JPS5842218A - Electronic part - Google Patents

Electronic part

Info

Publication number
JPS5842218A
JPS5842218A JP56140618A JP14061881A JPS5842218A JP S5842218 A JPS5842218 A JP S5842218A JP 56140618 A JP56140618 A JP 56140618A JP 14061881 A JP14061881 A JP 14061881A JP S5842218 A JPS5842218 A JP S5842218A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
hole
shape
electrode terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56140618A
Other languages
Japanese (ja)
Other versions
JPS6236371B2 (en
Inventor
梶原 康也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56140618A priority Critical patent/JPS5842218A/en
Publication of JPS5842218A publication Critical patent/JPS5842218A/en
Publication of JPS6236371B2 publication Critical patent/JPS6236371B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Details Of Resistors (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は電子部品、特にその電極端子の構成に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to electronic components, and particularly to the configuration of electrode terminals thereof.

電子回路の組み立てには、予め所要の導体パターンが表
面に形成された、いわゆる印刷配線基板に抵抗器、コン
デンサ、牛導体素子、コネクタなどの各種電子部品の電
極端子を挿入すべき孔をあけておき、この孔にそれぞれ
所要の電子部品の電極端子を挿入し、上記導体パターン
に接続する方式が極めて広く用いられている。
To assemble an electronic circuit, holes are drilled into a so-called printed circuit board, which has the required conductor pattern formed on its surface in advance, into which electrode terminals for various electronic components such as resistors, capacitors, conductive elements, and connectors are inserted. A method is extremely widely used in which electrode terminals of required electronic components are inserted into the holes and connected to the conductor patterns.

第・−1図は従来の方式によって印刷配線基板に電子部
品を装着した状態を示し、第1図ムはその平爾図、#!
1図BFiaTM図である。図において、(1)は印刷
配線基板、(2)はその表面に形成された導体パターン
、(3)はこの導体パターン(2)の上から印刷配線基
板(1)を貫通して形成された孔、(4)は電子部品、
(5)は電子部品(4)の電極端子で、それぞれ孔(3
)に挿入され、半田(6)で固定されている。電極端子
(6)は孔(3)K挿入後必要があれば曲げた後、半田
(6)で固定される。
Figure 1 shows a state in which electronic components are mounted on a printed wiring board using the conventional method.
Figure 1 is a BFiaTM diagram. In the figure, (1) is a printed wiring board, (2) is a conductive pattern formed on its surface, and (3) is a printed wiring board (1) formed from above this conductive pattern (2). hole, (4) is an electronic component,
(5) are the electrode terminals of the electronic component (4), each with a hole (3
) and fixed with solder (6). After the electrode terminal (6) is inserted into the hole (3) K, it is bent if necessary and then fixed with solder (6).

ところが、このような従来の方式では、半田付は工程が
厄介であり、しかも、半田の流れが悪い場合には電気的
、機械的な接触不良を生じ、電子回路の信頼性を低下さ
せるおそれがあった0この発明は以上のような点に鑑み
てなされたもので、印刷配線基板への装着が容易で、し
かも確実な接触が得られるような電極端子構造の電子部
凸金提供する仁とを目的としている。
However, with these conventional methods, soldering is a cumbersome process, and if the solder does not flow properly, it may cause electrical or mechanical contact failures and reduce the reliability of electronic circuits. This invention has been made in view of the above-mentioned points, and is directed by the Company and the Company to provide an electronic part protrusion with an electrode terminal structure that is easy to attach to a printed wiring board and also provides reliable contact. It is an object.

