JPS60113449A - 難加工性ろう材付リ−ドピンの製造方法 - Google Patents

難加工性ろう材付リ−ドピンの製造方法

Info

Publication number
JPS60113449A
JPS60113449A JP22125183A JP22125183A JPS60113449A JP S60113449 A JPS60113449 A JP S60113449A JP 22125183 A JP22125183 A JP 22125183A JP 22125183 A JP22125183 A JP 22125183A JP S60113449 A JPS60113449 A JP S60113449A
Authority
JP
Japan
Prior art keywords
lead pin
difficult
brazing
alloy
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22125183A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0550142B2 (cs
Inventor
Katsuyuki Takarasawa
宝沢　勝幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP22125183A priority Critical patent/JPS60113449A/ja
Publication of JPS60113449A publication Critical patent/JPS60113449A/ja
Publication of JPH0550142B2 publication Critical patent/JPH0550142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP22125183A 1983-11-24 1983-11-24 難加工性ろう材付リ−ドピンの製造方法 Granted JPS60113449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22125183A JPS60113449A (ja) 1983-11-24 1983-11-24 難加工性ろう材付リ−ドピンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22125183A JPS60113449A (ja) 1983-11-24 1983-11-24 難加工性ろう材付リ−ドピンの製造方法

Publications (2)

Publication Number Publication Date
JPS60113449A true JPS60113449A (ja) 1985-06-19
JPH0550142B2 JPH0550142B2 (cs) 1993-07-28

Family

ID=16763838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22125183A Granted JPS60113449A (ja) 1983-11-24 1983-11-24 難加工性ろう材付リ−ドピンの製造方法

Country Status (1)

Country Link
JP (1) JPS60113449A (cs)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265456A (ja) * 1986-12-24 1988-11-01 Tanaka Kikinzoku Kogyo Kk ろう付リ−ドピンの製造方法とその接合方法
JPH02177554A (ja) * 1988-12-28 1990-07-10 Tokuriki Honten Co Ltd ろう材付リードピンの製造方法およびその製造装置
KR100499321B1 (ko) * 2002-04-26 2005-07-04 정일조 귀고리핀 전기저항 용접장치
CN107813090A (zh) * 2016-09-13 2018-03-20 富鼎电子科技(嘉善)有限公司 一种探针制备方法及制备该探针的焊接治具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823466A (ja) * 1981-08-04 1983-02-12 Tanaka Kikinzoku Kogyo Kk 集積回路装置用リ−ドピン
JPS5835093A (ja) * 1981-08-25 1983-03-01 Tanaka Kikinzoku Kogyo Kk 複合ろう材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823466A (ja) * 1981-08-04 1983-02-12 Tanaka Kikinzoku Kogyo Kk 集積回路装置用リ−ドピン
JPS5835093A (ja) * 1981-08-25 1983-03-01 Tanaka Kikinzoku Kogyo Kk 複合ろう材

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265456A (ja) * 1986-12-24 1988-11-01 Tanaka Kikinzoku Kogyo Kk ろう付リ−ドピンの製造方法とその接合方法
JPH02177554A (ja) * 1988-12-28 1990-07-10 Tokuriki Honten Co Ltd ろう材付リードピンの製造方法およびその製造装置
KR100499321B1 (ko) * 2002-04-26 2005-07-04 정일조 귀고리핀 전기저항 용접장치
CN107813090A (zh) * 2016-09-13 2018-03-20 富鼎电子科技(嘉善)有限公司 一种探针制备方法及制备该探针的焊接治具
CN107813090B (zh) * 2016-09-13 2021-08-31 富鼎电子科技(嘉善)有限公司 一种探针制备方法及制备该探针的焊接治具

Also Published As

Publication number Publication date
JPH0550142B2 (cs) 1993-07-28

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