JPH02139989A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH02139989A
JPH02139989A JP29328988A JP29328988A JPH02139989A JP H02139989 A JPH02139989 A JP H02139989A JP 29328988 A JP29328988 A JP 29328988A JP 29328988 A JP29328988 A JP 29328988A JP H02139989 A JPH02139989 A JP H02139989A
Authority
JP
Japan
Prior art keywords
lead wire
hole
printed wiring
wiring board
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29328988A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Nakayama
中山 義幸
Tetsuya Nitta
哲也 新田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP29328988A priority Critical patent/JPH02139989A/en
Publication of JPH02139989A publication Critical patent/JPH02139989A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads

Abstract

PURPOSE:To press a lead wire against a through-hole by its elasticity to obtain electrical continuity and eliminate necessity of temporary soldering by a method wherein the lead wire is bent after it is inserted into the through-hole and then inserted into another through-hole. CONSTITUTION:In order to provide temporary connection of an electronic component 2, after a lead wire 2a is inserted into a first through-hole 1a-1 first, the tip of the lead wire 2a is bent to form a U-shape toward a direction of an arrow A and inserted into a second through-hole 1a-2 and the lead wire 2a is lightly pulled up toward a direction of an arrow B. With this procedure, the lead wire 2a is laid across the through-holes 1a-1 and 1a-2 and, as if it sews the two through-holes 1a-1 and 1a-2, presses itself against both the through- holes by its elasticity to obtain electrical continuity. Therefore, test data can be obtained temporarily without temporary soldering of the lead wire. After a specification is determined, the lead wire is connected to the first through-hole by soldering permanently.

Description

【発明の詳細な説明】 〔概要〕 プリント配線板に係り、さらに詳しくは、リード線付き
電子部品を仮接続するスルホールを備えたプリント配線
板に関し、 リード線を半田付けすることなしに電子部品を仮接続す
ることを目的とし、 リード線付き電子部品のリード線を挿通する第1のスル
ホールと、挿通したリード線を折り返しばね性を有して
挿通する第2のスルホールとを備えるか、あるいは上記
第1.第2のスルホールを連接するように構成する。
[Detailed Description of the Invention] [Summary] This invention relates to a printed wiring board, and more specifically, to a printed wiring board equipped with through holes for temporarily connecting electronic components with lead wires, and which allows electronic components to be connected without soldering lead wires. For the purpose of temporary connection, it is provided with a first through hole through which a lead wire of an electronic component with a lead wire is inserted, and a second through hole through which the inserted lead wire is inserted with a folded back spring property, or the above-mentioned one is provided. 1st. The second through holes are configured to be connected.

〔産業上の利用分野〕[Industrial application field]

本発明はプリント配線板に係り、さらに詳しくは、リー
ド線付き電子部品を仮接続するスルホールを備えたプリ
ント配線板に関する。
The present invention relates to a printed wiring board, and more particularly to a printed wiring board provided with through holes for temporarily connecting electronic components with lead wires.

電子回路において、回路定数が確定していない場合、プ
リント配線板に実装される電子部品の中、例えばリード
線付きの固定抵抗器やコンデンサなどを実際の電子回路
に試験的に仮接続し、その抵抗や容量などの確定後、正
式に半田付は接続する方法が採られている。そのとき、
リード線付き電子部品を半田付けすることなしに仮接続
することのできるプリント配線板が要望されている。
In an electronic circuit, if the circuit constants have not been determined, some of the electronic components mounted on the printed wiring board, such as fixed resistors and capacitors with lead wires, can be temporarily connected to the actual electronic circuit on a trial basis. After determining the resistance, capacitance, etc., formal soldering is used to connect the parts. then,
There is a need for a printed wiring board that can temporarily connect electronic components with lead wires without soldering.

〔従来の技術〕[Conventional technology]

従来のプリント配線板は、固定抵抗器やコンデンサなど
のリード線付き電子部品(以下、電子部品と略記する)
を接続するスルホールを形成し、そのスルホールに電子
部品を試験的に仮半田付け(仮接続)したり、あるいは
仮接続回数が増えるとスルホールやその周辺の基板を熱
的に損傷する恐れがあるため、−旦、そのスルホールに
接続用端子を半田付け(本接Vt) した後、その接続
用端子に電子部品を試験的に仮半田付けするなどして回
路定数を決定している。その後、所定数値の電子部品を
スルホールあるいは接続用端子に正式に半田付は接続し
ている。
Conventional printed wiring boards contain electronic components with lead wires such as fixed resistors and capacitors (hereinafter abbreviated as electronic components).
If you form a through hole to connect the through hole and temporarily solder (temporary connect) electronic components to the through hole, or if the number of temporary connections increases, there is a risk of thermal damage to the through hole and the board around it. After soldering a connection terminal to the through hole (main connection Vt), circuit constants are determined by temporarily soldering an electronic component to the connection terminal on a trial basis. Thereafter, electronic components of a predetermined value are formally connected to the through holes or connection terminals by soldering.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、このような上記プリント配線板によれば
、仮接続に仮半田付けを要し、正式に半田付けする場合
、仮半田をきれいに除去しなければならないことから作
業性が悪く、また接続用端子の使用は経済性が悪いとい
った問題があった。
However, according to the above-mentioned printed wiring board, temporary soldering is required for temporary connection, and when performing formal soldering, workability is poor because the temporary solder must be removed cleanly. There was a problem in that the use of was not economical.

