JPH02235917A - Light-and heat-curing resin composition - Google Patents
Light-and heat-curing resin compositionInfo
- Publication number
- JPH02235917A JPH02235917A JP5687389A JP5687389A JPH02235917A JP H02235917 A JPH02235917 A JP H02235917A JP 5687389 A JP5687389 A JP 5687389A JP 5687389 A JP5687389 A JP 5687389A JP H02235917 A JPH02235917 A JP H02235917A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- epoxy
- curing agent
- resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title description 17
- 238000013007 heat curing Methods 0.000 title description 4
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- 239000003999 initiator Substances 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims abstract description 5
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 3
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract description 2
- -1 benzoin peroxide Chemical class 0.000 abstract description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 abstract 1
- 244000028419 Styrax benzoin Species 0.000 abstract 1
- 235000000126 Styrax benzoin Nutrition 0.000 abstract 1
- 235000008411 Sumatra benzointree Nutrition 0.000 abstract 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 abstract 1
- 229960002130 benzoin Drugs 0.000 abstract 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 abstract 1
- 235000019382 gum benzoic Nutrition 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 21
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000002841 Lewis acid Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- MUZDXNQOSGWMJJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O MUZDXNQOSGWMJJ-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、光熱硬化併用型樹脂組成物に関するもので
、特に、電子部品等の樹脂封止に有利に用いられる樹脂
組成物に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a photothermosetting resin composition, and particularly to a resin composition that is advantageously used for resin sealing of electronic parts, etc. .
［従来の技術］
電子部品本体がケースに収納される形式の電子部品にお
いて、ケースの密封性を高めるために、ケースの開口か
ら、ケース内に樹脂を注型することがしばしば行なわれ
る。また、ケースを備えない電子部品においても、電子
部品の耐電圧性、耐湿性、等を向上させるために、電子
部品本体の周囲に樹脂外装を施すため、金型を用いて、
そのような樹脂外装を形成すべき樹脂をモールドするこ
とがしばしば行なわれている。[Prior Art] In electronic components in which the main body of the electronic component is housed in a case, resin is often cast into the case through an opening in the case in order to improve the sealing performance of the case. In addition, even for electronic components that do not have a case, a mold is used to apply a resin sheath around the electronic component body in order to improve the voltage resistance, moisture resistance, etc. of the electronic component.
The resin to form such a resin sheath is often molded.
上述したように注型またはモールドされる樹脂は、比較
的大きな厚みや複雑な形状をとる場合がある。The resin that is cast or molded as described above may have a relatively large thickness or a complicated shape.
［発明が解決しようとする課題コ
たとえば、上述したような注型等に用いられる樹脂とし
て、機械的強度および硬化時間等を考慮して、光硬化型
樹脂成分と熱硬化型樹脂成分とを配合した、光熱硬化併
用型樹脂組成物を用いる試みがなされている。この場合
、樹脂の取扱い等の作業性をさらに考慮に入れると、一
液型で貯蔵安定性が良好であることが望ましい。[Problems to be solved by the invention] For example, as a resin used for casting as described above, it is possible to combine a photocurable resin component and a thermosetting resin component, taking into consideration mechanical strength, curing time, etc. Attempts have been made to use photo-thermosetting resin compositions. In this case, when workability such as handling of the resin is further taken into account, it is desirable that the resin be of a one-component type and have good storage stability.
たとえば、光により重合するラジカル反応タイプの樹脂
成分と、熱硬化剤または熱硬化触媒により架橋するエポ
キシ樹脂とを配合した、光熱硬化併用型の樹脂において
、これを一液型の樹脂組成にするには、エボキシ樹脂用
架橋剤（熱硬化剤）に制限を受ける。アミン系硬化剤で
は、貯蔵安定性が乏しい。また、酸無水物系硬化剤は、
それ自身、比較的貯蔵安定性があるが、これに硬化促進
剤を加えることは、貯蔵安定性を悪くするため、できず
、そのため、熱硬化条件が厳しくなってしまう。すなわ
ち、熱硬化のために、高温で長時間加熱することが必要
になる。このため、従来、上述したような光熱硬化併用
型の一液性樹脂には、光透過阻害が少ない、液状の、熱
によりルイス酸を放出する、潜在性硬化剤を使用する場
合においてのみ、実用化の可能性があるものと評価され
ていた。For example, in a photothermally curing resin that is a combination of a radical reaction type resin component that polymerizes when exposed to light and an epoxy resin that crosslinks using a thermosetting agent or a thermosetting catalyst, it is possible to convert this into a one-component resin composition. is limited by crosslinking agents (thermosetting agents) for epoxy resins. Amine curing agents have poor storage stability. In addition, acid anhydride curing agents are
Although it is relatively storage stable by itself, it is not possible to add a curing accelerator to it because it will impair storage stability, and therefore the heat curing conditions will become stricter. That is, heat curing requires heating at a high temperature for a long time. For this reason, conventional one-component resins that can be cured with light and heat as described above have been put into practical use only when using a latent curing agent that is liquid, releases Lewis acid when heated, and has little inhibition of light transmission. It was evaluated that there is a possibility of development.