餓2図ムおよびBはそれぞれこの発明の第1および第2
の実施例を示す斜視図で、(5a)はこの発明の要点で
ある形状記憶合金を用いた電極端子である。形状記憶合
金とは、例えばチタン(TI) −=ツケル(Ni)合
金、銅(Ou)−アルミニウム(ム/)−亜鉛(Zn)
合金などの組成を有し、所要の形状に形成しておくと、
これを低温でマルテンサイト状態にした段階で塑性変形
を加え、しかる後に温度を上昇させると、結晶状態が元
の状態にもとシ、形状も塑性変形前の形状にもどる性質
をもっている。
Figure 2 and B are the first and second figures of this invention, respectively.
FIG. 5 is a perspective view showing an embodiment of the present invention, and (5a) is an electrode terminal using a shape memory alloy, which is the main point of the present invention. Shape memory alloys include, for example, titanium (TI) - Tsukel (Ni) alloy, copper (Ou) - aluminum (mu/) - zinc (Zn).
If it has a composition such as an alloy and is formed into the desired shape,
When plastic deformation is applied to this material at a stage where it becomes a martensitic state at a low temperature, and the temperature is then raised, the crystal state returns to its original state and the shape returns to the shape before plastic deformation.

従って、図示実施例のように、電子部品(4)の電極端
子(5a)を形状記憶合金で構成し、その常1K(高温
相)での形状を第3図に示すように印刷配線基板fi+
の孔(3)に挿入した状態で、孔(3)から抜けず、し
かも孔(3)の外囲部で印刷配線基板(11を締めつけ
るような形状にしておく。
Therefore, as in the illustrated embodiment, the electrode terminal (5a) of the electronic component (4) is made of a shape memory alloy, and its shape at 1K (high temperature phase) is as shown in FIG.
The printed wiring board (11) is shaped so that it does not come out of the hole (3) when inserted into the hole (3), and the printed wiring board (11) is tightened by the outer circumference of the hole (3).

このような電子部品(4)を印刷配線基板+11に装着
するには、すべての電子部品(4)を低温にして、その
電極端子(5a) ’eフマルンサイト状態にし、この
状態で、各電子部品(4)の電極端子(5a)を所要の
孔(3)へ挿入する。このと色は、各電極端子(5a)
は容易に塑性変形を受けて手作業または自動機械で孔(
s)へ容易に挿入できる。すべての電極端子(5a)を
挿入後、温度を上昇させ常温に戻すと形状記憶合金の結
晶状態は元にもどり、電極端子(5a)の形状ももとの
形状に復し、#I3図に示したように、印刷配線基板(
1)K電気的、機械的接触が確実な状態で固定される。
In order to mount such electronic components (4) on the printed wiring board +11, all electronic components (4) are brought to a low temperature and their electrode terminals (5a) are placed in a fumarunsite state, and in this state, each Insert the electrode terminal (5a) of the electronic component (4) into the required hole (3). This color is for each electrode terminal (5a)
easily undergo plastic deformation and are manually or automatically machined (
can be easily inserted into s). After inserting all the electrode terminals (5a), when the temperature is raised and returned to room temperature, the crystalline state of the shape memory alloy returns to its original state, and the shape of the electrode terminals (5a) returns to its original shape, as shown in Figure #I3. As shown, printed wiring board (
1) Electrical and mechanical contact is securely fixed.

もし、温度1昇が不十分で、電極端子(5a)の固定が
十分でない場合’Irあっても、電流を流すことによっ
て、接触の悪い電極端子部分で発熱し、形状の復帰が促
進され電気的、機械的接触は良好となる〇 なお、電極端子の形状は上記実施例に限らず、必!!に
応じて任意に選べることは言うまでもない。
If the temperature increase by 1 is insufficient and the electrode terminal (5a) is not fixed enough, even if there is Ir, by passing current, heat will be generated in the electrode terminal part with poor contact, promoting the recovery of the shape, and the electric current will be removed. 〇The shape of the electrode terminal is not limited to the above example, but is required! ! Needless to say, it can be selected arbitrarily depending on the situation.

