JPS59168622A - Electronic part - Google Patents

Electronic part

Info

Publication number
JPS59168622A
JPS59168622A JP4382983A JP4382983A JPS59168622A JP S59168622 A JPS59168622 A JP S59168622A JP 4382983 A JP4382983 A JP 4382983A JP 4382983 A JP4382983 A JP 4382983A JP S59168622 A JPS59168622 A JP S59168622A
Authority
JP
Japan
Prior art keywords
shape
wiring board
terminal
wiring
shape memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4382983A
Other languages
Japanese (ja)
Inventor
「淵」脇 洋介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP4382983A priority Critical patent/JPS59168622A/en
Publication of JPS59168622A publication Critical patent/JPS59168622A/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は電子部品に係り、特に、端子を形状記憶合金
を以て構成し、その形状記1.aに基づき配線基板に固
定可能にしたものに関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component, and in particular, a terminal is made of a shape memory alloy, and its shape is described in 1. This invention relates to a device that can be fixed to a wiring board based on (a).

従来、電解コンデンナ等の各種部品を配線基板に接続す
る場合、端子の持つ弾性を利用してスナップインr+J
能な形状にし、その弾性力により配線基板に固定し、又
は、電子部品から引き出されたにいり−1・線を直接配
線基板に110人し2、ジー1゛線を半田イτjL:l
シた後、その不要部分を切断している。
Conventionally, when connecting various parts such as electrolytic capacitors to wiring boards, the elasticity of the terminals was used to connect snap-in r+J
110, and fix it to the wiring board by its elastic force, or directly attach the wire drawn from the electronic component to the wiring board, and solder the wire τjL:l.
After that, the unnecessary parts are cut off.

前者のスナップインによる固定では、電子部品の大きさ
や、その接続形態に合わせてその形状を設定しなければ
ならず、電子部品毎にスナップイン形状を管理すること
が極めて困ゲ「であり、電子部品の製造コストや配線の
作業コストを高くする。
In the former method of fixing by snap-in, the shape must be set according to the size of the electronic component and its connection form, and it is extremely difficult to manage the snap-in shape for each electronic component. Increases the manufacturing cost of parts and the cost of wiring work.

また、l&壱の方法では川に配線基板に電子部品から引
き出されたリードを挿入するだけであるため、半田付は
前においてはその固定が不十分となり、半田付けの際、
電子部品の脱落や位置ずれ等の不都合を生ずる。特に、
この方法は、近年の自動挿入機による配線作業には不適
である。
In addition, since the method of 1 & 1 only involves inserting the leads pulled out from the electronic components into the wiring board, the soldering is insufficient at the front, and when soldering,
This may cause inconveniences such as electronic parts falling off or being misaligned. especially,
This method is unsuitable for wiring work using recent automatic insertion machines.

とごろで、一定の形に曲げる等、成形した後、これを機
械的に変形して熱処理を施すと、元の形状に復帰する形
状記憶効果を持つ合金が提案されている。このような形
状記憶効果を持つ合金、即ら、形状記憶合金には、例え
ば、N i −’1” i合金等があり、良好な導電性
と形状記憶による保持力を併せ持っている。
An alloy has been proposed that has a shape memory effect that returns to its original shape when it is mechanically deformed and heat treated after being formed, such as by bending it into a certain shape. An alloy having such a shape memory effect, that is, a shape memory alloy, includes, for example, a N i -'1'' i alloy, which has both good electrical conductivity and a holding force due to shape memory.

この発明は、端子を配線基板の接続形態に合致させた形
状とするとともに、形状記憶合金でその一部又は全部を
形成、形状記憶の性質を利用して配線基板への挿入し、
自動固定を可能にした電子911品の提供を目的とする
In this invention, the terminal is shaped to match the connection form of the wiring board, part or all of it is made of a shape memory alloy, and the terminal is inserted into the wiring board using the property of shape memory.
The purpose is to provide 911 electronic products that can be automatically fixed.

この発明は、配線基板に装着される’jf!子を配線基
板上の実装形態に適合する形状に4Ji曲加工するとと
もに、その一部又は全部を形状記10合金で形成し、こ
の端子を配線基板に装着する際に挿入r+J能な形状に
変形して挿入後、温度処理を施すことにより、原形状に
復帰さ−けて前記配線基板に固定可能にしたことを特徴
とする。
This invention is a 'jf!' mounted on a wiring board. The terminal is processed into a shape that matches the mounting form on the wiring board, and part or all of it is made of a shape 10 alloy, and when this terminal is mounted on the wiring board, it is transformed into a shape that can be inserted. After insertion, temperature treatment is performed to restore the original shape and fix it to the wiring board.

以下、この発明を図面に示した実施例に基づき詳細に説
明する。
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

第1図はこの発明の電子gB品の実施例を示している。FIG. 1 shows an embodiment of the electronic GB product of the present invention.