しかしながら、上述し７たような潜在性硬化剤を用いた
場合、硬化物特性に関しては、二液型でアミン系や酸無
水物系硬化剤を使用し２た場合に比べると、劣っている
。However, when a latent curing agent such as that described in 7 above is used, the properties of the cured product are inferior to those when a two-part type amine-based or acid anhydride-based curing agent is used.
そこで、この発明は、一液型でありながら貯蔵安定性が
良好で、短時間の紫外線照射と比較的低温加熱で硬化可
能な、酸無水物系硬化剤を用いた、光熱硬化併用型樹脂
組成物を提供することを目的とするものである。Therefore, this invention has developed a photothermal curing resin composition using an acid anhydride curing agent, which is a one-component type, has good storage stability, and can be cured by short-time ultraviolet irradiation and heating at a relatively low temperature. The purpose is to provide something.
［課題を解決するための手段］
この発明に係る光熱硬化併用型樹脂組成物は、」二記目
的を達成するため、
（ａ）ラジカル重合単量体、
（ｂ）分子内にエポギシ基を１個以上有する化合物の少
なくとも１種を含んでなるエポキシ樹脂、（ｃ）酸無水
物系エボギシ樹脂用硬化剤、（ｄ）光重合開始剤、
（ｅ）熱ラジカル重合開始剤、および
（ｆ）マイクロカプセル化されたエボキシ樹脂用硬化剤
、
を含むことを特徴とＬ．ている。[Means for Solving the Problems] In order to achieve the second object, the photothermosetting resin composition according to the present invention comprises (a) a radically polymerized monomer, (b) one epoxy group in the molecule. (c) an acid anhydride curing agent for epoxy resin, (d) a photopolymerization initiator, (e) a thermal radical polymerization initiator, and (f) a micro an encapsulated curing agent for epoxy resin; ing.
［作用コ
この発明に係る光熱硬化併用型樹脂組成物に含まれる各
成分が持つ働きは、次のとおりてある。[Function] The functions of each component contained in the photothermosetting resin composition according to the present invention are as follows.
（ａ）ラジカル重合単量体・・光または熱によりラジカ
ルを発生する重合開始剤によりラジカル重合する。光硬
化型の樹脂成分として使用される。(a) Radical polymerization monomer: Radical polymerization is performed using a polymerization initiator that generates radicals by light or heat. Used as a photocurable resin component.
（ｂ）分子内にエポキシ基を１個以−ヒ有する化合物の
少なくとも１種を含んでなるエポキシ樹脂・・・光によ
ってカチオン重合を生じさせるタイプでの使用以外では
、熱硬化型の樹脂成分として使われる。(b) Epoxy resin containing at least one compound having one or more epoxy groups in the molecule...other than the type that causes cationic polymerization by light, it is used as a thermosetting resin component. used.
（ｃ）酸無水物系エボキシ樹脂用硬化剤・・・（ｂ）を
熱架橋（光硬化の後の熱架橋）するために使用される。(c) Acid anhydride curing agent for epoxy resin: Used to thermally crosslink (b) (thermal crosslinking after photocuring).
（ｄ）光重合開始剤・・・光により分解してラジカルを
発生し、（ａ）を重合するのに使う。(d) Photopolymerization initiator: Decomposes with light to generate radicals, which are used to polymerize (a).
（ｅ）熱ラジカル重合開始剤・・・硬化されるべき樹脂
組成物が特に複雑な形状を有していたり厚みを有してい
たりする場合、未反応で残る可能性のある（ａ）を、（
ｂ）の架橋と同時に重合させるための重合開始剤として
使われる。(e) Thermal radical polymerization initiator: When the resin composition to be cured has a particularly complicated shape or thickness, (a) that may remain unreacted, (
It is used as a polymerization initiator for simultaneous polymerization with b) crosslinking.
（ｆ）マイクロカプセル化されたエポキシ樹脂用硬化剤
・・硬化剤あるいは硬化促進剤（三級アミン）の固体表
面を不活性膜で１つ１つ包み込んだもので、保存安定性
を保ちながら、熱硬化時間の短縮を図る。(f) Microencapsulated curing agent for epoxy resin: The solid surface of a curing agent or curing accelerator (tertiary amine) is wrapped one by one in an inert film, maintaining storage stability. Aim to shorten heat curing time.
