JPS60106121A - Method of producing electronic part - Google Patents
Method of producing electronic partInfo
- Publication number
- JPS60106121A JPS60106121A JP21445983A JP21445983A JPS60106121A JP S60106121 A JPS60106121 A JP S60106121A JP 21445983 A JP21445983 A JP 21445983A JP 21445983 A JP21445983 A JP 21445983A JP S60106121 A JPS60106121 A JP S60106121A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead member
- component
- solder
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
イ、産業上の利用分野
この発明は部品本体の両端より同一方向にリード線を導
出したリード付電子部品の製造に利用される。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention is utilized for manufacturing leaded electronic components in which lead wires are led out in the same direction from both ends of the component body.
口、従来技術と発明が解決しようとする問題点最近の電
子部品は小形化の要求でリードレスのチップ部品化され
る傾向にある。またチップ化された電子部品はリードレ
スのままプリント基板等に実装されるが、実装上の都合
や用途変更によってチップ状の部品本体にリード線を半
田付けしてリード付電子部品として使用されるものがあ
るが、この種リード付電子部品はその製造に次の問題が
あった。Problems to be Solved by the Prior Art and the Invention Recent electronic components are becoming leadless chip components due to the demand for miniaturization. Additionally, chipped electronic components are mounted on printed circuit boards, etc. without leads, but due to mounting reasons or changes in purpose, lead wires may be soldered to the chip-shaped component body and used as leaded electronic components. However, this type of electronic component with leads has the following problems in its manufacture.
例えば第1図にリード付樹脂外装型積層セラミツー久コ
ンデンサを示すと、(1)、はチップ状に製造された部
品本体で、複数のセラミックシートを内部電極を挾んで
積層し熱プレスしてチップ状に分割してから焼成したコ
ンデンサニレメン) (1’)の両端面に外部電極(2
)(2)を被着形成したものである。(3)(3)は外
部電極(2)(2)に一端部が半田(4)(4)で接続
固定されて同一方向に延びる2本のリード線、(5)は
部品本体(1)の周辺を封止する外装樹脂材で、浸漬法
やモールド成形法で形成される。For example, Figure 1 shows a resin-clad multilayer ceramic capacitor with leads. (1) is the component body manufactured in the form of a chip. Multiple ceramic sheets are laminated with internal electrodes sandwiched between them and then hot-pressed to form a chip. External electrodes (2
)(2) is formed by adhesion. (3) (3) is two lead wires extending in the same direction with one end connected and fixed to the external electrode (2) (2) with solder (4) (4), (5) is the component body (1) This is an exterior resin material that seals the periphery of the housing, and is formed by dipping or molding.
上記電子部品の製造は一般に第2図に示すように2本の
リード線(3)(3)の一端部を治具(6)で保持して
同一方向に延ばし、リード線(3)(3)の開放端部(
3’) (3’)間に部品本体(1)を嵌めてこれを挾
持し、この状態で部品本体(1)を半田槽(7)内の溶
融半田(8)に浸漬してリード線(3)(3)と外部電
極(2)(2)を半田付けし、その後所望時に外装樹脂
材(5)を形成する工程で多数個を一括して行っている
。ところが、部品本体(1)はミリ単位の非常に小さな
ものであり、これに対応してリード線(3)(3)も細
いものが使用されるので、治具(6)で保持されたリー
ド線(3)(3)に反りなどの変形があると部品本体(
1)を挾持した時の挟持力が弱くなって半田浸漬時に部
品本体(1)が落下することがあり2、製造上の信頼性
が悪かった。またリード線(3)(3)は細くて腰が弱
いため、変形が無くとも部品本体(1)の挟持力がどう
しても弱くなり、部品落下が尚更に多発する要因になっ
ていた。Generally, the above electronic components are manufactured by holding one end of the two lead wires (3) (3) with a jig (6) and extending them in the same direction as shown in Figure 2. ) open end (
3') Insert the component body (1) between the (3') and sandwich it, and in this state, dip the component body (1) into the molten solder (8) in the solder tank (7) and connect the lead wire ( 3) The process of soldering (3) and the external electrodes (2) (2) and then forming the exterior resin material (5) as desired is performed on a large number of pieces at once. However, the main body of the component (1) is very small, measured in millimeters, and the lead wires (3) (3) are correspondingly thin, so the leads held by the jig (6) If the line (3) (3) is warped or otherwise deformed, the part body (
1) The clamping force when clamping the component (1) was weakened, and the component body (1) could fall during solder immersion (2), resulting in poor manufacturing reliability. Further, since the lead wires (3) (3) are thin and weak, even if there is no deformation, the clamping force of the component body (1) is inevitably weak, which causes the components to fall even more frequently.
