JPS5882517A - Method of producing chip-shaped condenser - Google Patents
Method of producing chip-shaped condenserInfo
- Publication number
- JPS5882517A JPS5882517A JP56180489A JP18048981A JPS5882517A JP S5882517 A JPS5882517 A JP S5882517A JP 56180489 A JP56180489 A JP 56180489A JP 18048981 A JP18048981 A JP 18048981A JP S5882517 A JPS5882517 A JP S5882517A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- bending
- plate
- chip
- shaped metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はチップ型コンデンサの製造方法の改良に関し％
４ＩＫチップ型固体電解コンデンサの板状金属端子の折
り曲げ加工法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for manufacturing chip capacitors.
This invention relates to an improvement in the method of bending a plate metal terminal of a 4IK chip type solid electrolytic capacitor.
一般にチップ型固体電解コンデンサは例えば第１図に示
すように弁作用を有するタンタル金属粉末を加圧成製し
焼結してなるコンデンサ素子１に、予めタンタル線を陽
極リード２として植立し、この陽極リード２の突出部分
に第１の板状金属端子３を溶接すると共に第２の板状金
属端子４をコンデンサ素子１０周面に誘電体酸化皮膜層
５および牛導体層６を介して形成された陰極の電極引出
し層７に接続し、コンデンサ素子ｌの全周面を外装樹脂
材８にて被覆し、然る後第２図および第３図に示すよう
に板状金属端子３および４を折り曲げ箇所３ｍ、３ｂ＋
４ａｔ４ｂＫて折如曲げ加工して構成されている。In general, chip-type solid electrolytic capacitors include, for example, a tantalum wire as an anode lead 2 planted in advance on a capacitor element 1 made by pressurizing and sintering tantalum metal powder having a valve action, as shown in FIG. A first plate-shaped metal terminal 3 is welded to the protruding portion of this anode lead 2, and a second plate-shaped metal terminal 4 is formed on the circumferential surface of the capacitor element 10 via a dielectric oxide film layer 5 and a conductor layer 6. The entire circumferential surface of the capacitor element l is covered with an exterior resin material 8, and then plate-shaped metal terminals 3 and 4 are connected to the electrode lead layer 7 of the cathode that has been formed. The bending point is 3m, 3b+
It is constructed by folding and bending 4at4bK.
ところで、従来の板状金属端子３，４の折り曲げ加工方
法では、まず第２図に示すように各板状金属端子３，４
の外装樹脂材８から突出した根本部の折り自げ箇所３ａ
、４ｍをコンデンサ本体９の左右側面９ａにそって曲げ
加工すゐ。次に第３図に示すように各板状金属端子３，
４の先端部の折り曲げ箇所３ｂ、４ｂをコンデンサ本体
９の底面９ｂにそって折少曲げ加工している。このため
板状金属端子３，４の折り曲げ箇所８ｍ、３ｂ、４ａ、
４ｂの内側の角度はスプリングバックによって曲げ加工
時よりも大きくなり、板状金属端子３．４の先端の実装
部３ｃ 、４ｃがコンデンサ本体９の底面９ｂと平行密
接状態を保持することができなくなり、底面９ｂから離
れてしまってい喪。このため次のような欠点を有してい
た。By the way, in the conventional method of bending the plate metal terminals 3 and 4, first, as shown in FIG.
The folding point 3a at the base protruding from the exterior resin material 8 of
, 4m along the left and right sides 9a of the capacitor body 9. Next, as shown in FIG. 3, each plate metal terminal 3,
The bending points 3b and 4b at the tip of the capacitor 4 are bent along the bottom surface 9b of the capacitor body 9. Therefore, the bending points of the plate metal terminals 3 and 4 are 8m, 3b, 4a,
The inner angle of 4b becomes larger due to springback than during the bending process, and the mounting parts 3c and 4c at the tips of the plate metal terminals 3.4 are no longer able to maintain parallel and close contact with the bottom surface 9b of the capacitor body 9. , I am saddened that it has separated from the bottom surface 9b. For this reason, it had the following drawbacks.
