JPS60113416A - Solid electrolytic condenser and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same.
In particular, it relates to the structure and manufacturing method of the anode terminal of chip solid electrolytic capacitors.

In general, in a solid electrolytic capacitor, for example, as shown in Fig. 1, a metal wire having a valve action is attached to an anode body 1 made by pressure molding a metal powder having a valve action as an anode lead 2. After forming an oxide film layer and a semiconductor layer on the circumferential surface, a cathode layer 3 of graphite, silver paste, solder, etc. is sequentially formed. Good anode lead lead terminal 5
It is configured by connecting.

As described above, since the anode body lead 2 cannot normally be soldered, it is necessary to connect the anode lead lead terminal 5, which has good soldering properties. This connection is normally made by welding, but since the oxide film on the anode body 1 deteriorates due to the high heat generated during welding, it is necessary to provide a certain distance between the welding point 6 and the anode body 1. For this reason, the distance between the welding point 6 and the anode body 1 in the formed capacitor is large, which is a major obstacle to high-density packaging of elements as equipment becomes smaller.

SUMMARY OF THE INVENTION An object of the present invention is to provide a solid electrolytic capacitor and a method for manufacturing the same which eliminates such conventional drawbacks.

According to the present invention, there is obtained a solid electrolytic capacitor and a method for manufacturing the same, characterized in that the tip of an anode lead led out from a capacitor element is roughened and then metal plated.

Hereinafter, the present invention will be explained with reference to the embodiment drawings of FIGS. 2 to 4.

[Embodiment 1] FIG. 2 is a side view of a non-exterior solid electrolytic capacitor according to an example of the tube 1 of the present invention.

First, metal powder with valve action, such as tantalum, is pressure-molded into the desired shape, sintered at high temperature in a high vacuum, and then anodized to form a dielectric material, and a semiconductor layer such as a manganese dioxide layer is formed. Graphite, silver paste, anode body 1
A cathode layer 3 made of solder or the like is sequentially formed. Next, if necessary, only the tip of the anode body lead 2 that has been molded into a desired shape and led out from the anode body 1 is roughened by means such as sandblasting, and the anodic oxide film is removed, followed by electroless plating or electrolytic plating. A solid electrolytic capacitor was formed by depositing a metal layer 4 of a metal that can be soldered, such as copper or nickel, by plating.

[Example 2] FIG. 3 shows a second example of the present invention, in which an anode body 1 produced in the same manner as in Example 1 has a thin structure formed to have approximately the same thickness as an anode body lead 2. FIG. 2 is a side view of a non-exterior solid electrolytic capacitor.

Since the anode body 1 has approximately the same thickness as the anode body lead 2, the anode body lead 2 does not need to be bent or otherwise molded, and there is no problem in mounting the product.

[Embodiment 3] FIG. 4 is a side view of a resin-clad solid electrolytic capacitor according to a third example of the present invention.

A cathode layer 3 made of graphite, silver paste, solder, etc. is sequentially formed on the anode body 1 which is press-molded and sintered in the same manner as in Example 1, and a plate-shaped or columnar cathode lead lead-out terminal bent into a crank shape is placed on top of the cathode layer 3. Connect 7 by soldering. Next, the tip of the anode body lead 2 which has been molded into a desired shape and led out from the anode body 1 and the tip of the cathode lead extraction terminal 7 are covered with an insulating exterior resin 8 such as epoxy resin.

Thereafter, the tip of the anode body lead 2 was roughened to remove the anodic oxide film, and then a solderable metal layer 4 was deposited by plating means to form a solid electrolytic capacitor.

As described above, in the solid electrolytic capacitor obtained by the present invention, a metal that can be directly soldered to the anode lead led out from the anode body is attached by electrolytic or electroless plating means without applying high heat, so the anode body is oxidized. There is no deterioration of the film, resulting in stable product characteristics and high reliability. Furthermore, the length of the anode body lead is shortened, allowing for miniaturization. moreover,
Since a large amount of metal can be deposited on the anode lead at once, it is much more efficient than the conventional method of attaching metal one by one by welding.

[Brief explanation of the drawing]

FIG. 1 is a side view of a conventional non-exterior solid electrolytic capacitor. FIG. 2 is a side view of a non-sheathed solid electrolytic capacitor according to an example of the present invention. 5- FIG. 3 is a side view of a non-sheathed solid electrolytic capacitor with a thin structure according to an example of the present invention. FIG. 4 is a side view of a resin-clad solid electrolytic capacitor according to an example of the present invention. DESCRIPTION OF SYMBOLS 1... Anode body, 2... Anode body-de, 3..., Cathode layer, 4... Solderable metal layer, 5... ...Anode lead extraction terminal, 6...
...Welding point, 7...Cathode lead extraction terminal, 8
...Insulating exterior resin. 6-

Claims (2)

[Claims] (1) A solid electrolytic capacitor characterized by metal plating applied to the tip of an anode lead led out from a solid electrolytic capacitor element. (2) A method for manufacturing a solid electrolytic capacitor, comprising the step of roughening the tip of an anode lead led out from a solid electrolytic capacitor element and then applying metal plating.