また上記リード付タイプの電子部品の実装はプリント基
板のスルーホールにリード線を挿通して半田付けするも
のが多く、この実装には一般に個々に製造された電子部
品をテーピングしたものから1個ずつ取出してプリント
基板に挿通していく自動挿入機が使用される。しかし乍
ら、この実装のため電子部品をテーピングする工程に個
々の電子部品をパーツフィーダ等で整列整送する装置、
整送されてきた電子部品を順次にテーピングしていく装
置などを必要として設備費が高(付き、これが製品コス
トを上げる要因になっていた。特にリード線に極性があ
るものは極性を揃えてテーピングする必要があって尚更
に大変であった。In addition, when mounting the above-mentioned lead-type electronic components, lead wires are often inserted into through-holes on the printed circuit board and soldered.In general, this is done one by one from individually manufactured electronic components that are taped together. An automatic insertion machine is used that takes it out and inserts it into the printed circuit board. However, in the process of taping electronic components for this mounting, there is a device that aligns and feeds individual electronic components using a parts feeder, etc.
Equipment costs were high as equipment was needed to tape electronic components one after another as they were delivered, which was a factor in increasing product costs.Especially for products with lead wires that have polarity, It was even more difficult because it had to be taped.
ハ9問題点を解決するための手段
本発明は上記問題点に鑑みなされたもので、2本のリー
ド線が部品本体を挾持して半田付けする際の問題点は2
本のリード線の間隔が不安定なるが故に発生している点
に注目し、これの解決手段として2本のリード線の先端
を同一材料で予め短絡一体化した略U字形リード部材を
使用する手段を提供する。また電子部品実装時のテーピ
ングによる問題点の解決手段として、上記リード部材を
帯状ホルダーに予め一体化したテーピング部品態様のも
のを使用して部品本体の半田付は等を行い、そのまま実
装時まで形状保持する手段を提供する。C9 Means for Solving the Problems The present invention has been made in view of the above problems, and there are two problems when the two lead wires sandwich the component body and solder it.
We focused on the fact that this problem occurs because the spacing between the book's lead wires is unstable, and as a solution to this problem, we used a roughly U-shaped lead member in which the ends of the two lead wires were pre-shorted and integrated using the same material. provide the means. In addition, as a means of solving problems caused by taping when mounting electronic components, the above lead member is integrated into a band-shaped holder in the form of a taping component, and soldering of the component body is performed, etc., and the shape is left unchanged until the time of mounting. Provide a means of holding.
以上をまとめると、本発明は次の(a)〜(c)の各工
程で電子部品を製造する。To summarize the above, the present invention manufactures electronic components through the following steps (a) to (c).
(a)、帯状ホルダーに両端部分が固定化されてホルダ
ーから延びる略U字形リード部材の先端部の対向部分で
チップ状部品本体を挾持させる工程。この工程における
リード部材はホルダーから多数本が同一方向に延びたも
のが適用される。(a) A step of sandwiching the chip-like component main body at opposing portions of the tip of a substantially U-shaped lead member whose both ends are fixed to the band-like holder and extends from the holder. In this step, a number of lead members extending in the same direction from a holder are used.
(b)、工程(a)で準備されたものの部品本体とリー
ド部材の互いに接触する部分を半田付けする工程。この
工程はリード部材の部品本体を挟持する部分に予め半田
を塗布、又は部品本体のリード部材で挾持される部分に
予め半田を塗布しておいて、リード部材で部品本体を挾
持したものを加熱炉内に入れて上記半田を溶融させる方
法や、いずれも半田処理していないリード部材で部品本
体を挾持したものを溶融半田に浸漬して行う方法で行わ
れる。(b) A step of soldering the mutually contacting parts of the component body and the lead member prepared in step (a). In this process, solder is applied in advance to the part of the lead member that holds the component body, or solder is applied in advance to the part of the component body that is held between the lead members, and the part body is held between the lead members and then heated. This can be carried out by placing the solder in a furnace and melting the solder, or by dipping the component main body between unsoldered lead members into molten solder.
(C)、部品本体を半田付けしたリード部材の先端の短
絡部分を切断除去してリード部材を部分する工程。(C) A step of cutting and removing the short-circuited portion at the tip of the lead member to which the component body is soldered to separate the lead member.