（イ） コンデンサの高さ寸法が大きくカリ、回路基板
への実装時の体積効率が悪い。(a) The height of the capacitor is large and the volumetric efficiency when mounting it on the circuit board is poor.
（ロ）コンデンサの回路基板への実装時の座りが悪い。(b) The capacitor does not sit well when mounted on the circuit board.
（ハ）回路基板への半田付は実装前の接着剤による仮留
め工事を行なう場合にコンデンサ本体の底面９ｂに接着
剤を厚く塗布しなくてはならない。(c) For soldering to a circuit board, when temporarily fixing with adhesive before mounting, it is necessary to apply a thick layer of adhesive to the bottom surface 9b of the capacitor body.
本発明の目的はかかる従来の欠点を除去したチップ型コ
ンデンサの製造方法を提供するものである。An object of the present invention is to provide a method for manufacturing a chip type capacitor that eliminates such conventional drawbacks.
本発明によれば樹脂外装されたコンデンサ本体と、この
本体より導出され、かつ本体外部にそって、複数の箇所
を折り曲げ加工して形成された板状金属端子を有するチ
ップ型コンデンサの製造方法において、板状金属端子の
本体導出部より遠い折り曲げ箇所から順次折り曲げ加工
を行なう工程を特徴とするチップ型コンデンサの製造方
法が得られる。According to the present invention, there is provided a method for manufacturing a chip-type capacitor having a resin-sheathed capacitor body and a plate-shaped metal terminal extending from the body and formed by bending a plurality of points along the outside of the body. There is obtained a method for manufacturing a chip-type capacitor, which is characterized by a step of sequentially bending a plate-shaped metal terminal from a bending point farther from the main body lead-out portion.
以下、本発明の実施例を第４図〜第６図を用いて説明す
る。Embodiments of the present invention will be described below with reference to FIGS. 4 to 6.
第４図は板状金属端子３，４を具備し九折り曲げ加工前
のチップ型固体電解コンデンサであり、コンデンサ本体
（以後本体という）９は樹脂モールドにより外装されて
いる。まず第５図に示すように本体９よシ導出され丸板
状金属端子３，４の本体導出部から、遠い折り曲げ箇所
３ｂ、４ｂを曲げ加工する。この時、折り曲げ箇所３ｂ
、４ｂの板状金属端子によって構成される内側の角度
λは、第６図に示した折り曲げ箇所３ｍ、４ｍを曲げ加
工した時にスプリングバックによって生ずる角度Ｂの分
だけ、本体９の左右側面９ａと底面９ｂによって構成さ
れる角度Ｃよ抄も小さくなる様に折り曲げる。FIG. 4 shows a chip-type solid electrolytic capacitor equipped with plate-shaped metal terminals 3 and 4 and before being bent, and a capacitor body (hereinafter referred to as the body) 9 is covered with a resin mold. First, as shown in FIG. 5, bent portions 3b and 4b of the round plate-shaped metal terminals 3 and 4 which are led out from the main body 9 and far from the main body lead-out portion are bent. At this time, bending point 3b
, 4b, the inner angle λ formed by the plate-shaped metal terminals 3m and 4b is equal to the angle B caused by springback when bending the bending points 3m and 4m shown in FIG. Bend it so that the angle C formed by the bottom surface 9b also becomes smaller.
また、折如曲げ箇所３ｂ、４ｂの位置は、第６図に示す
ように折り曲げ箇所３ｍ、４ｍの折り曲げ加工を行なっ
た時に板状金属端子３，４０回路基板への実装部３ｃ
、４ｃが本体９の底面９ｂＫ平行に接するような位置を
選択する。次に第６図に示すように折り曲げ箇所３ｍ、
４ｍを本体９０側面９ａにそって折り曲げ加工を行なう
。本発明の折り曲げ加工により板状金属端子３，４の実
装部３ち４Ｃが本体９の底面９ｂと平行で、かつ底面９
ｂに接したチップ型コンデンサが得られる。Further, the positions of the folding parts 3b and 4b are as shown in FIG. 6 when the bending parts 3m and 4m are bent.
