JPS60103841U - electronic parts equipment - Google Patents

electronic parts equipment

Info

Publication number
JPS60103841U
JPS60103841U JP19512383U JP19512383U JPS60103841U JP S60103841 U JPS60103841 U JP S60103841U JP 19512383 U JP19512383 U JP 19512383U JP 19512383 U JP19512383 U JP 19512383U JP S60103841 U JPS60103841 U JP S60103841U
Authority
JP
Japan
Prior art keywords
molded body
electronic component
electronic parts
pedestal
parts equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19512383U
Other languages
Japanese (ja)
Other versions
JPS6320120Y2 (en
Inventor
秋山　克彦
秀幸 高橋
寛隆 小林
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP19512383U priority Critical patent/JPS60103841U/en
Publication of JPS60103841U publication Critical patent/JPS60103841U/en
Application granted granted Critical
Publication of JPS6320120Y2 publication Critical patent/JPS6320120Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の電子部品装置の路線的拡大断面図、第２
図は本考案による電子部品装置の一例の路線的拡大断面
図、第３図はそのモールド作業の説明に供する構成図、
第４図は本考案による電子部品装置の他の例の路線的拡
大断面図である。 ２５は電子部品、１１は台座、１３は第１のモールド体
、２７は第２のモールド体、２４は蓋体である。 補正　昭５９．２．２１ 図面の簡単な説明を次のように補正する。 明細書第９頁、ｌ請１第４図はヨを１第４図及び第５図
は、と訂正する。Figure 1 is an enlarged cross-sectional view of a conventional electronic component device;
The figure is an enlarged cross-sectional view of an example of an electronic component device according to the present invention, and FIG. 3 is a configuration diagram for explaining the molding operation.
FIG. 4 is an enlarged cross-sectional view of another example of the electronic component device according to the present invention. 25 is an electronic component, 11 is a pedestal, 13 is a first mold body, 27 is a second mold body, and 24 is a lid body. Amendment February 21, 1982 The brief description of the drawing is amended as follows. On page 9 of the specification, 1. Figure 1.4 is corrected to 1.4 and 5.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 台座の上に電子部品がマウントされると共に該電子部品
に電気的に接続されたリード導体が上記台座の側方より
突設されるように配置され上記台座の周面を覆い上記リ
ード導体の外端を露出させて第１のモールド体が施され
、該第１のモールド体上に該第１のモールド体との共働
によって上記°　　電子部品を包囲する蓋体が配置され
、該蓋体の周縁部を覆って上記第１のモールド体上に第
２のモールド体が施されてなる電子部品装置。An electronic component is mounted on a pedestal, and a lead conductor electrically connected to the electronic component is arranged so as to protrude from the side of the pedestal, and covers the circumferential surface of the pedestal and covers the outside of the lead conductor. A first molded body is applied with the end thereof exposed, and a lid is disposed on the first molded body to surround the electronic component in cooperation with the first molded body. An electronic component device comprising a second molded body formed on the first molded body so as to cover the peripheral edge thereof.
JP19512383U 1983-12-19 1983-12-19 electronic parts equipment Granted JPS60103841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19512383U JPS60103841U (en) 1983-12-19 1983-12-19 electronic parts equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19512383U JPS60103841U (en) 1983-12-19 1983-12-19 electronic parts equipment

Publications (2)

Publication Number Publication Date
JPS60103841U true JPS60103841U (en) 1985-07-15
JPS6320120Y2 JPS6320120Y2 (en) 1988-06-03

Family

ID=30419181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19512383U Granted JPS60103841U (en) 1983-12-19 1983-12-19 electronic parts equipment

Country Status (1)

Country Link
JP (1) JPS60103841U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120833A (en) * 2004-10-21 2006-05-11 Harvatek Corp Package structure of electro-optical semiconductor
JP2008502159A (en) * 2004-06-04 2008-01-24 クリー　インコーポレイテッド Power light emitting die package having a reflective lens and method of manufacturing
JP2015165551A (en) * 2014-02-04 2015-09-17 セイコーインスツル株式会社 Optical sensor device
JP2017050411A (en) * 2015-09-02 2017-03-09 株式会社東芝 Optical semiconductor device, and method of manufacturing the same
WO2019059047A1 (en) * 2017-09-20 2019-03-28 岩崎電気株式会社 Light-emitting device, illumination device, and method for manufacturing light-emitting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008502159A (en) * 2004-06-04 2008-01-24 クリー　インコーポレイテッド Power light emitting die package having a reflective lens and method of manufacturing
JP2006120833A (en) * 2004-10-21 2006-05-11 Harvatek Corp Package structure of electro-optical semiconductor
JP2015165551A (en) * 2014-02-04 2015-09-17 セイコーインスツル株式会社 Optical sensor device
JP2017050411A (en) * 2015-09-02 2017-03-09 株式会社東芝 Optical semiconductor device, and method of manufacturing the same
WO2019059047A1 (en) * 2017-09-20 2019-03-28 岩崎電気株式会社 Light-emitting device, illumination device, and method for manufacturing light-emitting device

Also Published As

Publication number Publication date
JPS6320120Y2 (en) 1988-06-03

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