JPS60112272A - Substrate mounting type connector - Google Patents

Substrate mounting type connector

Info

Publication number
JPS60112272A
JPS60112272A JP58219403A JP21940383A JPS60112272A JP S60112272 A JPS60112272 A JP S60112272A JP 58219403 A JP58219403 A JP 58219403A JP 21940383 A JP21940383 A JP 21940383A JP S60112272 A JPS60112272 A JP S60112272A
Authority
JP
Japan
Prior art keywords
board
connector
shape
type connector
substrate mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58219403A
Other languages
Japanese (ja)
Inventor
宮園 節
上妻 祐輔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58219403A priority Critical patent/JPS60112272A/en
Publication of JPS60112272A publication Critical patent/JPS60112272A/en
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は基板取付型のコネクタに係り、特に基板取付け
に好適なリードに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a board-mounted connector, and particularly to a lead suitable for board-mounting.

〔発明の背景〕[Background of the invention]

従来の基板取付型コネクタを基板に取付ける方法は、半
田付又は圧入方式きなっていたので、前者では半田付け
をする時にコネクタが動かないように仮固定し、半田付
は後のフラックス洗浄、半田修正等工数を要し、又熱ス
トレスが加わるため基板の信頼性を劣化させていた。後
者では半田付けは不要だが、圧入時に大きな力が必要な
ことと基板のコネクタ取付穴の内壁メ・ツキにコネクタ
が圧入されることによりキズが付き、やはり基板の信頼
度を低下させるような欠点があった。
Conventional methods for attaching board-mounted connectors to boards have been either soldering or press-fitting, so in the former method, the connector is temporarily fixed so that it does not move when soldering, and the soldering is done after cleaning with flux and soldering. This required a lot of man-hours for corrections, and added heat stress, which degraded the reliability of the board. The latter does not require soldering, but has the disadvantage that a large amount of force is required when press-fitting, and the connector is press-fitted into the inner wall surface of the connector mounting hole on the board, causing scratches, which also reduces the reliability of the board. was there.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、信頼性を損なわずに、簡単な方法で基
板に取付けが可能な基板取付型コネクタを提供すること
にある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a board-mounted connector that can be mounted to a board in a simple manner without impairing reliability.

〔発明の概要〕[Summary of the invention]

熱により形状が変化する形状記憶合金をコネクタの基板
取付は部に活用することにより、従来の半田付は又は圧
入等の方法を不要とした。
By utilizing a shape-memory alloy whose shape changes with heat in the connector's board mounting section, conventional methods such as soldering or press-fitting are no longer necessary.

形状記憶効果は、低温でマルテンサイト状態にある金属
材料を加熱すると変形前の元の形に戻る現象であり、T
i−Ni合金、C1L−Zn −At合金が実用化され
ている。
Shape memory effect is a phenomenon in which a metal material in a martensitic state at a low temperature returns to its original shape before deformation when heated.
i-Ni alloy and C1L-Zn-At alloy have been put into practical use.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例を図面を用いて詳細に説明する。 Embodiments of the present invention will be described in detail below with reference to the drawings.

第1図は、本発明の一実施例である基板取付型コネクタ
のピンコンタクトの部分図であり、形状記憶合金で作ら
れており、第1図のごとき形状を記憶させておく。基板
取付部1とコンタクト部2の部分だけを表わしており、
他は省略しである。
FIG. 1 is a partial view of a pin contact of a board-mounted connector according to an embodiment of the present invention, which is made of a shape memory alloy and has a shape memorized as shown in FIG. Only the board mounting part 1 and contact part 2 are shown.
Others are omitted.

第2図は、第1図のピンコンタクトを低温で基板取付部
1を塑性変形させたものである。
FIG. 2 shows the pin contact shown in FIG. 1 with the board mounting portion 1 plastically deformed at a low temperature.

第6図、第4図は各々第1図、第2図を上部から見た平
面図であり、基板取付部1の対角線6.4の長さが違う
ところを表わしている。
6 and 4 are plan views of FIGS. 1 and 2 viewed from above, respectively, and show that the length of the diagonal line 6.4 of the board mounting portion 1 is different.

第5図はコネクタが取付く基板の断面図であり基材5に
導電部6とコネクタ取付穴7があり、取付穴7の仕上り
内径8を表わしている。
FIG. 5 is a cross-sectional view of the substrate to which the connector is attached. The base material 5 has a conductive portion 6 and a connector mounting hole 7, and the finished inner diameter 8 of the mounting hole 7 is shown.

今基板取付部1.対角線6を取付穴、内径8より大きく
、対角線4を内径8より小さく設定しておく。
Now board mounting part 1. The diagonal line 6 is set to be larger than the inner diameter 8 of the mounting hole, and the diagonal line 4 is set smaller than the inner diameter 8.