上記問題点に鑑み、本発明はリード線を半田付けするこ
となしに電子部品を仮接続することのできるプリント配
線板を提供することを目的とする。
In view of the above problems, an object of the present invention is to provide a printed wiring board to which electronic components can be temporarily connected without soldering lead wires.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するために、本発明のプリント配線板に
おいては、電子部品を容易に仮接続することを目的とし
、電子部品のリード線を挿通する第1のスルホールと、
挿通したリード線を折り返しばね性を有して挿通する第
2のスルホールとを備えるか、あるいは上記第1.第2
のスルホールを連接するように構成する。
In order to achieve the above object, the printed wiring board of the present invention has a first through-hole through which a lead wire of the electronic component is inserted, in order to easily temporarily connect the electronic component.
or a second through hole through which the inserted lead wire is inserted with a folded back spring property, or Second
The structure is such that the through-holes of the two are connected.

〔作用〕[Effect]

リード線をばね性を有して折り返しスルホールに挿通す
ることにより、リード線はスルホールと弾接し導通接続
することができ、仮半田付けの必要がなくなる。
By folding the lead wire with spring properties and inserting it through the through hole, the lead wire can come into elastic contact with the through hole and be electrically connected, eliminating the need for temporary soldering.

〔実施例〕〔Example〕

以下図面に示した実施例に基づいて本発明の要旨を詳細
に説明する。
The gist of the present invention will be explained in detail below based on embodiments shown in the drawings.

第1図はプリント配線板の要部平面図を、第2図は電子
部品の仮接続状態を示す側断面図である。
FIG. 1 is a plan view of the main parts of the printed wiring board, and FIG. 2 is a side sectional view showing a temporarily connected state of electronic components.

第1図に示すように、プリント配線板1は固定抵抗器や
コンデンサなどの電子部品2のリード線2aを挿通ずる
リード線2aの直径より僅かに大きい孔径を有する第1
のスルホール1a−1と、挿通したリード線2aを折り
返しばね性を有して挿通ずるリード線2aの直径より僅
かに大きい孔径を有する第2のスルホール1a−2を備
える。第1のスルホール1a−1と第2のスルホール1
a−2との間隔は配線効率を良くするため僅かに離す。
As shown in FIG. 1, a printed wiring board 1 has a first hole having a diameter slightly larger than the diameter of a lead wire 2a through which a lead wire 2a of an electronic component 2 such as a fixed resistor or a capacitor is inserted.
a through hole 1a-1, and a second through hole 1a-2 having a hole diameter slightly larger than the diameter of the lead wire 2a through which the inserted lead wire 2a is inserted with a folded back spring property. First through hole 1a-1 and second through hole 1
A-2 should be slightly spaced apart to improve wiring efficiency.

電子部品2の仮接続は、第2図の如くリード線2aを先
ず、第1のスルホール1a−1に挿通した後、さらにリ
ード線2aの先端を矢印A方向にU字形に折り曲げて第
2のスルホール1a−2に挿通し、リード線2aを上方
矢印B方向に軽く引き上げる。そうすると、リード&I
2aは第1.第2のスルホール1a−1,1a−2間に
跨がり、両スルホール1a−1,1a−2を縫う形でば
ね性を有して弾接し導通傍続することができる。したが
って、リード線を仮半田付けすることなく一時的に試験
データを採取することができる。仕様(抵抗あるいは容
量などの数値)が決定すれば、正式に第1のスルホール
にリード線を半田付は接続する。
To temporarily connect the electronic component 2, first insert the lead wire 2a into the first through hole 1a-1 as shown in Fig. 2, then bend the tip of the lead wire 2a into a U-shape in the direction of arrow A, and insert the second through hole 1a-1. Insert the lead wire 2a into the through hole 1a-2 and lightly pull up the lead wire 2a in the upward direction of arrow B. Then, Reed & I
2a is the first. It straddles between the second through holes 1a-1 and 1a-2, and has a spring property in a manner that stitches both the through holes 1a-1 and 1a-2, so that they can be elastically contacted and electrically connected. Therefore, test data can be temporarily collected without temporarily soldering the lead wires. Once the specifications (numbers of resistance or capacitance, etc.) are determined, the lead wires are formally connected to the first through-hole by soldering.

