JPS60109238A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS60109238A
JPS60109238A JP58216327A JP21632783A JPS60109238A JP S60109238 A JPS60109238 A JP S60109238A JP 58216327 A JP58216327 A JP 58216327A JP 21632783 A JP21632783 A JP 21632783A JP S60109238 A JPS60109238 A JP S60109238A
Authority
JP
Japan
Prior art keywords
spool
wire
end plate
bonding
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58216327A
Other languages
Japanese (ja)
Inventor
Isamu Hirahara
平原 勇
Michiaki Furukawa
古川 道明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP58216327A priority Critical patent/JPS60109238A/en
Publication of JPS60109238A publication Critical patent/JPS60109238A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/786Means for supplying the connector to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To block disconnections due to the hang-up of a linear object by a method wherein at least one of the end plates of a spool is provided with a hang-up preventing means. CONSTITUTION:The spool has a cylindrical wire-wound part 1 for wire winding and end plates 2a and 2b formed at both ends in the axial direction. At the plate 2a on the side of placing on a spool mount 3 of the end plates of this spool, a guide 4 having a section shape of circular tray form is fitted in contact. Therefore, the spool is placed on the spool mount via guide with the plate 2a downward. Besides, circumferential wall 4a in the outer periphery of the guide projects out to the outer peripheral side of the plate slightly upward from the top of the plate. Accordingly, even when the wire around the wire-wound part sags e.g. in shifting from the first bonding point to the second bonding point, wire cuts due to its hang-up between the plate and the spool mount are eliminated.

Description

【発明の詳細な説明】 [技術分野] 本発明はボンディング技術、特に、ワイヤボンディング
用のワイヤを巻くためのスプールに通用して効果のある
技術に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to bonding technology, and in particular to a technology that is applicable and effective for spools for winding wire for wire bonding.

[背景技術] I 半導体装置の製造過程においてペレットのポンディング
パッドと外部導出用の導電部とを電気的に接続するため
に金(Au)またはアルミニウム(AI)等で作られた
ボンディングワイヤを用いる場合がある。
[Background Art] I In the manufacturing process of semiconductor devices, bonding wires made of gold (Au), aluminum (AI), etc. are used to electrically connect the bonding pads of pellets and conductive parts for external lead-out. There are cases.

この場合、ボンディングワイヤはスプールに巻かれたも
のを必要量ずつ巻き出して使用することが行われる(特
開昭50−131765号公報)。
In this case, the bonding wire is wound onto a spool and then unwound in the required amount for use (Japanese Patent Laid-Open No. 131765/1983).

この巻き出し、すなわちワイヤ供給の方式としては、ス
プール置場に設けた中空のワイヤスプールおよびがラス
管のガイドの孔を通ってワイヤを引っ張ることによりワ
イヤの供給を行う方式と、ワイヤスプール自体をモータ
で回転させてワイヤの供給を行う方式とが考えられる。
This unwinding, or wire feeding, method is divided into two methods: a method in which the wire is supplied by pulling the wire through a hollow wire spool installed in a spool storage area and a hole in the guide of the lath tube; One possible method is to feed the wire by rotating the wire.

ところが、これらの方式において、ワイヤスプールとス
プール置場等との間には隙間があり、ワイヤがたるむ際
にその隙間にワイヤが引っ掛かるため、第1ボンドから
第2ボン′ドに移る際に第1ボンドのネック部等でワイ
ヤ切れを生じてしまうという問題があることを本発明者
は見い出した。
However, in these methods, there is a gap between the wire spool and the spool storage area, and when the wire slackens, the wire gets caught in that gap. The inventor has discovered that there is a problem in that the wire breaks at the neck of the bond.

[発明の目的] 本発明の目的は、スプールに巻かれたワイヤ等の線状物
が供給時等に引っ掛かりを生じて切れることを防止でき
る技術を提供することにある。
[Object of the Invention] An object of the present invention is to provide a technique that can prevent a linear object such as a wire wound around a spool from being caught and cut during feeding.

