JPS60106116A - Laminated electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminated electronic component such as a laminated Leramiku condenser.

Precious metals such as Pt and Pd are generally used for the internal electrodes of conventional multilayer semiconductors.
In addition to being expensive, it has the disadvantage of evaporation when firing in a reducing atmosphere at high temperatures.

In order to compensate for these drawbacks, a base plate made of carbon and ceramic powder or carbon is printed on a dielectric green sheet, and the sheets are stacked, pressed, and fired.

A shaped porous layer or void layer is formed in such a fired element, and this porous layer or void layer has a molten circle, eight
A method has been proposed in which a low melting point metal such as No. 1 is injected under pressure.

However, this method has disadvantages in that it is difficult to manufacture and the electrical characteristics are impaired. In other words, a low melting point metal (=J) is deposited between the external electrodes, causing a bridge, which must be removed, but this work is extremely difficult.゛(Removed.

In addition, the contact between the low melting point metal and the dielectric ceramic is weak, and there have been various problems such as increased dielectric loss, especially in the case of materials that are used for crowds.

This invention was made in order to solve the above-mentioned problems of conventional multilayer electronic components such as multilayer ceramic capacitors. The purpose is to provide the following.

That is, the present invention is characterized in that it consists of a dielectric layer formed in a layered manner and a porous layer or a void layer, and an internal electrode mainly made of silver is formed in the porous layer or void layer. It is something.

Hereinafter, one embodiment of the present invention will be described based on the attached drawing No. f.

Reference numeral 1 in FIG. 1 denotes a green sheet made of a suitable dielectric material such as ceramic, and an example of its manufacturing method is as follows.

(Sr 965 Y 005) Sr CO3 ゜■, 02, and Y2O3 are mixed in proportions so as to have the composition of TiO2, and then calcined at 1100°C.

After pulverizing the calcined material as described above, an organic binder is added thereto, a green sheet is created using a doctor blade method, and the green sheet is cut into a predetermined size.

Created as above, 1 = green sheet 1, and carbon Sr T
J in Figure 1:
In this case, the printed layers 3 are placed at one end and not reaching the other end, and the other are placed from the other end but not reaching the other end. , the end and the bottom end are a green sheet 1 without a carbon printing layer.

The stacked green sheets 1.2 as described above were pressed together and the binder was burned at 1100°C in air, followed by firing at 1400°C in an atmosphere containing 95% N2 and 825% N2.

After firing, the element 4 has a porous layer 5 formed in a layered manner, not shown in FIG. Later, 03, yen, 07,
Add a small amount of oxidizing agent paste made of CuO etc. to 11
Thermal diffusion is performed at 50° C. to make the grain boundaries into insulators.

Next, prepare a paste consisting of silver powder, an organic binder, and a solvent. When the element 4 is placed in the paste in a vacuum container C (not shown), the silver paste is injected into the porous layer 5. At this time, pressure may be applied if necessary.

Thereafter, excess silver paste adhering to the periphery is wiped off, and a paste mainly composed of silver is again applied to both ends of the element 4 using a dipping method, etc., and then baked at 800°C to form the external electrode 6 as shown in FIG. Provided at both ends as shown.

When a 0.1 µF multilayer reramic capacitor is obtained using the above example, the dielectric loss is 0.5%r IC0.On the other hand, in the case of a conventional product in which one metal is press-fitted into the porous layer, the dielectric loss is 0.1 µF. The loss was 3.2%.

In the embodiment, an example of strontium butanoate-based grain boundary insulation and type semiconductor content 1 is shown, but similar effects can be obtained with a normal dielectric material. Moreover, although the porous layer 5 was formed in the above-mentioned 1=example, a void layer may be used instead of the porous layer 5. It is common to add an appropriate amount of glass frit to the silver paste h of the J3 example.

Moreover, by providing barriers made of sintered ceramic powder at both ends of the element before injecting the silver paste, backflow of the paste after injecting the silver paste can be prevented.

Further, in addition to the multilayer ceramic capacitor as in the embodiment, it can also be used for electronic components such as a multilayer biristor.

Note that the thickness of the porous layer or void layer is preferably in the range of 50 to 200 μm. In other words, if the thickness is less than 50 μm, the internal electrode will become thinner.
Since the capacity is small and the loss is large, it is no longer of practical use. Moreover, if it exceeds 200 μn1, the capacitance per unit area becomes small, making it impossible to obtain a compact and large-capacity product.

As described above, this invention forms internal electrodes mainly made of silver by injecting silver paste into a porous layer or a void layer, so it is a small multilayer type that is easy to manufacture and has excellent electrical properties. This is an excellent invention that allows electronic components to be obtained.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a green sheet for manufacturing the laminated electronic component of the present invention, FIG. 2 is a perspective view of the element after sintering, and FIG. 3 is a perspective view of the completed laminated electronic component. . 1.2...Green sheet 3...Carbon printed layer 4...Element 5...Porous layer 6...External electrode patent applicant Murata Manufacturing Co., Ltd. Representative Patent attorney Kazu 1η Akira

Claims (3)

[Claims] (1) A multilayer electronic device comprising a dielectric layer formed in a layered manner and a porous layer or a void layer, and an internal electrode mainly made of silver is formed in the porous layer or void layer. parts. (2) The multilayer electronic component according to claim 1, wherein the dielectric layer is a grain-boundary insulated semiconductor porcelain mainly composed of tin titanate to rontium. (3) The thickness of the porous layer or void layer is 50 to 200
Claim 1 characterized in that the range is in the range of μm.
Laminated electronic components as described in section.