第3図は他の実施例のプリント配線板の要部平面図を示
す。図示するように、プリント配線板1゜は第1.第2
のスルホール1a−1’、1a−2”を連接しひょうた
ん形のスルホールを備える。そのため、スペースをとら
ず上記実施例より更に配線効率がよくなる。電子部品2
の仮接続は第4図の側断面図に示すように、リード線2
aを第1のスルホール1a−1に挿通した後、リード線
2aを矢印C方向にV字形に折り曲げ第2のスルホール
に挿通する。リード線2aを上方矢印り方向に軽く引き
上げるだけでくびれ部が折曲部の内側に食い込みV字形
を押し広げるため、リード線2aは両スルホール1a−
1’ 。
FIG. 3 shows a plan view of essential parts of a printed wiring board according to another embodiment. As shown in the figure, the printed wiring board 1° is located at the first. Second
A gourd-shaped through hole is provided by connecting the through holes 1a-1' and 1a-2''.Therefore, it does not take up much space and the wiring efficiency is even better than in the above embodiment.Electronic component 2
As shown in the side sectional view of Fig. 4, the temporary connection is made by connecting the lead wire 2.
After inserting the lead wire 2a into the first through hole 1a-1, the lead wire 2a is bent into a V shape in the direction of arrow C and inserted into the second through hole. By simply pulling the lead wire 2a upward in the direction of the arrow, the constriction bites into the inside of the bent part and expands the V-shape.
1'.

1a−2°と圧接し、より確実な導通を得ることができ
る。
1a-2°, and more reliable conduction can be obtained.

このように、プリント配線板にリード線を挿通する第1
.第2のスルホールを設けることにより、リード線を第
1のスルホールに挿通した後、U字あるいは7字形に折
り返し、更に第2のスルホールに挿通しリード線を引き
上げることにより、仮半田付けすることなしに導通接続
することができ、従来の接続用端子は必要がなくなる。
In this way, the first
.. By providing a second through hole, after inserting the lead wire into the first through hole, fold it back into a U-shape or 7-shape, and then insert it into the second through hole and pull up the lead wire, eliminating the need for temporary soldering. can be electrically connected to the terminal, eliminating the need for conventional connection terminals.

〔発明の効果〕〔Effect of the invention〕

以上、詳述したように本発明によれば、リード線を仮半
田付けすることなしに電子部品を仮接続することができ
て作業性をよくするとともに、接続用端子が不要となる
ため経済性もよくなるといった産業上極めて有用な効果
を発揮する。
As detailed above, according to the present invention, it is possible to temporarily connect electronic components without temporarily soldering the lead wires, improving work efficiency, and eliminating the need for connection terminals, which is economical. It exhibits extremely useful effects in industry, such as improving the

を示す側断面図、 第3図は本発明による他の実施例のプリント配線板の要
部平面図、 第4図は第3図を用いた電子部品の仮接続状態を示す側
断面図である。
3 is a plan view of essential parts of a printed wiring board according to another embodiment of the present invention, and FIG. 4 is a side sectional view showing a temporary connection state of electronic components using FIG. 3. .

図において、 1はプリント配線板、 1a−1,1a−2は第1.第2のスルホール、1a−
1’ 、 1a−2’は第1.第2のスルホール、2は
電子部品(リード線付き)、 2aはリード線を示す。
In the figure, 1 is a printed wiring board, 1a-1 and 1a-2 are 1st. Second throughhole, 1a-
1', 1a-2' is the first. The second through hole, 2 is an electronic component (with a lead wire), and 2a is a lead wire.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による一実施例のプリント配線板の要部
平面図、 第2図は第1図を用いた電子部品の仮接続状態第  Z
  図
FIG. 1 is a plan view of essential parts of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a temporary connection state of electronic components using FIG. 1.
figure

Claims (1)

【特許請求の範囲】 〔1〕リード線付き電子部品(2)のリード線(2a)
を挿通する第1のスルホール(1a−1)と、挿通した
リード線(2a)を折り返しばね性を有して挿通する第
2のスルホール(1a−2)とを備えることを特徴とす
るプリント配線板。 〔2〕上記第1,第2のスルホール(1a−1,1a−
2)を連接したことを特徴とする請求項1記載のプリン
ト配線板。
[Claims] [1] Lead wire (2a) of electronic component with lead wire (2)
A printed wiring characterized by comprising a first through hole (1a-1) through which the lead wire (2a) is inserted, and a second through hole (1a-2) through which the inserted lead wire (2a) is inserted with a folded back spring property. Board. [2] The first and second throughholes (1a-1, 1a-
2) The printed wiring board according to claim 1, wherein the printed wiring board is connected to the printed wiring board.
JP29328988A 1988-11-18 1988-11-18 Printed wiring board Pending JPH02139989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29328988A JPH02139989A (en) 1988-11-18 1988-11-18 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29328988A JPH02139989A (en) 1988-11-18 1988-11-18 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH02139989A true JPH02139989A (en) 1990-05-29

Family

ID=17792908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29328988A Pending JPH02139989A (en) 1988-11-18 1988-11-18 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH02139989A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003020696A (en) * 2001-07-05 2003-01-24 Shinichiro Hayashi Water storage device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003020696A (en) * 2001-07-05 2003-01-24 Shinichiro Hayashi Water storage device

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