図において、電子部品の部品本体1の両、4i1部には
端子2.3がそれぞれ引き出され、各11A4子2.3
はNi−′ri合金、Cu−3n合金等の形状記憶合金
で形成され、その形状は予め実装形態に適合する形に設
定づ−る。、即も、この実施例では各端子2.3の部品
本体1からの引出し部分を一方向に直角に折り曲げ、そ
の先醋1部を対向する側に45°方向に折り曲げたもの
である。
In the figure, terminals 2.3 are pulled out from both sides and 4i1 parts of the electronic component main body 1, and each 11A4 terminal 2.3
is made of a shape memory alloy such as Ni-'ri alloy or Cu-3n alloy, and its shape is set in advance to suit the mounting form. That is, in this embodiment, the lead-out portion of each terminal 2.3 from the component body 1 is bent at right angles in one direction, and the tip portion thereof is bent at 45 degrees to the opposite side.

このような形状記憶合金で端子2.3を形成すれば、第
2図に示すように、配線基板4の挿入孔5.6に挿入す
る前、各端子2.3を直線上に伸はし、前記挿入孔5.
6に矢印A方向より挿入する。そして、各端子2.3に
温度処理を施すことにより、第3図に示すように、bi
’i’1子2.3の形状は第1図に示す原形状に復帰し
、配線基板4の背面部に配設された配線パターン7.8
にそれぞれの端子2.3を接触させて配線基板4に固定
することができる。このようにした後、半[■1処理を
ずれは、配線パターン7.8と端子2.3とを電気的に
接続することができる。
If the terminals 2.3 are formed of such a shape memory alloy, each terminal 2.3 can be stretched in a straight line before being inserted into the insertion hole 5.6 of the wiring board 4, as shown in FIG. , the insertion hole 5.
6 from the direction of arrow A. Then, by subjecting each terminal 2.3 to temperature treatment, as shown in FIG.
The shape of the 'i'1 child 2.3 returns to the original shape shown in FIG.
Each terminal 2.3 can be brought into contact with and fixed to the wiring board 4. After doing this, the wiring pattern 7.8 and the terminal 2.3 can be electrically connected after the half [■1 process].

このように電子部品の端子2.3を所望の配線形態に応
じた形状に成形加工しておけば、形状記憶合金の性質を
利用し、配線基板4へ挿入し易い形状にして挿入できる
ので、その作業が容易になるとともに、温度処理で各電
子部品を配線基板」−に固定することができ、電子部品
の脱落、領き或いは位置ずれ等を防止することができ、
配線作業の効率化と接続の信頼性の向上を図ることがで
きる。
If the terminals 2.3 of the electronic component are formed into a shape according to the desired wiring configuration in this way, they can be inserted into the wiring board 4 in a shape that is easy to insert by utilizing the properties of the shape memory alloy. In addition to making the work easier, each electronic component can be fixed to the wiring board by temperature treatment, and it is possible to prevent electronic components from falling off, being separated from each other, or being misaligned.
It is possible to improve the efficiency of wiring work and the reliability of connections.

第4図ないし第6図は、この発明を電解コンデンサに実
施したものである。第4図に示すよ・うに、電解コンデ
ンサ素子9を封入した外装ケース1゜は封口板11で封
止され、この封口Fi、11にはその内外面部を貫通さ
せたりヘット11でその外面ニr、7:l子13、I4
を固定するとともに、その内面部に電解コンデンサ素子
9がら引出された電極引出用タブ15、I6を固定し、
端子13.14と電極引出用タフ15.16とはりヘッ
ト11を介し゛ζ電気的に接続されている。また、各端
子13、I4は前記実施例と同様に形状記憶合金で形成
するとともに、その形状は前記実施例と同様に実装形態
に則してその先端部を対向する側にほば45゛力向に折
り曲げたものである。
4 to 6 show the present invention implemented in an electrolytic capacitor. As shown in FIG. 4, the exterior case 1° in which the electrolytic capacitor element 9 is enclosed is sealed with a sealing plate 11. , 7: l child 13, I4
At the same time, the electrode drawing tabs 15 and I6 drawn out from the electrolytic capacitor element 9 are fixed to the inner surface thereof,
The terminals 13, 14 and the electrode lead-out toughs 15, 16 are electrically connected via the beam head 11. In addition, each terminal 13, I4 is formed of a shape memory alloy as in the previous embodiment, and its shape is adapted to the mounting form, with its tip end pushed approximately 45° toward the opposite side. It is folded in the opposite direction.

このように構成すれば、第5図に示すように配線基板4
の挿入孔5.6に挿入するに際し、各端?−13、I4
の端部を直線状にし、この状態で矢Etl B方向から
挿入孔5.6に挿入するものとする。
With this configuration, the wiring board 4 as shown in FIG.
When inserting into the insertion hole 5.6, each end? -13, I4
It is assumed that the end of the holder is made straight, and in this state it is inserted into the insertion hole 5.6 from the direction of arrow EtlB.