以上説明したように、この発明になる電子部品では電極
端子に形状記憶合金を用いたので、電子回路の組立ての
ための印刷配線基板への装着は、像温下における挿入の
みでよく、半田づけ工程を必要とせず極めて容易であり
、しかも常温に復帰後は十分な電気的、機械的接触が確
保され、組立ての信頼性が向上する。
As explained above, since the electronic component according to the present invention uses a shape memory alloy for the electrode terminal, mounting on the printed wiring board for assembling the electronic circuit only requires insertion under image temperature, and soldering is required. It is extremely easy and does not require any steps, and after returning to room temperature, sufficient electrical and mechanical contact is ensured, improving assembly reliability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の方式によって印刷配線基板に電子部品を
装着した状態を示し、第1図人けその平面図、第1図B
は側面図であるo@2図AおよびBはそれぞれこの発明
の第1および第2の実施例金示す斜視図、第3図はこれ
らの実施例の印刷配線基板への装着状態を示す側面図で
ある。 図において、(1)は印刷配線基板、(3)は孔、(4
)は電子部品、(5a)ij電極端子である。 なお、図中、同一符号は同一または相当部分を示す。 代理人  葛 野 信 −(外1名) 第1図 第2図 第3v4
Figure 1 shows a state in which electronic components are mounted on a printed wiring board using the conventional method.
Figures A and B are perspective views showing the first and second embodiments of the invention, respectively, and Figure 3 is a side view showing how these embodiments are mounted on a printed wiring board. It is. In the figure, (1) is a printed wiring board, (3) is a hole, and (4) is a printed wiring board.
) is an electronic component, and (5a) is an ij electrode terminal. In addition, in the figures, the same reference numerals indicate the same or corresponding parts. Agent Shin Kuzuno - (1 other person) Figure 1 Figure 2 Figure 3v4

Claims (1)

【特許請求の範囲】[Claims] (1)形状記憶合金で構成され、常温(高温和)ではそ
れが挿入された孔の外囲部で印刷配線基板を締めつける
形状をなし、かつ低温マルテンサイト状態では上記印刷
配線基板の上記孔に容易に挿入できるような電極端子を
備えたことをtf!j−とする電子部品。
(1) It is composed of a shape memory alloy, and at room temperature (high temperature), it has a shape that tightens the printed wiring board with the outer circumference of the hole into which it is inserted, and in a low-temperature martensitic state, it tightens around the hole of the printed wiring board. tf! Equipped with electrode terminals that can be easily inserted! j-electronic components.
JP56140618A 1981-09-07 1981-09-07 Electronic part Granted JPS5842218A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56140618A JPS5842218A (en) 1981-09-07 1981-09-07 Electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56140618A JPS5842218A (en) 1981-09-07 1981-09-07 Electronic part

Publications (2)

Publication Number Publication Date
JPS5842218A true JPS5842218A (en) 1983-03-11
JPS6236371B2 JPS6236371B2 (en) 1987-08-06

Family

ID=15272891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56140618A Granted JPS5842218A (en) 1981-09-07 1981-09-07 Electronic part

Country Status (1)

Country Link
JP (1) JPS5842218A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945921U (en) * 1982-09-20 1984-03-27 松下電器産業株式会社 electronic components
JPS59171331U (en) * 1983-04-30 1984-11-16 ニチコン株式会社 Electrolytic capacitor
JPS59218757A (en) * 1983-05-27 1984-12-10 Hitachi Ltd Electronic component
JPS602881U (en) * 1983-06-20 1985-01-10 エスエムケイ株式会社 Parts for printed wiring boards
JPS6133474U (en) * 1984-07-30 1986-02-28 山一電機工業株式会社 Fixing mechanism for parts mounted on printed wiring boards
JPS6346874U (en) * 1986-09-11 1988-03-30

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945921U (en) * 1982-09-20 1984-03-27 松下電器産業株式会社 electronic components
JPS59171331U (en) * 1983-04-30 1984-11-16 ニチコン株式会社 Electrolytic capacitor
JPS59218757A (en) * 1983-05-27 1984-12-10 Hitachi Ltd Electronic component
JPS602881U (en) * 1983-06-20 1985-01-10 エスエムケイ株式会社 Parts for printed wiring boards
JPS6133474U (en) * 1984-07-30 1986-02-28 山一電機工業株式会社 Fixing mechanism for parts mounted on printed wiring boards
JPS6346874U (en) * 1986-09-11 1988-03-30

Also Published As

Publication number Publication date
JPS6236371B2 (en) 1987-08-06

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