, 4c are in contact with the bottom surface 9bK of the main body 9 in parallel. Next, as shown in Figure 6, the bending point is 3m,
4m is bent along the side surface 9a of the main body 90. Due to the bending process of the present invention, the mounting portions 3 4C of the plate metal terminals 3 and 4 are parallel to the bottom surface 9b of the main body 9, and the bottom surface 9
A chip type capacitor in contact with b is obtained.
以上、本発明は次の効果が有る。As described above, the present invention has the following effects.
（１）コンデンサの高さ寸法が小さくなり１回路基板へ
０実装上の体積効率が良い。(1) The height dimension of the capacitor is reduced, and the volumetric efficiency of zero mounting on one circuit board is good.
（１１）コンデンサの実装時に回路基板への座りが嵐い
。(11) When mounting the capacitor, it is difficult to sit on the circuit board.
０１ｉ）コンデンサの実装時に接着剤を用いそ仮留めを
する場合の接着剤塗布の厚さを薄くすることができる。01i) When mounting a capacitor using an adhesive and temporarily fixing the capacitor, the thickness of the adhesive applied can be reduced.
第１図はチップ型コンデンサの構造を示す断面図。嬉２
図および第３図は従来の板状金属端子の折り曲げ加工方
法を示す側断面図。第４図、第５図および第６図は本発
明による板状金属端子の折り曲げ加工方法を示す側断面
図。
ｌ・・・・・・コンデンサ素子、２・・・・・・陽極リ
ード、３・・・・・・第１の板状金属端子、４・・・・
・・第２の板状金属端子、３ａ、３ｂ、４ａｔ４ｂ””
”折り曲げ箇所、３ ｃ。
４Ｃ・・・・・・実装部、５・・・・・・酸化層、６・
・・・・・半導体層、７・・・・・・（陰極の）電極引
出し層、８・・・・・・外装樹脂材、９・・・・・・（
コンデンサ）本体、９＆・・・・・・（本体の）側面、
９ｂ・・・・・・（本体の）底面。FIG. 1 is a sectional view showing the structure of a chip type capacitor. Happy 2
3 and 3 are side sectional views showing a conventional method for bending a plate-shaped metal terminal. FIG. 4, FIG. 5, and FIG. 6 are side sectional views showing a method of bending a plate-shaped metal terminal according to the present invention. l... Capacitor element, 2... Anode lead, 3... First plate metal terminal, 4...
...Second plate metal terminal, 3a, 3b, 4at4b""
"Bending point, 3 c. 4C... Mounting part, 5... Oxidation layer, 6.
... Semiconductor layer, 7 ... Electrode extraction layer (of the cathode), 8 ... Exterior resin material, 9 ...... (
capacitor) main body, 9 &... (main body) side,
9b...Bottom surface (of the main body).
Claims (1)
、かつ本体外部にそって複数の箇所を折り曲げ加工して
形成され丸板状金属端子を有するチップ型コンデンサの
製造方法において、前記板状金属端子の本体導出部より
遠い折り曲げ箇所から順次折り曲げ加工を行なう１柵を
特徴とするチップ型コンデンサの製造方法。A method for manufacturing a chip-type capacitor having a resin-sheathed capacitor body and a round plate-shaped metal terminal extending from the capacitor body and formed by bending a plurality of points along the outside of the body, wherein the plate-shaped metal terminal A method for manufacturing a chip-type capacitor characterized by one fence in which the bending process is performed sequentially from a bending point farthest from a main body lead-out part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56180489A JPS5882517A (en) | 1981-11-11 | 1981-11-11 | Method of producing chip-shaped condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56180489A JPS5882517A (en) | 1981-11-11 | 1981-11-11 | Method of producing chip-shaped condenser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5882517A true JPS5882517A (en) | 1983-05-18 |
Family
ID=16084122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56180489A Pending JPS5882517A (en) | 1981-11-11 | 1981-11-11 | Method of producing chip-shaped condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5882517A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62213226A (en) * | 1986-03-14 | 1987-09-19 | 松下電器産業株式会社 | Chip electronic parts |
-
1981
- 1981-11-11 JP JP56180489A patent/JPS5882517A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62213226A (en) * | 1986-03-14 | 1987-09-19 | 松下電器産業株式会社 | Chip electronic parts |
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