JPH07286117A - Photo-setting moistureproof insulating coating and production of moistureproof insulated electronic part - Google Patents
Photo-setting moistureproof insulating coating and production of moistureproof insulated electronic partInfo
- Publication number
- JPH07286117A JPH07286117A JP8081494A JP8081494A JPH07286117A JP H07286117 A JPH07286117 A JP H07286117A JP 8081494 A JP8081494 A JP 8081494A JP 8081494 A JP8081494 A JP 8081494A JP H07286117 A JPH07286117 A JP H07286117A
- Authority
- JP
- Japan
- Prior art keywords
- moistureproof
- photo
- insulating coating
- coating
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品の防湿、絶縁
等に適した光硬化性防湿絶縁塗料およびこれを用いて処
理された電子部品の製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocurable moisture-proof insulating coating suitable for moisture-proofing and insulating electronic parts and a method for producing electronic parts treated with the same.
【０００２】[0002]
【従来の技術】従来、実装回路板およびハイブリッドＩ
Ｃ（integrated circuit）等の電子部品には、ガラスエ
ポキシ、紙フェノール、アルミナセラミック等の基板に
配線図が印刷されてマイコン、抵抗体、コンデンサなど
の各種部品が搭載されており、それらを湿気、ほこりな
どから保護する目的で絶縁処理が行われている。この絶
縁処理方法には、アクリル樹脂、シリコーン樹脂、フェ
ノール樹脂、エポキシ樹脂などの塗料による保護コーテ
ィング処理が広く採用されている。このような実装回路
板およびハイブリッドＩＣは、過酷な環境下、特に高湿
度下で使用され、例えば自動車、洗濯機などの機器に搭
載されて使用されている。2. Description of the Related Art Conventionally, a mounting circuit board and a hybrid I
For electronic components such as C (integrated circuit), a wiring diagram is printed on a substrate such as glass epoxy, paper phenol, and alumina ceramic, and various components such as a microcomputer, a resistor, and a capacitor are mounted. Insulation is performed to protect it from dust. As the insulation treatment method, a protective coating treatment using a paint such as acrylic resin, silicone resin, phenol resin, or epoxy resin is widely adopted. Such a mounting circuit board and a hybrid IC are used in a harsh environment, particularly under high humidity, and are mounted and used in equipment such as an automobile and a washing machine.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記塗
料は加熱硬化性であるため、塗料を完全に硬化させて絶
縁効果を得るためには高温度処理、また長時間処理が必
要であった。一方、短時間処理、例えば数秒〜数分での
硬化が可能な紫外線硬化性樹脂塗料が開発されている
が、まだ充分な可とう性および耐湿性を有するものが得
られていない。また、搭載部品の下部など紫外線が照射
されない所は液状で未硬化の状態となり、電子部品の信
頼性が低下するおそれがあった。本発明は、このような
従来技術の問題点を解決し、短時間処理が可能で、可と
う性および耐湿性に優れた塗膜を生成する光硬化性防湿
絶縁塗料およびこれを塗布、硬化する防湿絶縁された電
子部品の製造法を提供することにある。However, since the coating material is heat-curable, high temperature treatment and long-time treatment are required to completely cure the coating material and obtain an insulating effect. On the other hand, an ultraviolet curable resin coating composition that can be cured in a short time, for example, in a few seconds to a few minutes has been developed, but a coating material having sufficient flexibility and moisture resistance has not yet been obtained. In addition, a portion such as a lower portion of the mounted component which is not irradiated with ultraviolet rays is in a liquid state and is in an uncured state, and there is a possibility that reliability of the electronic component is deteriorated. The present invention solves the above-mentioned problems of the prior art, can be treated for a short time, and produces a coating film excellent in flexibility and moisture resistance. It is an object of the present invention to provide a method of manufacturing a moisture-proof insulated electronic component.