このような挿入状態において、各端子13.14は数十
度ないし百数十度の温度処理を施すこと番こより、第6
図に示すように、配線パターン7.8の表面部に各端子
13.14を原形状に浚(17+さ・U、配線基板4上
に固定することができる。このような固定状態において
、半田処理を施せば、配線パターン7.8に前記端子1
3.14を電気的に接続することができ、電解コンデン
サの場合においても前記実施例と同様に位置ずれや脱落
等を防止でき、配線作業の効率化を図ることができる。
In such an inserted state, each terminal 13, 14 is subjected to temperature treatment at several tens of degrees to over a hundred degrees.
As shown in the figure, each terminal 13.14 can be fixed in its original shape on the surface of the wiring pattern 7.8 (17+S/U) on the wiring board 4.In such a fixed state, solder After processing, the wiring pattern 7.8 has the terminal 1
3.14 can be electrically connected, and even in the case of electrolytic capacitors, displacement and falling off can be prevented as in the above embodiment, and wiring work can be made more efficient.

以上、電解コンデンサの実施例について説明したが、こ
の発明はトランジスタ、IC(半導体集積回路)その他
、配線基板に自動挿入する等の各種の機構部品を含む電
子部品について実施できるものである。
Although the embodiments of electrolytic capacitors have been described above, the present invention can be applied to electronic parts including transistors, ICs (semiconductor integrated circuits), and various other mechanical parts that can be automatically inserted into wiring boards.

以上説明したようにこの発明によれば、電子部品の端子
を形状記憶合金で実装形態に則した形に形成したので、
配線基板への挿入は挿入に適する形状に変形させて行い
、挿入後、温度処理によっ−Cその形状を元にIM帰さ
せて固定することができ、従来のスナップイン端子等6
.二比較し、形状設定が容易で、半Ifl伺&Jの後に
り一1′カット等の面倒な作業を省略することができ、
配線作業の容易化、す)生死を図ることができる。
As explained above, according to the present invention, the terminals of electronic components are formed using a shape memory alloy in a shape that conforms to the mounting form.
Insertion into the wiring board is done by deforming it into a shape suitable for insertion, and after insertion, it can be fixed by returning the shape to its original shape by temperature treatment, making it possible to fix it using conventional snap-in terminals, etc.
.. Comparing the two, it is easy to set the shape, and it is possible to omit troublesome work such as half-ifl cutting & J-cutting.
Wiring work is made easier, and a) life and death can be determined.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の電子部品の実施例を示す側面図、第
2図及び第3図はその接続方法を示す説明図、第4図は
この発明の実施例である電解コンデンサを示す一部断面
図、第5図及び第6図はその接続方法を示す説明図であ
る。 1・・・部品本体、2.3.13.14・・・端子。 第1図 箪2図 第3図 第4図 第5図 (B 第6図
Fig. 1 is a side view showing an embodiment of the electronic component of this invention, Figs. 2 and 3 are explanatory diagrams showing its connection method, and Fig. 4 is a part showing an electrolytic capacitor which is an embodiment of this invention. The sectional view, FIGS. 5 and 6 are explanatory diagrams showing the connection method. 1... Part body, 2.3.13.14... Terminal. Fig. 1 Fig. 2 Fig. 3 Fig. 4 Fig. 5 (B Fig. 6

Claims (1)

【特許請求の範囲】[Claims] 配線基板に装着される端子を配線基板上の実装形態に適
合する形状に折曲加工するとともに、その一部又は全部
を形状記憶合金で形成し、この端子を配線基板に装着す
る際に挿入可能な形状に変 “形して挿入後、61に度
処理を施すことにより、原形状に復帰させ′(前記配線
基板に固定可能にしたことを特徴とする電子部品。
The terminal to be mounted on the wiring board is bent into a shape that matches the mounting form on the wiring board, and part or all of it is made of shape memory alloy, so that it can be inserted when mounting the terminal on the wiring board. The electronic component is characterized in that after it has been transformed into a desired shape and inserted, it is returned to its original shape by subjecting it to a degree treatment (61).
JP4382983A 1983-03-15 1983-03-15 Electronic part Pending JPS59168622A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4382983A JPS59168622A (en) 1983-03-15 1983-03-15 Electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4382983A JPS59168622A (en) 1983-03-15 1983-03-15 Electronic part

Publications (1)

Publication Number Publication Date
JPS59168622A true JPS59168622A (en) 1984-09-22

Family

ID=12674641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4382983A Pending JPS59168622A (en) 1983-03-15 1983-03-15 Electronic part

Country Status (1)

Country Link
JP (1) JPS59168622A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171331U (en) * 1983-04-30 1984-11-16 ニチコン株式会社 Electrolytic capacitor
JPS602881U (en) * 1983-06-20 1985-01-10 エスエムケイ株式会社 Parts for printed wiring boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171331U (en) * 1983-04-30 1984-11-16 ニチコン株式会社 Electrolytic capacitor
JPS602881U (en) * 1983-06-20 1985-01-10 エスエムケイ株式会社 Parts for printed wiring boards

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