二、実施例
上記(a)〜(c)の工程を第1図の電子部品の製造に
適用して具体例を説明する。2. Example A specific example will be described by applying the steps (a) to (c) above to the manufacture of the electronic component shown in FIG.
先ず第1実施例を第3図乃至第8図に示し、これを順に
説明すると、始めに第3図に示す如きり、−ドフレーム
(9)を用意する。これは金属平板を打抜き成形したも
ので、1枚の帯状ホルダー(lO)の−側端から複数の
略U字状リード部材(11) (11)−・がその両端
がホルダー(10)に連結された形で一体成形されて延
びたものである。各リード部材(11) (111−は
同一形状でその先端部の対向部分(lla)(lla)
−は1つの部品本体(1)が嵌る一定の間隔βを有する
。次ぎに第4図に示すように各リード部材(11) (
11)−の先端対向部分(11a )(11a > −
に所定量のペースト状の半田(12)(12) −を塗
布する。尚、この工程においては各リード部材(11)
(II)−・−・の先端の短絡部分(llb)(ll
b)−・をも含めて半田塗布するようにしてもよいが、
短絡部分(11b ) (11b )−は後で切断除去
される不要部分なためこの部分での半田塗布は材料的な
無駄を招くので特別な必要性の無い限り行わない。First, the first embodiment is shown in FIGS. 3 to 8, and will be explained in order. First, as shown in FIG. 3, a frame (9) is prepared. This is made by punching and forming a flat metal plate, and from the negative end of one strip-shaped holder (lO), a plurality of approximately U-shaped lead members (11) (11)-- are connected at both ends to the holder (10). It is integrally molded and extended. Each lead member (11) (111- has the same shape and its tip facing portion (lla) (lla)
- has a constant interval β into which one component body (1) fits. Next, as shown in FIG. 4, each lead member (11) (
11) - Tip opposing portion (11a) (11a > -
A predetermined amount of paste solder (12) (12) - is applied to. In addition, in this step, each lead member (11)
(II) Short-circuited part (llb) at the tip of --- (ll
b) You may also apply solder to -., but
The short-circuit portion (11b) (11b)- is an unnecessary portion that will be cut and removed later, and therefore solder application at this portion will result in waste of material and should not be applied unless there is a special need.
次ぎに第5図に示すように各リード部材(11)(11
)−の先端部間に1個ずつ部品本体(1)(1) −を
嵌めて各部品本体(1)(1)、−をリード部材(11
) (111−・−で挾持する。この挟持はリード部材
(11) (11)−の先端対向部分(lla)(ll
a)−の間隔lが短絡部分(11b )(11b )・
・−によりいずれも一定に保持されているので、いずれ
の部品本体(1)(1)−をも安定した一定の挟持力で
挾持され、この状態が持続されて落下する心配は無い。Next, as shown in FIG.
) - Fit the component bodies (1) (1) - one by one between the tips of the lead members (11) and -, respectively.
) (111-・-. This clamping is carried out by the tip facing portions (lla) (lla) (lla) of the lead members (11) (11)-.
a) The interval l between - is the short-circuited part (11b) (11b)
Since both parts are held constant by -, both parts bodies (1) (1) - are held with a stable and constant clamping force, and there is no fear that this state will continue and fall.
部品挟持が完了すると第6図に示すようにリードフレー
ム(9)の全体を加熱炉(13)に搬入して半田(12
) (12)−を加熱溶融させ、リード部材(11)
(11)−の先端対向部分(lla)(lla)・−・
・と部品本体(1)(1)−の外部電極(2)(2)
−−一−−とを一括して半田付けする。次に加熱炉(1
3)から出して第7図に示すように各リード部材(11
) (11)−・−・の短絡部分(llb)(llb)
−を図面破線位置から切断して除去する。この切断で部
分されて残ったリード部材は第1図のリード線(3)(
3)−に相当する。而して後、第8図に示すように各部
品本体(1)(1)・−・の周辺を外装樹脂材(5)(
5L−で封止する。When the clamping of the parts is completed, the entire lead frame (9) is carried into the heating furnace (13) and soldered (12) as shown in FIG.
) (12)- is heated and melted to form a lead member (11).
(11) - Tip opposing part (lla) (lla) ---
・External electrodes (2) (2) of the parts body (1) (1) -
Solder ---1-- all at once. Next, the heating furnace (1
3) and remove each lead member (11) as shown in Figure 7.