【０００４】[0004]
【課題を解決するための手段】本発明は、（Ａ）数平均
分子量が３００〜１０，０００で、水素添加率が９０％
以上である光硬化性末端アクリロキシポリブタジエンま
たは末端メタアクリロキシポリブタジエン、（Ｂ）環状
構造を有するアクリル単量体またはメタアクリル単量
体、（Ｃ）ワックスおよび（Ｄ）光重合開始剤を含有し
てなる光硬化性防湿絶縁塗料およびこの塗料を電子部品
に塗布、硬化する防湿絶縁された電子部品の製造法に関
する。The present invention provides (A) a number average molecular weight of 300 to 10,000 and a hydrogenation rate of 90%.
It contains the above-mentioned photo-curable terminal acryloxy polybutadiene or terminal methacryloxy polybutadiene, (B) an acrylic monomer or methacrylic monomer having a cyclic structure, (C) wax and (D) a photopolymerization initiator. The present invention relates to a photocurable moisture-proof insulating coating material and a method for producing a moisture-proof insulating electronic component, which comprises applying and curing the coating material on an electronic component.
【０００５】本発明に用いられる光硬化性の末端アクリ
ロキシポリブタジエンまたは末端メタアクリロキシポリ
ブタジエン（Ａ）は、水素添加率が９０％以上の末端ヒ
ドロキシポリブタジエンを、ポリイソシアネートと反応
させ、その後にヒドロキシエチルアクリレートまたはヒ
ドロキシエチルメタクリレートを反応させて得られる数
平均分子量が３００〜１０，０００のアクリル変性水素
添加ポリブタジエン樹脂である。この樹脂の数平均分子
量は３００〜１０，０００、好ましくは５００〜５，０
００、水素添加率は９０％以上、好ましくは９５％以上
とされる。数平均分子量が３００未満では造膜性が悪く
なり、１０，０００を超えると粘度が高く、作業性に劣
る。また水素添加率が９０％未満では得られる塗膜の加
熱劣化後の可とう性が低下し、耐熱性が劣る。このアク
リル変性水素添加ポリブタジエン樹脂の市販品として
は、日本曹達社製の商品名ＴＥＡＩ−１０００、ＴＥＡ
Ｉ−３０００等が挙げられ、これらは単独でまたは２種
以上を組み合わせて使用できる。The photocurable terminal acryloxypolybutadiene or terminal methacryloxypolybutadiene (A) used in the present invention is obtained by reacting a terminal hydroxypolybutadiene having a hydrogenation rate of 90% or more with a polyisocyanate, followed by hydroxyethyl. It is an acryl-modified hydrogenated polybutadiene resin having a number average molecular weight of 300 to 10,000 obtained by reacting acrylate or hydroxyethyl methacrylate. The number average molecular weight of this resin is 300 to 10,000, preferably 500 to 5,0.
00, the hydrogenation rate is 90% or more, preferably 95% or more. When the number average molecular weight is less than 300, the film-forming property is poor, and when it exceeds 10,000, the viscosity is high and the workability is poor. On the other hand, if the hydrogenation rate is less than 90%, the flexibility of the obtained coating film after heat deterioration is lowered and the heat resistance is deteriorated. Commercially available products of this acrylic modified hydrogenated polybutadiene resin are trade names TEAI-1000 and TEA manufactured by Nippon Soda Co., Ltd.
I-3000 and the like can be mentioned, and these can be used alone or in combination of two or more kinds.
【０００６】本発明に用いられる環状構造を有するアク
リル単量体またはメタアクリル単量体（Ｂ）としては、
ベンジルアクリレート、シクロヘキシルアクリレート、
フェノキシエチルアクリレート、テトラヒドロフルフリ
ルアクリレート、ジシクロペンテニルアクリレート、イ
ソボルニルアクリレート、ベンジルメタクリレート、シ
クロヘキシルメタクリレート、フェノキシエチルメタク
リレート、テトラヒドロフルフリルメタクリレート、イ
ソボルニルメタクリレートなどが挙げられ、これらは単
独でまたは２種以上を組み合わせて使用できる。これら
単量体（Ｂ）の配合割合は、硬化速度と塗料の粘度の点
から前記の（Ａ）成分１００重量部に対して１０〜２０
０重量部の範囲が好ましく、５０〜１００重量部の範囲
がより好ましい。As the acrylic monomer or methacrylic monomer (B) having a cyclic structure used in the present invention,
Benzyl acrylate, cyclohexyl acrylate,
Phenoxyethyl acrylate, tetrahydrofurfuryl acrylate, dicyclopentenyl acrylate, isobornyl acrylate, benzyl methacrylate, cyclohexyl methacrylate, phenoxyethyl methacrylate, tetrahydrofurfuryl methacrylate, isobornyl methacrylate and the like, which may be used alone or in combination. The above can be used in combination. The mixing ratio of these monomers (B) is 10 to 20 with respect to 100 parts by weight of the above-mentioned component (A) from the viewpoint of the curing speed and the viscosity of the coating material.