本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[発明の概要] 本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。
[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

すなわち、スプールの端板部の少なくとも一方に引っ掛
かり防止手段を設けることにより、線状物の引っ掛かり
に起因する断線を阻止するものである。
That is, by providing a snag prevention means on at least one of the end plate portions of the spool, wire breakage due to the wire object being snagged is prevented.

[実施例1] 第1図は本発明にょるボンディング装置におけるスプー
ルの一実施例を一部断面図で示す側面図であ菖。
[Embodiment 1] FIG. 1 is a side view, partially in cross section, of an embodiment of a spool in a bonding apparatus according to the present invention.

この実施例において、ス、プールはたとえばワイヤボン
ディングに用いるワイヤを巻き取ったり巻き出しく繰り
出し)たりするものである。
In this embodiment, the spool is used, for example, to wind up or unwind a wire used for wire bonding.

このスプールは、ワイヤを巻回するための円筒状のワイ
ヤ巻回部1と、その軸方向両端に形成された端板部2a
、2bとを有している。
This spool includes a cylindrical wire winding part 1 for winding a wire, and end plate parts 2a formed at both axial ends of the cylindrical wire winding part 1.
, 2b.

このスプールの端板部のうち、スプール置場3の上に置
かれる側の端板部2aには、円形の皿状断面形状を持つ
ガイド4が密着状態で嵌装されている。したがって、ス
プールは端板部2aを下側にしてガイド4を介してスプ
ール置場3の上に載置されている。そして、ガイド4の
外周部の周壁部4aは端板部2aの外周側に端板部2a
の上面よりも僅かに上方に突出している。
Of the end plate portions of the spool, a guide 4 having a circular dish-shaped cross section is fitted tightly into the end plate portion 2a on the side placed on the spool storage space 3. Therefore, the spool is placed on the spool storage space 3 via the guide 4 with the end plate portion 2a facing downward. The peripheral wall 4a on the outer periphery of the guide 4 is attached to the end plate 2a on the outer periphery side of the end plate 2a.
It protrudes slightly above the top surface.

したがって、本実施例においては、たとえば第1ボンデ
ィング点から第2ボンディング点に移る際にワイヤ巻回
部に巻かれたワイヤがたるみを生じたような場合にも、
ワ4イヤが端板部2aとスプール置場3との間の隙間に
引っ掛かってワイヤ切れを起こすようなことはなくなる
Therefore, in this embodiment, even if the wire wound around the wire winding part becomes slack when moving from the first bonding point to the second bonding point, for example,
There is no possibility that the wire gets caught in the gap between the end plate part 2a and the spool storage place 3 and breaks the wire.

[実施例2] 第2図は本発明の他の実施例であるボンディング装置に
おけるスプールを示す側面図である。
[Embodiment 2] FIG. 2 is a side view showing a spool in a bonding apparatus according to another embodiment of the present invention.

この実施例では、スプール置場の上に載置される側の端
板部2aの外周部が反対側の端板部2bよりも同図にL
lで示す寸法だけ大きい直径に作られている。
In this embodiment, the outer periphery of the end plate portion 2a placed on the spool storage area is located at a lower angle in the figure than the end plate portion 2b on the opposite side.
It is made to have a larger diameter by the dimension indicated by l.

したがって、本実施例でも、端板部2aが外周方向に寸
法L1だけ張り出していることにより、ワイヤ巻回部l
に巻いたワイヤがたるみを生じても端板部2aとスプー
ル置場3との間の隙間に引っ掛かることがなく、ワイヤ
切れを防止できる。
Therefore, in this embodiment as well, since the end plate portion 2a protrudes in the outer circumferential direction by the dimension L1, the wire winding portion l
Even if the wound wire becomes slack, it will not get caught in the gap between the end plate part 2a and the spool storage place 3, and breakage of the wire can be prevented.

[実施例3] 第3図は本発明の他の実施例であるボンディング装置に
おけるスプールを示す正面図である。
[Embodiment 3] FIG. 3 is a front view showing a spool in a bonding apparatus according to another embodiment of the present invention.