) (11) Short-circuited part (llb) (llb)
- is removed by cutting from the broken line position in the drawing. The lead member that remains after this cutting is the lead wire (3) in Figure 1 (
3) Corresponds to -. After that, as shown in Fig. 8, the surroundings of each part body (1) (1)...
Seal with 5L-.
第8図のリードフレーム(9)はそのまま保管され、個
々の電子部品が要求される必要時にホルダー(10)か
らリード線(3)(3)−を切断分離して要求に応じる
。また電子部品をプリント基板に自動挿入機で実装する
場合は自動挿入機で第8図状態のリードフレーム(9)
が従来のテーピング部品と同じ要領で供給され、リード
フレーム(9)に一体化された電子部品は実装の直前で
ホルダー(10)から順次に切断分離されてプリント基
板へと挿入されていく。The lead frame (9) shown in FIG. 8 is stored as it is, and when individual electronic components are required, the lead wires (3) (3) are cut and separated from the holder (10) to meet the demand. In addition, when mounting electronic components on a printed circuit board using an automatic insertion machine, use the automatic insertion machine to install the lead frame (9) in the state shown in Figure 8.
are supplied in the same manner as conventional taped components, and the electronic components integrated into the lead frame (9) are sequentially cut and separated from the holder (10) and inserted into the printed circuit board just before mounting.
つまり本発明においては電子部品をプリント基板に自動
挿入するため改めてテーピングする必要性が無くなり、
この種実装装置の簡略化、設備費低減化を実現させる。In other words, in the present invention, the electronic components are automatically inserted into the printed circuit board, so there is no need for additional taping.
This type of mounting equipment can be simplified and equipment costs can be reduced.
次ぎに第9図で第2実施例を説明する。これの第1実施
例との相違点は第3図のリードフレーム(9)の各リー
ド部材(11) (11)−−−−−に半田処理するこ
と無く部品本体(1)(IL、−・を直接に嵌め挾持さ
せておいて部品本体(1)(1) −を半田槽(14)
内の溶融半田(15)に浸漬して所望の半田付けを一括
して行う点のみである。この場合も部品本体(1)(1
)−の挟持は安定して行われる。Next, a second embodiment will be explained with reference to FIG. The difference between this and the first embodiment is that each lead member (11) (11) of the lead frame (9) in FIG. - Directly fit and hold the component body (1) (1) - into the solder bath (14)
The only point is that the desired soldering is performed all at once by dipping it into the molten solder (15) inside. In this case as well, the parts body (1) (1
)- is held stably.
尚、本発明は上記実施例に限らず、特にリード部材とこ
れを保持するホルダーの形態は様々であり、また第10
図に示すように紙製ボルダ−(10’ )に予め独立し
て成形された略U字形の丸棒状リード部材(11”)
(11’ )−の両端部をかしめや接着剤による接着な
どの手段で固定化したものを使用することも可能である
。また本発明は積層セラミックコンデンサの製造にのみ
制約されない。It should be noted that the present invention is not limited to the above-mentioned embodiments; in particular, the form of the lead member and the holder that holds it may be varied;
As shown in the figure, a roughly U-shaped round rod-shaped lead member (11") is formed independently in advance on a paper boulder (10').
It is also possible to use one in which both ends of (11')- are fixed by caulking, bonding with an adhesive, or the like. Furthermore, the present invention is not limited to manufacturing monolithic ceramic capacitors.
ホ0発明の効果
以上の如く、本発明は安定した間隔のリード部材で部品
本体を挾持して半田付けするので、半田付は時に部品本
体が位置ずれを起こしたり落下する心配が無く、歩留ま
りの良い高信頼度の製法が提供できる。またリード部材
をホルダーに一体化したものを使用するので、リード支
持用の複雑な治具等が不要になり、また部品本体半田付
は工程やリード部材一部切断工程など各工程がタイバー
を用いたまま連続して行え、作業性の向上、製造装置の
簡略化が図れる。更にタイバーに連結されたままでの製
造のため、製造後はテーピング部品態様のものが得られ
、これをそのままプリント基板の自動挿入機に供給使用
することができて実装が非常に便利、且つ実装に必要な
テーピング装置などを不要にして設備費の低減化による
製品のコストダウンを可能にする。Effects of the Invention As described above, in the present invention, the component body is held and soldered by lead members with stable intervals, so there is no fear that the component body may sometimes shift or fall during soldering, and the yield can be reduced. We can provide a good and highly reliable manufacturing method. In addition, since the lead member is integrated into the holder, there is no need for complex jigs for supporting the lead, and tie bars are used for each process such as soldering the component body and cutting part of the lead member. It can be carried out continuously, improving workability and simplifying manufacturing equipment. Furthermore, since it is manufactured while connected to the tie bar, a taped component is obtained after manufacturing, which can be fed directly to an automatic printed circuit board insertion machine, making mounting very convenient and easy. This makes it possible to reduce product costs by eliminating the need for taping equipment and reducing equipment costs.