The range of 0 parts by weight is preferable, and the range of 50 to 100 parts by weight is more preferable.
【０００７】本発明に用いられるワックス（Ｃ）は、常
温で固体であり、溶融時に揮発性が極めて小さいカルナ
ウバワックス、ライスワックス、みつろう、パラフィン
ワックス、マイクロクリスタリンワックス等の天然ワッ
クスあるいは合成ワックスである。これらは単独でまた
は２種以上組み合わせて使用できる。ワックス（Ｃ）の
配合割合は、べたつきの防止および塗膜の可とう性から
前記の（Ａ）成分１００重量部に対して５〜１００重量
部の範囲が好ましく、１０〜５０重量部の範囲がより好
ましい。The wax (C) used in the present invention is a natural wax or a synthetic wax such as carnauba wax, rice wax, beeswax, paraffin wax and microcrystalline wax which is solid at room temperature and has extremely low volatility when melted. is there. These can be used alone or in combination of two or more. The mixing ratio of the wax (C) is preferably 5 to 100 parts by weight, and more preferably 10 to 50 parts by weight with respect to 100 parts by weight of the component (A) in view of prevention of stickiness and flexibility of the coating film. More preferable.
【０００８】本発明に用いられる光重合開始剤（Ｄ）と
しては、ベンジルジメチルケタール、ベンゾイン、ベン
ゾインエチルエーテル、ベンゾインプロピルエーテル、
ベンゾインフェニルエーテルなどのベンゾインエーテル
類、ベンゾインチオエーテル類、ベンゾフェノン、アセ
トフェノン、２−エチルアントラキノンフロイン、ベン
ゾインエーテルミヒラーケトン系、塩化デシルノチオキ
サントン類などが挙げられ、これらは単独でまたは２種
以上を組み合わせて使用できる。これら光重合開始剤
（Ｃ）の配合割合は、硬化速度と造膜性の点から前記の
（Ａ）成分１００重量部に対して０．０１〜１０重量部
の範囲が好ましく、０．１〜５重量部の範囲がより好ま
しい。The photopolymerization initiator (D) used in the present invention includes benzyl dimethyl ketal, benzoin, benzoin ethyl ether, benzoin propyl ether,
Examples thereof include benzoin ethers such as benzoin phenyl ether, benzoin thioethers, benzophenone, acetophenone, 2-ethylanthraquinone furoine, benzoin ether Michler's ketone, decylnothioxanthone chloride, etc. These may be used alone or in combination of two or more. Can be used. The mixing ratio of these photopolymerization initiators (C) is preferably in the range of 0.01 to 10 parts by weight with respect to 100 parts by weight of the above-mentioned component (A) from the viewpoint of curing rate and film-forming property, and is 0.1 to 10. A range of 5 parts by weight is more preferable.
【０００９】本発明の光硬化性防湿絶縁塗料は、前記の
（Ａ）、（Ｂ）、（Ｃ）および（Ｄ）成分を配合し、加
熱溶解することによって得られる。また、本発明になる
光硬化性防湿絶縁塗料には、必要に応じて架橋性単量
体、シランカップリング剤、重合禁止剤などを添加する
ことができる。The photocurable moisture-proof insulating coating material of the present invention can be obtained by blending the above-mentioned components (A), (B), (C) and (D) and heating and dissolving them. In addition, a crosslinkable monomer, a silane coupling agent, a polymerization inhibitor, etc. can be added to the photocurable moisture-proof insulating coating material of the present invention, if necessary.