本実施例では、スプールの端板部2aの下側には、該端
板部2aの直径よりも寸法L2だけ大きい直径を持つ円
板状のガイド板5が接着等で固定されている。
In this embodiment, a disc-shaped guide plate 5 having a diameter larger than the diameter of the end plate 2a by a dimension L2 is fixed to the lower side of the end plate 2a of the spool by adhesive or the like.

したがって、本実施例では、ガイド板5の外周部が寸法
L2だけ端板部2aよりも張り出していることにより、
ワイヤの引っ掛かりを防止することができる。
Therefore, in this embodiment, since the outer circumferential portion of the guide plate 5 protrudes beyond the end plate portion 2a by the dimension L2,
This can prevent the wire from getting caught.

なお、ガイド板5は端板部2a等と一体成形の樹脂等で
作ってもよい。
Note that the guide plate 5 may be made of resin or the like integrally molded with the end plate portion 2a and the like.

[実施例4] 第4図は本発明の他の実施例によるボンディング装置に
おけるスプールの断面図である。
[Embodiment 4] FIG. 4 is a sectional view of a spool in a bonding apparatus according to another embodiment of the present invention.

この実施例では、両端板部2a、2bの外周部内側に互
いに対向方向に延びるリング状の突出部2a1.2b1
が一体的に形成されている。
In this embodiment, ring-shaped protrusions 2a1 and 2b1 extend in opposite directions inside the outer peripheries of both end plates 2a and 2b.
are integrally formed.

この突出部2a1.2b1を設けたことにより、ワイヤ
巻回部2a、2bに引っ掛がることを防止できる。
By providing the protrusions 2a1 and 2b1, it is possible to prevent the wire from being caught on the wire windings 2a and 2b.

なお、突出部をリング状に複数ケ所設けてもよい。Note that a plurality of ring-shaped protrusions may be provided.

[効果] (l)、スプールの少なくとも一方の端部が引っ掛かり
防止手段を有することにより、スプールに巻かれたワイ
ヤ等の線状物が引っ掛かりを生ずることを阻止し、線状
物の切断を阻止できる。
[Effects] (l) At least one end of the spool has a snag prevention means, which prevents a wire or other wire wound around the spool from getting caught and prevents the wire from being cut. can.

(2)、前記(1)により、線状物の供給が中断されな
(なるので、作業効率、ひいては装置の稼動率が向上す
る。
(2) According to the above (1), the supply of the linear material is not interrupted, so the working efficiency and the operating rate of the apparatus are improved.

(3)8本発明のスプールをワイヤボンディング用のワ
イヤのために使用すると、たとえば第1ボンディング点
から第2ボンディング点に移る時等におけるワイヤのネ
ック切れや断線を防止することができる。
(3) 8 When the spool of the present invention is used for a wire for wire bonding, it is possible to prevent neck breakage or disconnection of the wire when moving from a first bonding point to a second bonding point, for example.

以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。
Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

たとえば、スプールの端部の引っH)かり防止構造は前
記実施例以外にも様々な構造とすることができる。
For example, the anti-snag structure at the end of the spool may have various structures other than the above-described embodiments.

また、スプールの巻回部と端板部等とは一体成形品でも
よく、あるいは別体のものを組み立てたものでもよい。
Further, the winding portion and the end plate portion of the spool may be integrally molded, or may be assembled from separate pieces.

