JPS6010679A - Semiconductor memory - Google Patents
Semiconductor memoryInfo
- Publication number
- JPS6010679A JPS6010679A JP11961083A JP11961083A JPS6010679A JP S6010679 A JPS6010679 A JP S6010679A JP 11961083 A JP11961083 A JP 11961083A JP 11961083 A JP11961083 A JP 11961083A JP S6010679 A JPS6010679 A JP S6010679A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- film
- floating gate
- floating
- semiconductor memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 230000015556 catabolic process Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 8
- 239000011229 interlayer Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000005684 electric field Effects 0.000 abstract description 2
- 239000002784 hot electron Substances 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 230000014759 maintenance of location Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
- H01L29/7886—Hot carrier produced by avalanche breakdown of a PN junction, e.g. FAMOS
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Volatile Memory (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、なだれ降伏により発生するホットエVクト
ロンを、浮遊ゲートに蓄積し情報を記憶する半導体記憶
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor memory device that stores information by accumulating hot electrons generated by avalanche breakdown in a floating gate.
第1図、第2図、第3図は従来のこの種の装置を示すも
ので、第1図は平面図であり、第2図は第1図の横方向
断面図、第3図は第1図の縦方向断面図である。これら
の図において、1はコントルールゲート、2は浮遊ゲー
ト、3はチャネル部分、4はトンイン、5はソース、6
は表面保護膜、7は層間絶縁膜、8はゲート酸化膜、9
はフィー+11 −一一
ルド酸化膜、10はシリコン基板である。Figures 1, 2, and 3 show conventional devices of this type, with Figure 1 being a plan view, Figure 2 being a lateral sectional view of Figure 1, and Figure 3 being a cross-sectional view of Figure 1. FIG. 2 is a longitudinal cross-sectional view of FIG. 1; In these figures, 1 is a control gate, 2 is a floating gate, 3 is a channel part, 4 is a tunnel part, 5 is a source, and 6
7 is a surface protection film, 7 is an interlayer insulating film, 8 is a gate oxide film, 9 is a
11 is a field oxide film, and 10 is a silicon substrate.
次に動作について説明する。Next, the operation will be explained.
トンイン4に近い空乏層領域で、なだれ降伏で発生じた
ホットエンクトロンの一部は、シリコン基板10とゲー
ト酸化膜8の界面のエネルギ障壁な乗り越え、コントロ
ールゲート1がつくるゲート酸化膜8中の電界によりゲ
ート酸化膜8中を流れ、浮遊ゲート2に落ち込み蓄積さ
れる。浮遊ゲート2は、層間絶縁膜7とゲート酸化膜8
により外部から完全に絶縁されているので、ホットエV
クトロンは長時間安定に保持され、記憶機能を持つこと
になる。実際の記憶装置では、浮遊ゲート2にホットエ
ンクトロンが蓄積された状態(データ書き込み状態)と
、空の状態(消去状態)により情報が記憶される。A part of the hot enctrons generated by avalanche breakdown in the depletion layer region near the tunnel 4 overcomes the energy barrier of the interface between the silicon substrate 10 and the gate oxide film 8 and is absorbed into the gate oxide film 8 formed by the control gate 1. It flows through the gate oxide film 8 due to the electric field, falls to the floating gate 2, and is accumulated. The floating gate 2 includes an interlayer insulating film 7 and a gate oxide film 8.
Since it is completely insulated from the outside by
Cutrons remain stable for long periods of time and have memory functions. In an actual storage device, information is stored in a state in which hot enctrons are accumulated in the floating gate 2 (data write state) and in an empty state (erased state).
従来の半導体記憶装置は以上のように構成されているの
で、記憶保持特性を高めるには、浮遊ゲート2の周りの
層間絶縁膜7とゲート酸化膜8の ゛′絶縁性を高める
必要があり、製造欠陥により絶縁性が低下すると記憶保
持特性も低下するという欠伐)
点があった。Since the conventional semiconductor memory device is configured as described above, in order to improve the memory retention characteristics, it is necessary to improve the insulation properties of the interlayer insulating film 7 and the gate oxide film 8 around the floating gate 2. If the insulation properties deteriorate due to manufacturing defects, the memory retention properties will also deteriorate.
この発明は、上記のような従来のものの欠点ケ除去する
ためになされたもので、浮遊ゲート′ヲ二層構造にする
ことにより、製造欠陥に起因する記憶揮発不良の発生を
低減させることができる半導体記憶装置を提供すること
を目的としている。以下この発明の一実施例を第4図〜
第6図によって説明する。This invention was made to eliminate the drawbacks of the conventional devices as described above, and by forming the floating gate into a two-layer structure, it is possible to reduce the occurrence of memory volatilization failures caused by manufacturing defects. The purpose is to provide a semiconductor memory device. An embodiment of this invention is shown below in Figs.
This will be explained with reference to FIG.
第4図において、第1図〜第3図と同一符号は同一部分
を示し、2a、2bは下側および上側の浮遊ゲートで、
第5甲、第6図に示すように絶縁膜11を挾んだ二層の
構造にしたものであり、絶縁膜11により、下側の浮遊
グー)2aと上側の浮遊グー)2bに分離されている。In FIG. 4, the same symbols as in FIGS. 1 to 3 indicate the same parts, 2a and 2b are lower and upper floating gates,
As shown in Figures 5A and 6, it has a two-layer structure with an insulating film 11 sandwiched between them, and the insulating film 11 separates the floating goo (2a) on the lower side and the floating goo (2b) on the upper side. ing.
なお、各浮遊グー)2a、2bを二層構造にした以外は
、従来装置と同一構造である。The structure is the same as that of the conventional device except that each floating goo (2a, 2b) has a two-layer structure.