【００１０】架橋性単量体としては、スチレン、ビニル
トルエン、α−メチルスチレン、ｐ−ターシャリーブチ
ルスチレン、クロルスチレン、ジビニルベンゼン、ジア
リルフタレート、２−ヒドロオキシエチルメタクリレー
ト、２−ヒドロオキシプロピルメタクリレート、メチル
メタクリレート、エチルメタクリレート、ラウリルメタ
クリレート、メタクリル酸とカージュラＥ−１０（シェ
ル化学社製、高級脂肪酸のグリシジルエステルの商品
名）の反応物などの１官能性のメタクリル酸エステル、
エチレングリコールジメタクリレート、ジエチレングリ
コールジメタクリレート、１，６−ヘキサンジオールジ
メタクリレートなどの２官能性のメタクリル酸エステ
ル、トリメチロールプロパントリメタクリレートなどの
３官能性のメタクリル酸エステル、メチルアクリレー
ト、エチルアクリレート、ラウリルアクリレート、２−
ヒドロオキシエチルアクリレート、２−ヒドロオキシプ
ロピルアクリレート、アクリル酸とカージュラＥ−１０
の反応物などの１官能性のアクリル酸エステル、エチレ
ングリコールジアクリレート、ジエチレングリコールジ
アクリレート、１，６−ヘキサンジオールジアクリレー
トなどの２官能のアクリル酸エステル、トリメチロール
プロパントリアクリレートなどの３官能性のアクリル酸
エステルなどが用いられ、これらは単独でまたは２種以
上を組み合わせて使用できる。Examples of the crosslinkable monomer include styrene, vinyltoluene, α-methylstyrene, p-tertiarybutylstyrene, chlorostyrene, divinylbenzene, diallylphthalate, 2-hydrooxyethyl methacrylate and 2-hydrooxypropyl methacrylate. , A monofunctional methacrylic acid ester such as a reaction product of methyl methacrylate, ethyl methacrylate, lauryl methacrylate, methacrylic acid and Cardura E-10 (trade name of glycidyl ester of higher fatty acid, manufactured by Shell Chemical Co., Ltd.),
Bifunctional methacrylic acid esters such as ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, and 1,6-hexanediol dimethacrylate, trifunctional methacrylic acid esters such as trimethylolpropane trimethacrylate, methyl acrylate, ethyl acrylate, and lauryl acrylate. , 2-
Hydroxyethyl acrylate, 2-hydroxypropyl acrylate, acrylic acid and Cardura E-10
Reaction products such as monofunctional acrylic acid esters, ethylene glycol diacrylate, diethylene glycol diacrylate, difunctional acrylic acid esters such as 1,6-hexanediol diacrylate, and trifunctional trimethylolpropane triacrylate. Acrylic acid esters and the like are used, and these can be used alone or in combination of two or more kinds.
【００１１】シランカップリング剤としては、γ−メタ
アクリロキシプロピルトリメトキシシラン、γ−メタア
クリロキシプロピルトリエトキシシラン、γ−アクリロ
キシプロピルトリメトキシシラン、ビニルトリメトキシ
シラン、ビニルトリエトキシシランなどが挙げられ、こ
れらは単独でまたは２種以上を組み合わせて使用でき
る。Examples of the silane coupling agent include γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-acryloxypropyltrimethoxysilane, vinyltrimethoxysilane and vinyltriethoxysilane. These may be used alone or in combination of two or more.
【００１２】重合禁止剤としては、ハイドロキノン、パ
ラターシャリーブチルカテコール、ピロガロール等のキ
ノン類、その他一般に使用されているものが用いられ
る。As the polymerization inhibitor, quinones such as hydroquinone, paratertiary butyl catechol and pyrogallol, and other commonly used ones can be used.
