JPS60110877A - 化学メツキ用組成物及び該組成物を使用する化学めつき方法 - Google Patents

化学メツキ用組成物及び該組成物を使用する化学めつき方法

Info

Publication number
JPS60110877A
JPS60110877A JP58218370A JP21837083A JPS60110877A JP S60110877 A JPS60110877 A JP S60110877A JP 58218370 A JP58218370 A JP 58218370A JP 21837083 A JP21837083 A JP 21837083A JP S60110877 A JPS60110877 A JP S60110877A
Authority
JP
Japan
Prior art keywords
resin
composition
acid
powder
chemical plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58218370A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0247544B2 (cg-RX-API-DMAC7.html
Inventor
Noriyuki Konaga
小永 宣之
Yasunori Zairi
在里 康則
Masatoshi Wada
正敏 和田
Yukikazu Moritsu
森津 幸和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Original Assignee
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OKUNO SEIYAKU KOGYO KK, Okuno Chemical Industries Co Ltd filed Critical OKUNO SEIYAKU KOGYO KK
Priority to JP58218370A priority Critical patent/JPS60110877A/ja
Publication of JPS60110877A publication Critical patent/JPS60110877A/ja
Publication of JPH0247544B2 publication Critical patent/JPH0247544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58218370A 1983-11-18 1983-11-18 化学メツキ用組成物及び該組成物を使用する化学めつき方法 Granted JPS60110877A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58218370A JPS60110877A (ja) 1983-11-18 1983-11-18 化学メツキ用組成物及び該組成物を使用する化学めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58218370A JPS60110877A (ja) 1983-11-18 1983-11-18 化学メツキ用組成物及び該組成物を使用する化学めつき方法

Publications (2)

Publication Number Publication Date
JPS60110877A true JPS60110877A (ja) 1985-06-17
JPH0247544B2 JPH0247544B2 (cg-RX-API-DMAC7.html) 1990-10-22

Family

ID=16718827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58218370A Granted JPS60110877A (ja) 1983-11-18 1983-11-18 化学メツキ用組成物及び該組成物を使用する化学めつき方法

Country Status (1)

Country Link
JP (1) JPS60110877A (cg-RX-API-DMAC7.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232488A (ja) * 1987-03-20 1988-09-28 株式会社日立製作所 回路板の製造方法
WO2005073431A1 (ja) * 2004-01-29 2005-08-11 Nippon Mining & Metals Co., Ltd. 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物
JP2008297386A (ja) * 2007-05-30 2008-12-11 Fujifilm Corp インク組成物、導電性膜及び導電性膜の製造方法
WO2011158783A1 (ja) * 2010-06-16 2011-12-22 ソニーケミカル&インフォメーションデバイス株式会社 導電粒子、その製造方法及び異方性導電接着剤
JP2013053329A (ja) * 2011-09-02 2013-03-21 Osaka Municipal Technical Research Institute 無電解めっきの前処理皮膜形成用組成物
JP2013526081A (ja) * 2010-05-04 2013-06-20 ユニ−ピクセル・ディスプレイズ・インコーポレーテッド 導電性パターンを伴う微細構造表面の製作方法
WO2016035896A1 (ja) * 2014-09-05 2016-03-10 日産化学工業株式会社 光硬化性無電解めっき下地剤

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1676937B1 (en) * 2004-11-26 2016-06-01 Rohm and Haas Electronic Materials, L.L.C. UV curable catalyst compositions

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5771997A (en) * 1980-10-21 1982-05-06 Nihon Shiirudo Engineering Kk Installation of stretching flexible pipe conduit underground

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5771997A (en) * 1980-10-21 1982-05-06 Nihon Shiirudo Engineering Kk Installation of stretching flexible pipe conduit underground

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232488A (ja) * 1987-03-20 1988-09-28 株式会社日立製作所 回路板の製造方法
WO2005073431A1 (ja) * 2004-01-29 2005-08-11 Nippon Mining & Metals Co., Ltd. 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物
JPWO2005073431A1 (ja) * 2004-01-29 2008-04-24 日鉱金属株式会社 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物
US7713340B2 (en) 2004-01-29 2010-05-11 Nippon Mining & Metals Co., Ltd. Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
JP4711415B2 (ja) * 2004-01-29 2011-06-29 Jx日鉱日石金属株式会社 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物
JP2008297386A (ja) * 2007-05-30 2008-12-11 Fujifilm Corp インク組成物、導電性膜及び導電性膜の製造方法
JP2013526081A (ja) * 2010-05-04 2013-06-20 ユニ−ピクセル・ディスプレイズ・インコーポレーテッド 導電性パターンを伴う微細構造表面の製作方法
WO2011158783A1 (ja) * 2010-06-16 2011-12-22 ソニーケミカル&インフォメーションデバイス株式会社 導電粒子、その製造方法及び異方性導電接着剤
JP2013053329A (ja) * 2011-09-02 2013-03-21 Osaka Municipal Technical Research Institute 無電解めっきの前処理皮膜形成用組成物
WO2016035896A1 (ja) * 2014-09-05 2016-03-10 日産化学工業株式会社 光硬化性無電解めっき下地剤

Also Published As

Publication number Publication date
JPH0247544B2 (cg-RX-API-DMAC7.html) 1990-10-22

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