JPS60106664A - Ic用全自動はんだ付け装置 - Google Patents
Ic用全自動はんだ付け装置Info
- Publication number
- JPS60106664A JPS60106664A JP21235983A JP21235983A JPS60106664A JP S60106664 A JPS60106664 A JP S60106664A JP 21235983 A JP21235983 A JP 21235983A JP 21235983 A JP21235983 A JP 21235983A JP S60106664 A JPS60106664 A JP S60106664A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- cleaning
- soldering
- flux
- cleaning liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21235983A JPS60106664A (ja) | 1983-11-14 | 1983-11-14 | Ic用全自動はんだ付け装置 |
| KR1019840007108A KR890004818B1 (ko) | 1983-11-14 | 1984-11-13 | Ic용 전자동 납땜장치 |
| US06/670,941 US4570569A (en) | 1983-11-14 | 1984-11-13 | Soldering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21235983A JPS60106664A (ja) | 1983-11-14 | 1983-11-14 | Ic用全自動はんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60106664A true JPS60106664A (ja) | 1985-06-12 |
| JPS6345908B2 JPS6345908B2 (enExample) | 1988-09-12 |
Family
ID=16621237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21235983A Granted JPS60106664A (ja) | 1983-11-14 | 1983-11-14 | Ic用全自動はんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60106664A (enExample) |
-
1983
- 1983-11-14 JP JP21235983A patent/JPS60106664A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6345908B2 (enExample) | 1988-09-12 |
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