【００１３】本発明になる光硬化性防湿絶縁塗料を用い
て防湿絶縁された実装回路板、ハイブリッドＩＣ等の電
子部品が製造されるが、その製法としては、一般に知ら
れているハケ塗り法、浸漬法（ディップ法）、スプレー
法などによってこの塗料を電子部品に塗布、硬化すれば
よい。塗布後の塗膜の硬化は紫外線照射によって行われ
る。Electronic components such as mounted circuit boards and hybrid ICs that are moisture-proof insulated using the photocurable moisture-proof insulating coating material according to the present invention are manufactured by a generally known brush coating method. The coating material may be applied to the electronic component and cured by a dipping method (dip method), a spray method, or the like. Curing of the coating film after coating is performed by ultraviolet irradiation.
【００１４】[0014]
【実施例】次に本発明を実施例および比較例により説明
するが、本発明は以下の実施例に限定されるものではな
い。「部」として表わしたものは重量部を示す。 実施例１ ＴＥＡＩ−１０００（日本曹達株式会社製、アクリル変
性水素添加ポリブタジエン樹脂、数平均分子量：約１，
０００、水素添加率：９７％）６０部、ベンジルアクリ
レート４０部、カルナウバワックス（日化精工社製、商
品名精製カルナウバワックスNo.２）３０部およびベン
ジルジメチルケタール５部を温度８０℃の条件で混合撹
拌して塗料Ａを得た。EXAMPLES The present invention will now be described with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. Those expressed as "parts" indicate parts by weight. Example 1 TEAI-1000 (manufactured by Nippon Soda Co., Ltd., acrylic modified hydrogenated polybutadiene resin, number average molecular weight: about 1,
000, hydrogenation ratio: 97%) 60 parts, benzyl acrylate 40 parts, carnauba wax (manufactured by Nikka Seiko Co., Ltd., trade name purified carnauba wax No. 2) 30 parts and benzyl dimethyl ketal 5 parts at a temperature of 80 ° C. Paint A was obtained by mixing and stirring under the conditions.
【００１５】実施例２ ＴＥＡＩ−１０００（日本曹達株式会社製、アクリル変
性水素添加ポリブタジエン樹脂、数平均分子量：約１，
０００、水素添加率：９７％）６０部、イソボルニルメ
タクリレート４０部、カルナウバワックス（日化精工社
製、商品名精製カルナウバワックスNo.２）３０部およ
びベンゾフェノン５部を温度８０℃の条件で混合撹拌し
て塗料Ｂを得た。Example 2 TEAI-1000 (manufactured by Nippon Soda Co., Ltd., acrylic modified hydrogenated polybutadiene resin, number average molecular weight: about 1,
000, hydrogenation rate: 97%) 60 parts, isobornyl methacrylate 40 parts, carnauba wax (manufactured by Nikka Seiko Co., Ltd., trade name purified carnauba wax No. 2) 30 parts and benzophenone 5 parts at a temperature of 80 ° C. A paint B was obtained by mixing and stirring under the conditions.
【００１６】比較例１ ＴＥ−２０００（日本曹達株式会社製、末端メタクリロ
イル基ポリブタジエン樹脂、数平均分子量：約２，００
０）１００部、ベンジルジメチルケタール５部およびト
ルエン１００部を温度５０℃の条件で混合撹拌して塗料
Ｃを得た。Comparative Example 1 TE-2000 (manufactured by Nippon Soda Co., Ltd., terminal methacryloyl group polybutadiene resin, number average molecular weight: about 2,000)
0) 100 parts, benzyl dimethyl ketal 5 parts and toluene 100 parts were mixed and stirred at a temperature of 50 ° C. to obtain coating C.
【００１７】比較例２ ＴＥＡＩ−１０００（日本曹達株式会社製、アクリル変
性水素添加ポリブタジエン樹脂、数平均分子量：約１，
０００、水素添加率：９７％）１００部およびベンジル
ジメチルケタール５部を温度１００℃の条件で混合撹拌
して塗料Ｄを得た。Comparative Example 2 TEAI-1000 (manufactured by Nippon Soda Co., Ltd., acrylic modified hydrogenated polybutadiene resin, number average molecular weight: about 1,
000, hydrogenation rate: 97%) and 5 parts of benzyl dimethyl ketal were mixed and stirred at a temperature of 100 ° C. to obtain a coating D.