第2図の状態のピンコンタクトを第5図の基板に常温で
挿入し位置決め後、高温に熱すると、ピンの基板取付部
1は変形前の元の状態に戻るため広くなり、コネクタ取
付穴7に機械的に固定され、電気的にも接続される。
When the pin contact in the state shown in Fig. 2 is inserted into the board shown in Fig. 5 at room temperature and positioned, and then heated to a high temperature, the board mounting part 1 of the pin returns to its original state before deformation and becomes wider, and the connector mounting hole 7 mechanically fixed and electrically connected.

本実施例によれば、強い力で圧入することなく又半田付
けも行なうことなくコネクタを基板に取付けることが出
来る効果がある。
According to this embodiment, there is an advantage that the connector can be attached to the board without being press-fitted with strong force or without soldering.

第6図、第7図は本発明の他の実施f13を示すもので
、基板取付部1の断面図である。形状を記憶させた状態
9を低温で塑性度形させた状態10を示している。すな
わち、第1図2番2図とは基板取付部の形状を変えただ
けである。
FIGS. 6 and 7 show another embodiment f13 of the present invention, and are sectional views of the board mounting portion 1. FIG. A state 10 is shown in which the state 9 in which the shape is memorized is changed to a plastic shape at a low temperature. That is, the only thing different from FIG. 1 and FIG. 2 is the shape of the board mounting portion.

又これまでの実施例ではオスコンタクHこついて説明し
て来たが、メスコンタクトにつG)でも同様であり、又
コンタクトを裸で基板に取付けるものでも、/Sウジン
グに治めであるものでも同様である。
In addition, in the examples so far, we have explained the male contact H, but the same applies to the female contact (G), and the same applies to those where the contact is mounted bare on the board, or when the contact is fixed to the /S housing. It is.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、強い力で圧入しなくて良G)ため、コ
ネクタ取付穴部の導体(スルーホール部の銅メッキ)部
をキズ付けて基板の信頼度を低下させる恐れがなく、又
半田付は作業力S不要なため、半田付は時の高温ストレ
スがなく、やはり信頼度には良い方向である。
According to the present invention, there is no need to press-fit with strong force (G), so there is no risk of damaging the conductor (copper plating of the through-hole part) in the connector mounting hole and reducing the reliability of the board. Soldering does not require high-temperature stress, which is good for reliability, as soldering does not require work force S.

その上工程が簡単なため、経済性にも優れた効果がある
Moreover, since the process is simple, it has excellent economical effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の形状を記憶させた状態のピ
ンコンタクトの立体図、第2図は塑性変形させた後のピ
ンコンタクトの立体図、第5、第4図は各々第1,第2
図の平面図、第5図は基板の断面図、第6,第7図は基
板取付部の他の実抱例の断面図である。 1・基板取付部、 2・・・フンタクト部、 7・・・コネクタ取付穴、 8・・・上記の仕上り内径、 ?・・形状記憶状態の基板取付部の断面、10・・・塑
性変形後の基板取付部の断面。 第7図 第2図 第 3111!] %4 図
FIG. 1 is a three-dimensional view of a pin contact in which the shape of an embodiment of the present invention has been memorized, FIG. 2 is a three-dimensional view of a pin contact after plastic deformation, and FIGS. , second
5 is a sectional view of the board, and FIGS. 6 and 7 are sectional views of other examples of the board mounting portion. 1. Board mounting part, 2... Mounting part, 7... Connector mounting hole, 8... Finished inner diameter as above, ? ...Cross section of the board mounting part in shape memory state, 10...Cross section of the board mounting part after plastic deformation. Figure 7 Figure 2 3111! ] %4 figure

Claims (1)

【特許請求の範囲】[Claims] 1、Ti−Ni合金等一方向性形状記憶特性を有する形
状記憶合金を基板取付型コネクタの基板取付部に使用し
またことを特徴とする基板取付型コネクタ。
1. A board-mounted connector characterized in that a shape-memory alloy having unidirectional shape-memory properties, such as a Ti-Ni alloy, is used for the board-mounting part of the board-mounted connector.
JP58219403A 1983-11-24 1983-11-24 Substrate mounting type connector Pending JPS60112272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58219403A JPS60112272A (en) 1983-11-24 1983-11-24 Substrate mounting type connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58219403A JPS60112272A (en) 1983-11-24 1983-11-24 Substrate mounting type connector

Publications (1)

Publication Number Publication Date
JPS60112272A true JPS60112272A (en) 1985-06-18

Family

ID=16734858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58219403A Pending JPS60112272A (en) 1983-11-24 1983-11-24 Substrate mounting type connector

Country Status (1)

Country Link
JP (1) JPS60112272A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60241680A (en) * 1984-05-16 1985-11-30 住友電気工業株式会社 Connector
JPS6247072U (en) * 1985-09-11 1987-03-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60241680A (en) * 1984-05-16 1985-11-30 住友電気工業株式会社 Connector
JPS6247072U (en) * 1985-09-11 1987-03-23

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