［実施例］
この発明に係る光熱硬化イ〕｛用型樹脂組成物に含まれ
る前述した成分（ａ）〜（ｆ）の各々には、たとえば、
次のものを用いることかできる。[Example] Photothermal curing according to the present invention] {Each of the above-mentioned components (a) to (f) contained in the mold resin composition includes, for example,
You can use the following:
（ａ）・・特に限定しないが、アクリル基やアクロイル
基等の重合性二重結合を有ずる、変性エボキシ樹脂、変
性ウレタン樹脂、変性不飽和ポリエステル。(a) Although not particularly limited, modified epoxy resins, modified urethane resins, modified unsaturated polyesters having polymerizable double bonds such as acrylic groups and acroyl groups.
（ｂ）・・・特に限定しないが、分子内にエポキシ基を
１個以上有する化合物であればよく、分子内に重合性二
重結合とエボキシ基とを共存させている化合物でもよい
。(b)... Although not particularly limited, any compound may be used as long as it has one or more epoxy groups in the molecule, and may be a compound in which a polymerizable double bond and an epoxy group coexist in the molecule.
（ｃ）・・・特に種類は限定しないが、芳香族系、環状
脂肪族系、脂肪族系、ハロゲン化系、等がある。(c) Although the type is not particularly limited, examples include aromatic type, cycloaliphatic type, aliphatic type, halogenated type, etc.
（ｄ）・・・光により分解してラジカルを発生し、（ａ
）を重合するものであれば、特に限定しない。(d) ... Decomposes with light to generate radicals, (a
) is not particularly limited as long as it polymerizes.
（ｂ）を光照射により架橋させるカチオン発生可能なジ
アゾニウム塩を併用しても差し支えない。A diazonium salt capable of generating a cation that crosslinks (b) by light irradiation may be used in combination.
Ｃｅ）・・・特に限定しないが、たとえば過酸化物が用
いられる。Ce)...Although not particularly limited, peroxide is used, for example.
（ｆ）・・・たとえば、旭化成（株）製の潜在性硬化剤
「ノバキュアＨＸ−３７４１Ｊ、「同ＨＸ３７４２ｊ、
「同Ｉ｛Ｘ−３８９１．ｊのうち、いずれか１種類以上
。(f)... For example, Asahi Kasei Corporation's latent curing agent "Novacure HX-3741J,""NovacureHX-3742j,"
“Any one or more of the same I{X-3891.j.
次に、この発明に従ったより具体的な実施例を、比較例
との比較の下で説明する。なお、以下の説明において、
各成分に関連して用いた（ａ）〜（ｆ）は、それぞれ、
今までこの明細書において用いていた成分を表わす（ａ
）〜（ｆ）の各記号と対応している。Next, more specific examples according to the present invention will be described in comparison with comparative examples. In addition, in the following explanation,
(a) to (f) used in connection with each component are, respectively,
Indicates the components used so far in this specification (a
) to (f).
実施例
（ａ）エポキシ変性アクリレー｝ＳＰ−１５０９（昭和
高分子（株）製）：６０重量部メタクリル酸アクリレー
トＴＨＦ−Ａ
（共栄社油脂化学工業（株）製）＝１０重量部（ｂ）エ
ポキシ当量１９０のビスフェノールＡ型エポキシ樹脂（
油化ンエルエポキシ（株）製）３０重量部
（Ｃ）メチルテトラヒＦ口無水フタル酸（ＨＮ−２２０
０ ．日立化成（株）製）：２５重量部（ｄ）光開始剤
ベンゾインエチルエーテル：２重量部
（ｅ）ペンゾインパーオキサイド；０，５重量部
（ｆ）ノバキュアＨＸ−３８９１ （旭化成（株）製）
：２．７重量部
上記（ａ）〜（ｆ）をよく混練し、この発明に係る樹脂
組成物を得た。Example (a) Epoxy-modified acrylic SP-1509 (manufactured by Showa Kobunshi Co., Ltd.): 60 parts by weight Methacrylic acid acrylate THF-A (manufactured by Kyoeisha Yushi Kagaku Kogyo Co., Ltd.) = 10 parts by weight (b) Epoxy equivalent 190 bisphenol A type epoxy resin (
30 parts by weight (C) Methyltetrahyphthalic anhydride (HN-220 manufactured by Yuka NEL Epoxy Co., Ltd.)
