JPS60110189A - Printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention provides an exterior that integrates a 24-conductor pattern and an exterior case in order to save space in small equipment such as S micro cassette audio equipment and calculators. This invention relates to a printed wiring board that can also serve as a case.

Conventional Structure and Problems In general, printed wiring boards are constructed by forming a conductive two-body pattern on an insulating substrate, leaving a land for soldering on the surface of the conductor pattern, and forming a soldering resistance layer on the entire surface. It is configured. However, recently, in order to save space in small equipment, metal-based copper clad plates that can be folded, bent, and drawn are used, such as aluminum-based copper clad plates (0.5 mm thick), and only copper foil is used. VC9 tends to be used as a printed wiring board that also serves as an exterior case by etching it to form a conductive pattern, bending it with a mold, drawing it, and other shapes.

However, when shape processing such as bending or drawing is performed, the conductor pattern in the shape processing portion is disconnected, resulting in a defective product. This is because the shape processing VC causes a conductor such as copper to crack due to compression and expansion.

Therefore, in the past, a conductive five-body pattern was not formed on the shaped portion. FIG. 1 shows a conventional example.

1 is an aluminum plate, 2 is an insulating layer, 3 is a conductor pattern made of copper, and 4 is a soldering resistance layer called a solder resist. , there were problems such as increasing the size.

OBJECTS OF THE INVENTION It is an object of the present invention to eliminate the above-mentioned conventional drawbacks, and to provide a printed wiring board that enables the formation of conductor patterns on shaped portions and that can be miniaturized.

Structure of the Invention In order to achieve this object, the printed wiring board of the present invention has the following features:
A conductor pattern is formed on a metal base copper clad plate that has been bent and drawn, and a solder resistance layer is formed on the entire surface of the conductor pattern, leaving a chip mount part and a bent and drawn part. , in which a solder layer is formed on the IX Il['i body pattern on which no soldering resistance layer is formed.

With this configuration, 14 electric conductor patterns such as copper are compressed by the shape processing part! Even if cracking occurs due to stretching, the conductor pattern can be prevented from breaking by reinforcing the folded and drawn portion with solder.

DESCRIPTION OF EMBODIMENTS The present invention will be explained below with reference to FIGS. 2 to 6 of the drawings of one embodiment.

As shown in the second figure, 6 is a base metal plate made of aluminum, and this base metal plate 6 has been subjected to shape processing such as bending and drawing.

An insulating layer 6 made of a resin layer or aluminum oxide is formed on one side of the base metal plate 6, and a conductive pattern 7 formed by etching copper foil is formed on this insulating layer 6. The conductor pattern 7 is formed so as to extend over the shape-processed portion 51L, such as bending or drawing.

A soldering resistive layer 8 is formed on the entire surface of the conductor pattern 7 except for the portion corresponding to the shaped portion 8a and the chip land portion, and a soldering layer 9 is formed on the portion where the soldering resistive layer 8 is not formed. ing.

Next, we will discuss the method for manufacturing a printed wiring board with this configuration in the third section.
This will be explained using FIGS. 5 and 2.

FIG. 3 shows an aluminum-based copper-clad board 11 constructed by providing an insulating layer 6 on a metal plate 5 made of aluminum and pasting a copper foil 10 thereon. In FIG. 4, a conductor pattern 7 made of copper is formed by etching or the like on an aluminum base copper clad plate 11. After that, as shown in FIG. 5, the chip land portion 12 and the folded
A soldering resistor layer 8 called a resistor resist is formed on the entire surface except for the constricted portion. FIG. 6 shows a product that has been subjected to shape processing such as bending and drawing using a mold or the like.

Thereafter, as shown in FIG. 2, the wire is immersed in a molten solder bath or a jet solder bath, and the conductor pattern 7 at the bent and drawn portions is reinforced with a solder layer 9 to prevent wire breakage.

Effects of the Invention As described above, since the printed wiring board of the present invention is made of 41J5, no matter how the shape of the metal-based copper clad board is processed, the electrocardiogram pattern that straddles the shape-processed portion will be damaged by the solder layer. reinforcement, there is no disconnection phenomenon, the production yield is improved, and it is advantageous in terms of productivity and cost.
Moreover, since there are no restrictions on the formation range of the electrocardiogram pattern, it can be miniaturized and has great industrial value.

[Brief explanation of drawings]

Fig. 1 is a sectional view of main parts showing the state of use of a conventional printed wiring board, and Fig. 2 is a sectional view of the main parts of the printed wiring board of the present invention. layer,
7...conductor pattern, 8...--mid"
Attached resistance layer, 9...Solder layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 6

Claims (1)

[Claims] A conductor pattern is formed on a metal machine base copper clad plate that has been bent and drawn, and a resistor layer is soldered to the entire surface, leaving a chip mount part and a bent and drawn part on the surface where the conductor pattern is formed. A printed wiring board in which a solder layer is formed on a conductor pattern on which a solder resistance layer is not formed.