【００１８】以上で得た塗料Ａ〜Ｄをガラスエポキシ銅
張積層板に配線が印刷され、ＩＣおよび抵抗が搭載され
た実装回路板に、浸漬法により塗布し、ウシオ電機株式
会社製の照射出力が５０Ｗ／cmの水銀ランプで照射距離
１０ｃｍから１２０秒間紫外線照射を行い、硬化性評価
用試験片を作製し硬化性を試験した。またこれらの塗料
をガラスエポキシ銅張積層板製のくし型電極（電極間隔
０．３mm、電極ＡｇＰｄ製）に、浸漬法により塗布し、
前記の硬化条件で硬化させ、耐湿性試験用試験片を作製
し、耐湿性を試験した。さらにこれらの試験片につい
て、ＪＩＳ Ｃ２１０３に準じて屈曲性試験用の試験片
を作製して前記の硬化条件で硬化させ、８０℃で１００
時間放置し、屈曲性を試験した。その結果を表１に示
す。なお、塗料Ａ、ＢおよびＤを浸漬法で塗布する際、
塗料Ａ、ＢおよびＤを８０℃に加熱して用いた。また、
耐湿性は耐湿性試験用試験片にＤＣ１４Ｖを印加しなが
ら８５℃、８５％ＲＨの恒温恒湿槽に放置し、表１に示
す放置時間ごとに恒温恒湿槽から取り出し、２時間後２
３℃でＤＣ５００Ｖを印加して絶縁抵抗を測定して評価
した。The paints A to D obtained as described above are applied by dipping onto a mounting circuit board on which wiring is printed on a glass epoxy copper clad laminate and ICs and resistors are mounted. Irradiation output manufactured by USHIO INC. Was irradiated with ultraviolet rays from a mercury lamp of 50 W / cm for an irradiation distance of 10 cm for 120 seconds to prepare a test piece for evaluation of curability, and the curability was tested. Also, these paints were applied by a dipping method to a comb-shaped electrode made of glass epoxy copper clad laminate (electrode gap 0.3 mm, made of electrode AgPd),
It was cured under the above-mentioned curing conditions to prepare a test piece for a moisture resistance test, and the moisture resistance was tested. Further, with respect to these test pieces, test pieces for bending test were prepared in accordance with JIS C2103 and cured under the above-mentioned curing conditions, and the temperature was raised to 100 at 80 ° C.
It was left for a period of time and tested for flexibility. The results are shown in Table 1. When applying the coating materials A, B and D by the dipping method,
Paints A, B and D were used after being heated to 80 ° C. Also,
Moisture resistance was measured by leaving the test piece for a humidity resistance test at 14 ° C and 85% RH in a constant temperature and humidity chamber while applying DC14V, and taking out from the constant temperature and humidity chamber at each standing time shown in Table 1 and after 2 hours 2
DC500V was applied at 3 degreeC, and insulation resistance was measured and evaluated.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【発明の効果】表１にも示されるように、本発明になる
光硬化性防湿絶縁塗料は、硬化性、耐湿性に優れ、加熱
劣化しても可とう性がほとんど損われない耐熱性に優れ
た塗料であり、この塗料によって信頼性の向上された電
子部品を製造することができる。As shown in Table 1, the photocurable moisture-proof insulating coating material according to the present invention is excellent in curability and moisture resistance, and has heat resistance that hardly deteriorates flexibility even when deteriorated by heating. It is an excellent paint, and it is possible to manufacture electronic parts with improved reliability.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大森 英二 茨城県日立市東町四丁目13番１号 日立化 成工業株式会社山崎工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Eiji Omori 4-13-1, Higashimachi, Hitachi City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Yamazaki Factory
Claims (2)
００で、水素添加率が９０％以上である光硬化性末端ア
クリロキシポリブタジエンまたは末端メタアクリロキシ
ポリブタジエン、（Ｂ）環状構造を有するアクリル単量
体またはメタアクリル単量体、（Ｃ）ワックスおよび
（Ｄ）光重合開始剤を含有してなる光硬化性防湿絶縁塗
料。1. (A) Number average molecular weight of 300 to 10,0
00, a photocurable terminal acryloxypolybutadiene or terminal methacryloxypolybutadiene having a hydrogenation rate of 90% or more, (B) an acrylic monomer or methacrylic monomer having a cyclic structure, (C) a wax and ( D) A photocurable moisture-proof insulating coating material containing a photopolymerization initiator.