0. Hitachi Chemical Co., Ltd.): 25 parts by weight (d) Photoinitiator benzoin ethyl ether: 2 parts by weight (e) Penzoin peroxide; 0.5 parts by weight (f) Novacure HX-3891 (Asahi Kasei Co., Ltd.) made)
: 2.7 parts by weight The above (a) to (f) were thoroughly kneaded to obtain a resin composition according to the present invention.
比較例１
（ａ）〜（ｅ）については、上記実施例と同じものを同
じ配合比で用いた。Comparative Example 1 For (a) to (e), the same materials as in the above example were used at the same compounding ratio.
（ｆ）については、熱によりルイス酸を発生する熱硬化
用触媒アデカオプトンＣＰ−６６ （旭電化工業（株）
製）：０．５重量部を用いた。Regarding (f), the thermosetting catalyst Adeka Opton CP-66 (Asahi Denka Kogyo Co., Ltd.) generates Lewis acid by heat.
): 0.5 part by weight was used.
これらをよく混練し、比較例］の樹脂組成物を得た。These were thoroughly kneaded to obtain a resin composition of Comparative Example.
比較例２
（ａ）〜（ｅ）については、上記実施例と同じものを同
じ配合比で用いた。Comparative Example 2 For (a) to (e), the same materials as in the above example were used at the same blending ratio.
（ｆ）は使用しなかった。(f) was not used.
これらについても、よく混練し、比較例２の樹脂組成物
を得た。These were also thoroughly kneaded to obtain a resin composition of Comparative Example 2.
比較例３ アミン系硬化剤を使用して、二液型樹脂組成物とした。Comparative example 3 A two-component resin composition was prepared using an amine curing agent.
すなわち、上記実施例における（ａ）， （ｂ），（
ｄ）， （ｅ）を混練し、主剤とした。That is, (a), (b), (
d) and (e) were kneaded to form a main ingredient.
これに対して、硬化剤として、トリエチレンテトラミン
を主剤１００重量部に対して１３重量部の配合比で混合
した。On the other hand, as a curing agent, triethylenetetramine was mixed at a blending ratio of 13 parts by weight to 100 parts by weight of the base resin.
これら実施例ならびに比較例１〜３の各々について、「
保存安定性」、「熱硬化条件」、「接着性」、「吸水率
」、および「絶縁抵抗」を測定または評価し、その結果
を以下の表に示す。Regarding each of these Examples and Comparative Examples 1 to 3, "
"Storage stability", "thermal curing conditions", "adhesion", "water absorption", and "insulation resistance" were measured or evaluated, and the results are shown in the table below.
（以下余白）
上記表において、「保存安定性」は、ポットライフを意
味し、初期粘度に対してその値が２倍になるまでの時間
を測定したものである。(The following is a blank space) In the above table, "storage stability" means pot life, and is measured as the time until the value doubles from the initial viscosity.
「熱硬化条件」は、紫外線（高圧水銀ランプ）５００ｍ
Ｊ／ｃｍ２照射後の熱硬化条件を示したものである。"Thermal curing conditions" are ultraviolet rays (high pressure mercury lamp) 500m
It shows the thermosetting conditions after irradiation with J/cm2.
「接着性」は、アルミナの板の表面に樹脂層を形成し、
紫外線を照射して硬化させたものを２枚準備し、樹脂層
の形成面を突き合わせてエポキシ接着剤で接着し、アル
ミナの板を引き剥がしたときの強度を相対的に評価した
ものである。"Adhesiveness" is achieved by forming a resin layer on the surface of the alumina plate.
Two sheets were prepared that had been cured by irradiation with ultraviolet rays, and the surfaces on which the resin layers were formed were butted together using epoxy adhesive, and the alumina sheets were peeled off and the strength was evaluated relatively.
「吸水率」は、２５゜Ｃの純水中に、２４時間浸漬後の
重量増加率を測定したものである。"Water absorption" is a measurement of the weight increase rate after immersion in pure water at 25°C for 24 hours.
「絶縁抵抗」は、５００■印加時の抵抗値［Ω］を測定
したものである。"Insulation resistance" is the resistance value [Ω] measured when 500μ is applied.
［発明の効果］
以上のように、この発明によれは、従来困難とされてい
た、酸無水物系硬化剤を用いた、一液型でありながら貯
蔵安定性が良好で、短時間の紫外線照射と比較的低温加
熱で硬化可能な光熱硬化併用型樹脂組成物が得られる。[Effects of the Invention] As described above, the present invention is a one-component type that uses an acid anhydride curing agent, has good storage stability, and can be used for a short time with ultraviolet rays, which was previously considered difficult. A photothermally curable resin composition that can be cured by irradiation and heating at a relatively low temperature is obtained.
