JPS60106121A - Method of producing electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention is utilized for manufacturing leaded electronic components in which lead wires are led out in the same direction from both ends of the component body.

Problems to be Solved by the Prior Art and the Invention Recent electronic components are becoming leadless chip components due to the demand for miniaturization. Additionally, chipped electronic components are mounted on printed circuit boards, etc. without leads, but due to mounting reasons or changes in purpose, lead wires may be soldered to the chip-shaped component body and used as leaded electronic components. However, this type of electronic component with leads has the following problems in its manufacture.

For example, Figure 1 shows a resin-clad multilayer ceramic capacitor with leads. (1) is the component body manufactured in the form of a chip. Multiple ceramic sheets are laminated with internal electrodes sandwiched between them and then hot-pressed to form a chip. External electrodes (2
)(2) is formed by adhesion. (3) (3) is two lead wires extending in the same direction with one end connected and fixed to the external electrode (2) (2) with solder (4) (4), (5) is the component body (1) This is an exterior resin material that seals the periphery of the housing, and is formed by dipping or molding.

Generally, the above electronic components are manufactured by holding one end of the two lead wires (3) (3) with a jig (6) and extending them in the same direction as shown in Figure 2. ) open end (
3') Insert the component body (1) between the (3') and sandwich it, and in this state, dip the component body (1) into the molten solder (8) in the solder tank (7) and connect the lead wire ( 3) The process of soldering (3) and the external electrodes (2) (2) and then forming the exterior resin material (5) as desired is performed on a large number of pieces at once. However, the main body of the component (1) is very small, measured in millimeters, and the lead wires (3) (3) are correspondingly thin, so the leads held by the jig (6) If the line (3) (3) is warped or otherwise deformed, the part body (
1) The clamping force when clamping the component (1) was weakened, and the component body (1) could fall during solder immersion (2), resulting in poor manufacturing reliability. Further, since the lead wires (3) (3) are thin and weak, even if there is no deformation, the clamping force of the component body (1) is inevitably weak, which causes the components to fall even more frequently.

In addition, when mounting the above-mentioned lead-type electronic components, lead wires are often inserted into through-holes on the printed circuit board and soldered.In general, this is done one by one from individually manufactured electronic components that are taped together. An automatic insertion machine is used that takes it out and inserts it into the printed circuit board. However, in the process of taping electronic components for this mounting, there is a device that aligns and feeds individual electronic components using a parts feeder, etc.
Equipment costs were high as equipment was needed to tape electronic components one after another as they were delivered, which was a factor in increasing product costs.Especially for products with lead wires that have polarity, It was even more difficult because it had to be taped.

C9 Means for Solving the Problems The present invention has been made in view of the above problems, and there are two problems when the two lead wires sandwich the component body and solder it.
We focused on the fact that this problem occurs because the spacing between the book's lead wires is unstable, and as a solution to this problem, we used a roughly U-shaped lead member in which the ends of the two lead wires were pre-shorted and integrated using the same material. provide the means. In addition, as a means of solving problems caused by taping when mounting electronic components, the above lead member is integrated into a band-shaped holder in the form of a taping component, and soldering of the component body is performed, etc., and the shape is left unchanged until the time of mounting. Provide a means of holding.

To summarize the above, the present invention manufactures electronic components through the following steps (a) to (c).

(a) A step of sandwiching the chip-like component main body at opposing portions of the tip of a substantially U-shaped lead member whose both ends are fixed to the band-like holder and extends from the holder. In this step, a number of lead members extending in the same direction from a holder are used.

(b) A step of soldering the mutually contacting parts of the component body and the lead member prepared in step (a). In this process, solder is applied in advance to the part of the lead member that holds the component body, or solder is applied in advance to the part of the component body that is held between the lead members, and the part body is held between the lead members and then heated. This can be carried out by placing the solder in a furnace and melting the solder, or by dipping the component main body between unsoldered lead members into molten solder.

(C) A step of cutting and removing the short-circuited portion at the tip of the lead member to which the component body is soldered to separate the lead member.

2. Example A specific example will be described by applying the steps (a) to (c) above to the manufacture of the electronic component shown in FIG.

First, the first embodiment is shown in FIGS. 3 to 8, and will be explained in order. First, as shown in FIG. 3, a frame (9) is prepared. This is made by punching and forming a flat metal plate, and from the negative end of one strip-shaped holder (lO), a plurality of approximately U-shaped lead members (11) (11)-- are connected at both ends to the holder (10). It is integrally molded and extended. Each lead member (11) (111- has the same shape and its tip facing portion (lla) (lla)
- has a constant interval β into which one component body (1) fits. Next, as shown in FIG. 4, each lead member (11) (
11) - Tip opposing portion (11a) (11a > -
A predetermined amount of paste solder (12) (12) - is applied to. In addition, in this step, each lead member (11)
(II) Short-circuited part (llb) at the tip of --- (ll
b) You may also apply solder to -., but
The short-circuit portion (11b) (11b)- is an unnecessary portion that will be cut and removed later, and therefore solder application at this portion will result in waste of material and should not be applied unless there is a special need.