電子部品に塗布、硬化する防湿絶縁された電子部品の製
造法。2. A method for producing a moisture-proof insulated electronic component, which comprises applying the photocurable moisture-proof insulating coating composition according to claim 1 to an electronic component and curing it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8081494A JPH07286117A (en) | 1994-04-20 | 1994-04-20 | Photo-setting moistureproof insulating coating and production of moistureproof insulated electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8081494A JPH07286117A (en) | 1994-04-20 | 1994-04-20 | Photo-setting moistureproof insulating coating and production of moistureproof insulated electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07286117A true JPH07286117A (en) | 1995-10-31 |
Family
ID=13728938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8081494A Pending JPH07286117A (en) | 1994-04-20 | 1994-04-20 | Photo-setting moistureproof insulating coating and production of moistureproof insulated electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07286117A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7105375B2 (en) | 2004-07-30 | 2006-09-12 | Xerox Corporation | Reverse printing |
| JP2007154004A (en) * | 2005-12-02 | 2007-06-21 | Somar Corp | Water-based moistureproofing and insulating coating agent |
| WO2007080936A1 (en) * | 2006-01-13 | 2007-07-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Curable resin composition, surface protection method, temporary fixation method, and separation method |
| JP2008069255A (en) * | 2006-09-14 | 2008-03-27 | Denki Kagaku Kogyo Kk | Method for peeling protective film applied on matter to be processed |
| JP2008095039A (en) * | 2006-10-16 | 2008-04-24 | Denki Kagaku Kogyo Kk | Curable composition for surface protection |
| JP2008303362A (en) * | 2007-06-11 | 2008-12-18 | Hitachi Chem Co Ltd | Photocurable moisture-proof insulating paint, electronic part moisture insulated by using the paint and method for producing the same |
| JP6346980B1 (en) * | 2017-07-06 | 2018-06-20 | アイカ工業株式会社 | Photocurable moisture-proof insulation coating composition |
| JP2020158674A (en) * | 2019-03-27 | 2020-10-01 | アイカ工業株式会社 | Resin composition of ultraviolet curable insulating coating agent |
-
1994
- 1994-04-20 JP JP8081494A patent/JPH07286117A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7105375B2 (en) | 2004-07-30 | 2006-09-12 | Xerox Corporation | Reverse printing |
| JP2007154004A (en) * | 2005-12-02 | 2007-06-21 | Somar Corp | Water-based moistureproofing and insulating coating agent |
| WO2007080936A1 (en) * | 2006-01-13 | 2007-07-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Curable resin composition, surface protection method, temporary fixation method, and separation method |
| JP2008069255A (en) * | 2006-09-14 | 2008-03-27 | Denki Kagaku Kogyo Kk | Method for peeling protective film applied on matter to be processed |
| JP2008095039A (en) * | 2006-10-16 | 2008-04-24 | Denki Kagaku Kogyo Kk | Curable composition for surface protection |
| JP2008303362A (en) * | 2007-06-11 | 2008-12-18 | Hitachi Chem Co Ltd | Photocurable moisture-proof insulating paint, electronic part moisture insulated by using the paint and method for producing the same |
| JP6346980B1 (en) * | 2017-07-06 | 2018-06-20 | アイカ工業株式会社 | Photocurable moisture-proof insulation coating composition |
| JP2019014806A (en) * | 2017-07-06 | 2019-01-31 | アイカ工業株式会社 | Photocurable moisture-proof insulation coating agent composition |
| JP2020158674A (en) * | 2019-03-27 | 2020-10-01 | アイカ工業株式会社 | Resin composition of ultraviolet curable insulating coating agent |
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