この樹脂組成物が硬化されたときには、耐熱性および耐
化学薬品性のほか、前述した表に示すように、密着性お
よび電気絶縁性に優れたものとなる。When this resin composition is cured, it has excellent heat resistance and chemical resistance as well as adhesion and electrical insulation as shown in the table above.
また、この発明に係る樹脂組成物は、容易に硬化できる
ため、前述したような厚みが比較的あり、また複雑な形
状を有していても、能率的に硬化されるので、たとえば
、電子部品等のケースに注型する樹脂等として有利に用
いることができる。Furthermore, since the resin composition according to the present invention can be easily cured, it can be efficiently cured even if it is relatively thick as described above and has a complicated shape, so it can be used, for example, in electronic parts. It can be advantageously used as a resin etc. to be cast into cases such as.
Claims (1)
なくとも１種を含んでなるエポキシ樹脂、（ｃ）酸無水
物系エポキシ樹脂用硬化剤、 （ｄ）光重合開始剤、 （ｅ）熱ラジカル重合開始剤、および （ｆ）マイクロカプセル化されたエポキシ樹脂用硬化剤
、 を含む、光熱硬化併用型樹脂組成物。[Scope of Claims] (a) a radically polymerized monomer; (b) an epoxy resin comprising at least one compound having one or more epoxy groups in the molecule; (c) for acid anhydride-based epoxy resins. A curing agent, (d) a photopolymerization initiator, (e) a thermal radical polymerization initiator, and (f) a microencapsulated epoxy resin curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5687389A JPH02235917A (en) | 1989-03-09 | 1989-03-09 | Light-and heat-curing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5687389A JPH02235917A (en) | 1989-03-09 | 1989-03-09 | Light-and heat-curing resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02235917A true JPH02235917A (en) | 1990-09-18 |
Family
ID=13039543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5687389A Pending JPH02235917A (en) | 1989-03-09 | 1989-03-09 | Light-and heat-curing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02235917A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03188102A (en) * | 1989-12-15 | 1991-08-16 | Nippon Kasei Kk | Polymerizable curable composition |
| EP0632059A2 (en) * | 1993-06-30 | 1995-01-04 | Sumitomo Chemical Company, Limited | Interpenetrating networks from unsaturated monomers and thermosetting resins |
| US5589230A (en) * | 1992-10-09 | 1996-12-31 | Henkel Kommanditgesellschaft Auf Aktien | Polymerizable, curable molding composition and a molding or coating process using this molding composition |
| US5721076A (en) * | 1992-06-19 | 1998-02-24 | Nippon Steel Corporation | Color filters and materials and resins therefor |
| JP2005226014A (en) * | 2004-02-13 | 2005-08-25 | Showa Highpolymer Co Ltd | Resin composition for pultrusion, fiber-reinforced resin composition, method for molding the same and molded article |
| WO2007017307A1 (en) * | 2005-08-08 | 2007-02-15 | Siemens Aktiengesellschaft | Uv-curable and thermosetting epoxy resin lacquer for electronic subassemblies in humid spaces |
-
1989
- 1989-03-09 JP JP5687389A patent/JPH02235917A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03188102A (en) * | 1989-12-15 | 1991-08-16 | Nippon Kasei Kk | Polymerizable curable composition |
| US5721076A (en) * | 1992-06-19 | 1998-02-24 | Nippon Steel Corporation | Color filters and materials and resins therefor |
| US5589230A (en) * | 1992-10-09 | 1996-12-31 | Henkel Kommanditgesellschaft Auf Aktien | Polymerizable, curable molding composition and a molding or coating process using this molding composition |
| EP0632059A2 (en) * | 1993-06-30 | 1995-01-04 | Sumitomo Chemical Company, Limited | Interpenetrating networks from unsaturated monomers and thermosetting resins |
| EP0632059A3 (en) * | 1993-06-30 | 1996-04-17 | Sumitomo Chemical Co | Interpenetrating networks from unsaturated monomers and thermosetting resins. |
| JP2005226014A (en) * | 2004-02-13 | 2005-08-25 | Showa Highpolymer Co Ltd | Resin composition for pultrusion, fiber-reinforced resin composition, method for molding the same and molded article |
| JP4546743B2 (en) * | 2004-02-13 | 2010-09-15 | 昭和高分子株式会社 | Drawing resin composition, fiber reinforced resin composition, molding method thereof and molded article |
| WO2007017307A1 (en) * | 2005-08-08 | 2007-02-15 | Siemens Aktiengesellschaft | Uv-curable and thermosetting epoxy resin lacquer for electronic subassemblies in humid spaces |
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