is not sealed with V resin (V resin) in order to improve heat dissipation. However, when liquid resin is used, In the Shishiru dipping method used, it is difficult to apply the mulch on only one side. On the other hand, in the resin sealing according to the present invention, as explained above, the film can be cut out according to the shape of the part to be sealed, so it is suitable for partial sealing or single-sided sealing. This can be done easily.

(Example 1) Methyl methacrylate-acrylonitrile-acrylated glycidyl acrylate)! Coalescence (molar ratio 65:1
0:25)...50 parts (parts by weight, same below) Polymethyl methacrylate...30 parts Epoxy acrylate...20 parts Bennoldimethyl ketal H+ + 214 (A 200 μm thick film with a composition of 5 or more A film was produced using the T-die method and had a softening temperature of 80'C.This film was placed on one side of the hybrid IC, that is, the electronic component mounting surface, and heated to 130°C to adhere the film to the components and board. Thereafter, the coating was cured by irradiating ultraviolet rays for 20 seconds from a distance of 15 minutes using an 80 W/c* high-pressure mercury lamp.

After curing is completed - When the parts mounted on the hybrid IC are removed, the resin has not penetrated into the gap of about 0.25 between the parts and the board, and unlike in the case of liquid resin, (there is no residual resin). There were no hardened areas.

(Example 2) Methyl methacrylate-n-butyl acrylate copolymer (mole ratio 90:l (H...60 parts Epoxy acrylate...40 parts Benzyl dimethyl ketal...261 or more) j! A film with a thickness of 500 μm was produced by the T-Tai method to obtain a film 1c with a softening temperature of 70°C.Similarly to Example 1, this film was applied on the IFJi piece of the hybrid IC, that is, on the mounting plate of the electronic component. Place it on the surface, 13
After heating the film to 0° C. to bring it into close contact with the parts and substrate, the film was cured by irradiating ultraviolet rays for 20 seconds from a distance of 15σ using an 80 W/cIn high-pressure mercury lamp.

When the components mounted on the hybrid IC were removed after curing was completed, it was found that, similar to the results of Example 1, no resin had penetrated into the gap of about 0.25 am between the components and the board.
Unlike in the case of liquid resins, there were no uncured portions of resin.

C Effects of the Invention] The moisture-proof insulation treatment of this invention was applied to the top as it is now! ■
The manufacturing method for Stopno Hybrid IC prevents the resin from penetrating into gaps where light does not shine, or causing the resin to drip after application, resulting in uneven coating thickness, ensuring uniform film thickness. It is possible to provide highly moisture-proof insulation. Furthermore, with this manufacturing method, partial sealing and single-sided sealing can be easily performed, and the curing time can be significantly shortened, so that productivity can be significantly increased.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of a conventional example, and Fig. 2 is a top view of a regenerative hybrid IC which has been subjected to moisture-proof insulation treatment using a film, showing one embodiment of the present invention. 1...Mini mold transistor 2...Bar r no lid IC board 3...1 kanshin fat 4...Gap agent Patent attorney Takehiko Matsuki I3-W4: (Spontaneous) 1. Indication of the case 1983 Special R'S mouth S225300 No. 2. Name of invention sealed hybrid IC m3,? Seki 1 related to the case of a person who commits illicit righteousness Patent applicant Address: 1048 Inujimon Ω, Kadoma City, Osaka Prefecture Name (5)
83) Matsushita Electric Works Co., Ltd. Representative 1 Representative Screaming Emperor Iku Kobayashi 4 Agent 6 Subject of amendment Mei♀111 Invitation 7 Contents of amendment (1) Specification page 5 line 12 Shiko “Metaac 1J rate ] Is it "(meta)"? Correct, "IJ rate".

Claims (1)

[Claims] (1) A method for producing a hybrid IC treated with moisture-proof insulation, which is characterized by heat-adhering a photocurable resin film to a non-hybrid IC to form a crack, and curing it by irradiation with ultraviolet rays.