Next, as shown in FIG.
) - Fit the component bodies (1) (1) - one by one between the tips of the lead members (11) and -, respectively.
) (111-・-. This clamping is carried out by the tip facing portions (lla) (lla) (lla) of the lead members (11) (11)-.
a) The interval l between - is the short-circuited part (11b) (11b)
Since both parts are held constant by -, both parts bodies (1) (1) - are held with a stable and constant clamping force, and there is no fear that this state will continue and fall.

When the clamping of the parts is completed, the entire lead frame (9) is carried into the heating furnace (13) and soldered (12) as shown in FIG.
) (12)- is heated and melted to form a lead member (11).
(11) - Tip opposing part (lla) (lla) ---
・External electrodes (2) (2) of the parts body (1) (1) -
Solder ---1-- all at once. Next, the heating furnace (1
3) and remove each lead member (11) as shown in Figure 7.
) (11) Short-circuited part (llb) (llb)
- is removed by cutting from the broken line position in the drawing. The lead member that remains after this cutting is the lead wire (3) in Figure 1 (
3) Corresponds to -. After that, as shown in Fig. 8, the surroundings of each part body (1) (1)...
Seal with 5L-.

The lead frame (9) shown in FIG. 8 is stored as it is, and when individual electronic components are required, the lead wires (3) (3) are cut and separated from the holder (10) to meet the demand. In addition, when mounting electronic components on a printed circuit board using an automatic insertion machine, use the automatic insertion machine to install the lead frame (9) in the state shown in Figure 8.
are supplied in the same manner as conventional taped components, and the electronic components integrated into the lead frame (9) are sequentially cut and separated from the holder (10) and inserted into the printed circuit board just before mounting.

In other words, in the present invention, the electronic components are automatically inserted into the printed circuit board, so there is no need for additional taping.
This type of mounting equipment can be simplified and equipment costs can be reduced.

Next, a second embodiment will be explained with reference to FIG. The difference between this and the first embodiment is that each lead member (11) (11) of the lead frame (9) in FIG. - Directly fit and hold the component body (1) (1) - into the solder bath (14)
The only point is that the desired soldering is performed all at once by dipping it into the molten solder (15) inside. In this case as well, the parts body (1) (1
)- is held stably.

It should be noted that the present invention is not limited to the above-mentioned embodiments; in particular, the form of the lead member and the holder that holds it may be varied;
As shown in the figure, a roughly U-shaped round rod-shaped lead member (11") is formed independently in advance on a paper boulder (10').
It is also possible to use one in which both ends of (11')- are fixed by caulking, bonding with an adhesive, or the like. Furthermore, the present invention is not limited to manufacturing monolithic ceramic capacitors.

Effects of the Invention As described above, in the present invention, the component body is held and soldered by lead members with stable intervals, so there is no fear that the component body may sometimes shift or fall during soldering, and the yield can be reduced. We can provide a good and highly reliable manufacturing method. In addition, since the lead member is integrated into the holder, there is no need for complex jigs for supporting the lead, and tie bars are used for each process such as soldering the component body and cutting part of the lead member. It can be carried out continuously, improving workability and simplifying manufacturing equipment. Furthermore, since it is manufactured while connected to the tie bar, a taped component is obtained after manufacturing, which can be fed directly to an automatic printed circuit board insertion machine, making mounting very convenient and easy. This makes it possible to reduce product costs by eliminating the need for taping equipment and reducing equipment costs.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an example of an electronic component, FIG. 2 is a sectional view illustrating a manufacturing apparatus according to the conventional manufacturing method for the electronic component shown in FIG. 1, and FIGS. For explanation purposes, Fig. 3 is a perspective view showing an example of the lead member and holder used in the present invention, and Figs. 4 to ¥58 show the manufacturing method of the present invention using the lead member and boulder shown in Fig. 3. FIG. 9 is a partially sectional front view showing another example of the manufacturing method of the present invention, and FIG. 10 is a perspective view showing a modification of the lead member and holder shown in FIG. 3. It is a diagram. (1) Part main body, (10) (10") - holder, (11) (11') - lead member, (ll
a) (11a) - Lead member tip opposing portion, (ll
b ) (llb) - short-circuited part of lead member tip, (1
2) -Solder, (I5)--molten solder. (11) First room Figure 2 Tumor 5 Figure 1g 6 Figure 9 Figure 7

Claims (1)

[Claims] (1) A step of sandwiching the chip-shaped component body between the opposing portions of the tip of a substantially U-shaped lead member whose both ends are fixed to a band-shaped holder and extending from the holder, and soldering the sandwiched portions of the component body and the lead member. A method for manufacturing an electronic component, comprising the steps of: and cutting and removing a short-circuited portion at the tip of a lead member.