[利用分野] 以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野であるワイヤボンディング
用のワイヤに適用した場合について説明したが、それに
限定されるものではなく、たとえば、ワイヤボンディン
グ以外の用途に用いられるワイヤあるいは糸等のように
スプールへの引っ掛かりを生じるものであればどのよう
な線状物にも広く適用できる。
[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to wire bonding wire, which is the field of application that formed the background of the invention, but the invention is not limited to this, for example, The present invention can be widely applied to any linear object that can be caught on the spool, such as wire or thread used for purposes other than wire bonding.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例1であるボンディング装置にお
けるスプールを一部断面図で示す側面図、第2図は本発
明の実施例2であるボンディング装置におけるスプール
の側面図、 第3図は本発明の実施例3であるボンディング装置にお
けるスプールの側面図、 第4図は本発明の実施例4であるボンディング装置にお
けるスプールの断面図である。 1・・・ワイヤ巻回部、2a、2b・・・端板部、2a
1.2b1・・・突出部(引っ掛かり防止手段)、3・
・・スプール置場、4・・・ガイド(引っ掛かり防止手
段)、5・・・ガイド板(引っ掛かり防止手段)。 第 1 図 第 3 図 第 2 図 ) 第 4 図 1 Z、1
FIG. 1 is a side view, partially in cross section, of a spool in a bonding device according to a first embodiment of the present invention, FIG. 2 is a side view of a spool in a bonding device according to a second embodiment of the present invention, and FIG. FIG. 4 is a side view of a spool in a bonding apparatus according to a third embodiment of the present invention, and FIG. 4 is a cross-sectional view of a spool in a bonding apparatus according to a fourth embodiment of the present invention. 1... Wire winding part, 2a, 2b... End plate part, 2a
1.2b1... protrusion (catch prevention means), 3.
... Spool storage area, 4... Guide (catch prevention means), 5... Guide plate (catch prevention means). Figure 1 Figure 3 Figure 2) Figure 4 Figure 1 Z, 1

Claims (1)

【特許請求の範囲】 1、スプールの端板部の少なくとも一方に引つ掛かり防
止手段を有することを特徴とするボンディング装置。 2、前記引っ掛かり防止手段が、一方の端板部に密着状
態で嵌装されたガイドよりなることを特徴とする特許請
求の範囲第1項記載のボンディング装置。 3、前記引っ掛かり防止手段が、一方の端板部を他方の
端板部よりも大きい直径にすることにより形成されるこ
とを特徴とする特許請求の範囲第1項記載のボンディン
グ装置。 4、前記引っ掛かり防止手段が、一方の端板部に形成さ
れかつ該端板部および他方の端板部よりも大きい直径を
持つガイドよりなることを特徴とする特許請求の範囲第
1項記載のボンディング装置。 5、前記引っ掛かり防止手段が、少なくとも一方の端板
の周縁部から軸方向内側に突出する環状のまたは環状に
配置された突起部よりなることを特徴とする特許請求の
範囲第1項記載のボンディング装置。
[Scope of Claims] 1. A bonding device characterized by having a catch prevention means on at least one of the end plate portions of the spool. 2. The bonding apparatus according to claim 1, wherein the snagging prevention means comprises a guide fitted in close contact with one end plate. 3. The bonding apparatus according to claim 1, wherein the snagging prevention means is formed by making one end plate portion larger in diameter than the other end plate portion. 4. The device according to claim 1, wherein the snagging prevention means comprises a guide formed on one end plate portion and having a diameter larger than that of the end plate portion and the other end plate portion. bonding equipment. 5. The bonding according to claim 1, wherein the snagging prevention means comprises an annular or annularly arranged protrusion projecting inward in the axial direction from the peripheral edge of at least one end plate. Device.
JP58216327A 1983-11-18 1983-11-18 Bonding device Pending JPS60109238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58216327A JPS60109238A (en) 1983-11-18 1983-11-18 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58216327A JPS60109238A (en) 1983-11-18 1983-11-18 Bonding device

Publications (1)

Publication Number Publication Date
JPS60109238A true JPS60109238A (en) 1985-06-14

Family

ID=16686789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58216327A Pending JPS60109238A (en) 1983-11-18 1983-11-18 Bonding device

Country Status (1)

Country Link
JP (1) JPS60109238A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5318739A (en) * 1988-12-15 1994-06-07 Fuji Photo Film Co., Ltd. Method for manufacturing magnetic tape cassette

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5318739A (en) * 1988-12-15 1994-06-07 Fuji Photo Film Co., Ltd. Method for manufacturing magnetic tape cassette

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