第1図は電子部品の一例を示す断面図、第2図は第1図
の電子部品の従来製法による製造装置を説明するための
断面図、第3図乃至第10図は本発明の詳細な説明する
ためのもので、第3図は本発明で使用するリード部材と
ホルダーの一例を示す斜視図、第4図乃至¥58図は第
3図のリード部材とボルダ−を用いた本発明製法の一具
体例を示す各工程での正面図、第9図は本発明製法の他
の一興体例を示す部分断面正面図、第10図は第3図の
リード部材とホルダーの変形例を示す斜視図である。
(1) 一部品本体、(10) (10”)−ホルダー
、 (11) (11’ ) −リード部材、 (ll
a)(11a ) −リード部材先端対向部分、(ll
b )(llb)−・リード部材先端短絡部分、(1
2) −半田、(I5)−・−溶融半田。
(11)
第1間 第2図
瘍5図
1g6図
9
第7図FIG. 1 is a sectional view showing an example of an electronic component, FIG. 2 is a sectional view illustrating a manufacturing apparatus according to the conventional manufacturing method for the electronic component shown in FIG. 1, and FIGS. For explanation purposes, Fig. 3 is a perspective view showing an example of the lead member and holder used in the present invention, and Figs. 4 to ¥58 show the manufacturing method of the present invention using the lead member and boulder shown in Fig. 3. FIG. 9 is a partially sectional front view showing another example of the manufacturing method of the present invention, and FIG. 10 is a perspective view showing a modification of the lead member and holder shown in FIG. 3. It is a diagram. (1) Part main body, (10) (10") - holder, (11) (11') - lead member, (ll
a) (11a) - Lead member tip opposing portion, (ll
b ) (llb) - short-circuited part of lead member tip, (1
2) -Solder, (I5)--molten solder. (11) First room Figure 2 Tumor 5 Figure 1g 6 Figure 9 Figure 7
Claims (1)
ーから延びる略U字形リード部材の先端部の対向部分で
チップ状部品本体を挟持する工程と、部品本体とリード
部材の挟持部分を半田付けする工程と、リード部材の先
端の短絡部分を切断除去する工程とを含むことを特徴と
する電子部品の製造方法。(1) A step of sandwiching the chip-shaped component body between the opposing portions of the tip of a substantially U-shaped lead member whose both ends are fixed to a band-shaped holder and extending from the holder, and soldering the sandwiched portions of the component body and the lead member. A method for manufacturing an electronic component, comprising the steps of: and cutting and removing a short-circuited portion at the tip of a lead member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21445983A JPS60106121A (en) | 1983-11-14 | 1983-11-14 | Method of producing electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21445983A JPS60106121A (en) | 1983-11-14 | 1983-11-14 | Method of producing electronic part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60106121A true JPS60106121A (en) | 1985-06-11 |
Family
ID=16656091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21445983A Pending JPS60106121A (en) | 1983-11-14 | 1983-11-14 | Method of producing electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60106121A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002310742A (en) * | 2001-04-06 | 2002-10-23 | Ricoh Elemex Corp | Unit box tangential flow impeller water meter |
JP2005072111A (en) * | 2003-08-21 | 2005-03-17 | Murata Mfg Co Ltd | Lead-type capacitor and manufacturing method therefor |
-
1983
- 1983-11-14 JP JP21445983A patent/JPS60106121A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002310742A (en) * | 2001-04-06 | 2002-10-23 | Ricoh Elemex Corp | Unit box tangential flow impeller water meter |
JP2005072111A (en) * | 2003-08-21 | 2005-03-17 | Murata Mfg Co Ltd | Lead-type capacitor and manufacturing method therefor |
JP4507527B2 (en) * | 2003-08-21 | 2010-07-21 | 株式会社村田製作所 | Lead type capacitor and manufacturing method thereof |
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