次に、動作について説明する。Next, the operation will be explained.
トンイン4に近い空乏層領域で、なだれ降伏にを流れ、
下側の浮遊グー)2aと上側の浮遊グー)2bに落ち込
み蓄積される。下側の浮遊ゲート2aと上側の浮遊グー
)2bに蓄積されるそれぞれの電荷量は、単独で存在し
た場合でもトランジスタが十分に動作するよう設計して
おく。In the depletion layer region near Tongin 4, avalanche breakdown occurs,
It falls and accumulates in the lower floating goo) 2a and the upper floating goo) 2b. The amounts of charge stored in the lower floating gate 2a and the upper floating gate 2b are designed so that the transistor can operate sufficiently even when they exist alone.
これにより、製造欠陥が原因でゲート酸化膜8の絶縁性
が低下し、下側の浮遊デー)2aの記憶保持特性が低下
した場合でも、上側の浮遊ゲート2bの記憶保持特性に
問題がない限り、記憶装置全体としては良好な記憶保持
特性が期待される。As a result, even if the insulation properties of the gate oxide film 8 deteriorate due to manufacturing defects and the memory retention characteristics of the lower floating gate 2a deteriorate, as long as there is no problem with the memory retention characteristics of the upper floating gate 2b. , the storage device as a whole is expected to have good memory retention characteristics.
また、製造欠陥により層間絶縁膜7の絶縁性が低下し、
上側の浮遊グー)2bの記憶保持特性が低下した場合で
も同様に、下側の浮遊ゲート2aによって装置全体の特
性低下が防止できる。In addition, the insulation properties of the interlayer insulating film 7 are reduced due to manufacturing defects,
Even if the memory retention characteristics of the upper floating gate 2b deteriorate, the lower floating gate 2a can similarly prevent the characteristics of the entire device from deteriorating.
なお、上記実施例では、下側の浮遊グー)2aと上側の
浮遊グー)2bの形状を同一にしたが、上側と下側の蓄
積電荷量を調整するため、形状に“′”“゛””°1
以上説明したように、この発明は、浮遊ゲートを絶縁膜
を介在させた二層構造にし、記憶装置の動作に冗長性を
持たせたので、信頼性が向上するだけでなく、歩留りも
向上する効果がある。In the above embodiment, the shapes of the lower floating goo (2a) and the upper floating goo (2b) were made the same, but in order to adjust the amount of accumulated charge on the upper and lower sides, "'" and "゛" were added to the shapes. ”°1 As explained above, this invention has a floating gate with a two-layer structure with an insulating film interposed between them, providing redundancy to the operation of the memory device, which not only improves reliability but also improves yield. It also has the effect of improving
第1図〜第3図は従来の半導体記憶装置を示す平面図、
横方向断面図、および縦方向断面図、第4図〜第6図は
この発明の一実施例7示す半導体記憶装置の平面図、横
方向断面図、および縦方向断面図である。
図中、1はコントロールゲート、2aは下側の浮遊ゲー
ト、2bは上側の浮遊ゲート、3はチャネル部分、4は
トンイン、5はソース、6は表面保護膜、7は層間絶縁
膜、8はゲート酸化膜、9はフィールド酸化膜、10は
シリコン基板、11は絶縁膜である。なお、図中の同一
符号は同一または相当部分を示す。
代理人 大 岩 増雄 (外2名)
第1図
第2図
第4図
第5図
第 3 図
第6図1 to 3 are plan views showing conventional semiconductor memory devices;
4 to 6 are a plan view, a horizontal sectional view, and a vertical sectional view of a semiconductor memory device showing a seventh embodiment of the present invention. In the figure, 1 is a control gate, 2a is a lower floating gate, 2b is an upper floating gate, 3 is a channel part, 4 is a tunnel, 5 is a source, 6 is a surface protection film, 7 is an interlayer insulating film, and 8 is a A gate oxide film, 9 a field oxide film, 10 a silicon substrate, and 11 an insulating film. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 Figure 4 Figure 5 Figure 3 Figure 6
Claims (1)
ゲートに蓄積して情報を記憶する半導体記憶装置におい
て、前記浮遊ゲートを絶縁膜を介在した二層構造にした
ことtx%徴とする半導体記憶装置。A semiconductor memory device that stores information by accumulating true enctronic energy in a floating gate caused by avalanche breakdown, wherein the floating gate has a two-layer structure with an insulating film interposed therebetween.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11961083A JPH0770625B2 (en) | 1983-06-29 | 1983-06-29 | Semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11961083A JPH0770625B2 (en) | 1983-06-29 | 1983-06-29 | Semiconductor memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6010679A true JPS6010679A (en) | 1985-01-19 |
JPH0770625B2 JPH0770625B2 (en) | 1995-07-31 |
Family
ID=14765670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11961083A Expired - Lifetime JPH0770625B2 (en) | 1983-06-29 | 1983-06-29 | Semiconductor memory device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0770625B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01132169A (en) * | 1987-11-17 | 1989-05-24 | Mitsubishi Electric Corp | Semiconductor device |
US5229631A (en) * | 1990-08-15 | 1993-07-20 | Intel Corporation | Erase performance improvement via dual floating gate processing |
-
1983
- 1983-06-29 JP JP11961083A patent/JPH0770625B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01132169A (en) * | 1987-11-17 | 1989-05-24 | Mitsubishi Electric Corp | Semiconductor device |
US5229631A (en) * | 1990-08-15 | 1993-07-20 | Intel Corporation | Erase performance improvement via dual floating gate processing |
Also Published As
Publication number | Publication date |
---|---|
JPH0770625B2 (en) | 1995-07-31 |
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