JPS60101927A - Apparatus for producing thin film - Google Patents
Apparatus for producing thin filmInfo
- Publication number
- JPS60101927A JPS60101927A JP20943683A JP20943683A JPS60101927A JP S60101927 A JPS60101927 A JP S60101927A JP 20943683 A JP20943683 A JP 20943683A JP 20943683 A JP20943683 A JP 20943683A JP S60101927 A JPS60101927 A JP S60101927A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- substrate
- entrance window
- gas
- airtight container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
〔発I−IIJの技術分野〕
この発IJI41″を光OVD (chemical
vapor deposition)薄膜製造装置の改
良Vこ関するものである。[Detailed description of the invention] [Technical field of I-IIJ] This IJI41'' is optically OVD (chemical
This invention relates to improvements in thin film manufacturing equipment (vapor deposition).
第1図な従来の元CvD薄膜製造装置をホす断面図であ
り、図において、il+は気密容器、(2)は例えば石
英等からなるエネルギー線入射窓、+31 rltエネ
ルギー線、(4)に気密性を保持するためのQ IJソ
ング(61け長面して薄yAヲ形成する時に用いられる
基板で、例えばシリコン、石英ガラス等からなり、(6
)は基板(5)を補助的に7JIJ熱するためのヒータ
を備えた基板ホルダ、(7)ハ例えば5in4. NH
3,N20 等の反応ガスをチャンバ内VC4人する反
応ガス供給管で、反応ガス供給手段(図ボせす)の一部
を構成する。FIG. 1 is a cross-sectional view of a conventional CvD thin film manufacturing apparatus, in which il+ is an airtight container, (2) is an energy beam entrance window made of, for example, quartz, Q IJ song to maintain airtightness (a substrate used when forming a thin YA with a long surface of 61 mm, made of silicon, quartz glass, etc.,
) is a substrate holder equipped with a heater for additionally heating the substrate (5) by 7JIJ; N.H.
A reaction gas supply pipe for supplying a reaction gas such as 3, N20, etc. to four VCs in the chamber constitutes a part of the reaction gas supply means (shown in the figure).
(8)は気密容器ttl内を真空に排気する排気管で、
排気手段(図示せず)の一部を構成する。(8) is an exhaust pipe that evacuates the inside of the airtight container TTL,
It constitutes a part of the exhaust means (not shown).
従来の光OVD薄膜製造装置は上記のように構成され、
例えば気密容器11iの中の基板ホルダ(6)上(で例
えはシリコン、石英カラス等の基板(51を乗せ、排気
管(8)を通して真空ポンダにより気密容器ill内を
真空排気した後、基板ホルダ(6)を例えは200〜3
00°C(300”C以下が望ましい)K加熱すること
により基板i51を加熱し、反応ガス供給f(7)によ
り例えはSiH<、 NH3,N20等の反応ガスを気
密容器(I;に導入し、排気−gi !81にエリ排気
(f−続け、例えは気密容器(1)内を数100mTo
rr 〜数’rorrの圧力Vrc保った後、例えば光
源として水銀ランフ−お工びキセノンラノグ善の宗外光
並びにアルゴンレーザ、C02レーザ、 YAGレーザ
、およびエキシマレーザ等のレーザ光などのエネルギー
m13)をエネルギー線入射窓(21Lり入射させ、エ
ネルギー線のエネルギーにより反応ガス全分解し、例え
ばSi、 5iOs+、 SiN等の薄膜を基板(51
上に堆積させる。A conventional optical OVD thin film manufacturing apparatus is configured as described above.
For example, place a substrate (51 such as silicon or quartz glass) on the substrate holder (6) in the airtight container 11i, and after evacuating the inside of the airtight container ill with a vacuum pumper through the exhaust pipe (8), place the substrate holder An example of (6) is 200 to 3
The substrate i51 is heated by heating at 00°C (preferably 300"C or less) K, and a reactive gas such as SiH<, NH3, N20, etc. is introduced into the airtight container (I) by the reactive gas supply f (7). Then, exhaust - gi!
After maintaining a pressure Vrc of ~ several'rorr, for example, the energy m13) of a mercury lamp, a xenon lamp, or a laser beam such as an argon laser, a C02 laser, a YAG laser, and an excimer laser is used as a light source. The energy beam incident window (21L) is introduced, and the energy of the energy beam completely decomposes the reaction gas, and a thin film of, for example, Si, 5iOs+, SiN, etc. is deposited on the substrate (51L).
deposit on top.
この場合、エネルギー線入射窓(2)ハ入射光を効率よ
く、屈折等なく透過させ、しかも気密容器11i内を真
空排気した場合に、気密容器il+内外の圧力差VCL
る破損、ひすみを生じさせないため肉厚(イ)〜30m
mと厚くし、しかも平面度よくオプティカルフラット而
に研磨しておく必要がある上に、エネルギー線の光源が
水銀ラング、エキシマレーザ光等の紫外光源の場合、透
過率を上けるため、材質として最【両級の合成石英にす
る必要がある。また、エネルギー線がアルゴンレーザ光
のように可視光であっても熱ひすみ等を考慮すれば石英
が望ましい。以上にエリエネルギー線入射窓(2)は非
常に高価な材料となる。しかるに、この光OVD法を行
なった場合、反応カスを導入し、基板(61上に例えは
Si、 SiO2,SiN等を堆積させた時に同時にエ
ネルギー−入射窓(2)の内1RIIにも反応物の一部
が付肯し、エネルギー線の透過率が悪くなるという欠点
があつiこ。し小も、このエネルギー線入射窓(2)に
前述のようにオプティカルフラット而に研磨仕上げして
あり、また場合によってセ透過率金上げるために無反射
コーティングしであることもあり、この汚nを除去する
ために、再研磨、エツチング尋金くり返し行なうことけ
旺されず、靜fたに上i己市価な材料を用いなけれはな
らないという欠点かあ゛りた。In this case, the energy ray entrance window (2) efficiently transmits the incident light without refraction, and when the inside of the airtight container 11i is evacuated, the pressure difference between the inside and outside of the airtight container il+VCL
Wall thickness (A) ~ 30m to prevent damage and distortion.
m thick and needs to be polished to an optically flat surface with good flatness.In addition, if the energy beam source is an ultraviolet light source such as a mercury Lang or excimer laser beam, the material must be made thick to increase transmittance. It is necessary to use synthetic quartz of the highest grade. Further, even if the energy beam is visible light such as argon laser light, quartz is preferable in consideration of thermal distortion. As described above, the energy beam entrance window (2) is made of very expensive material. However, when this optical OVD method is carried out, when the reaction scum is introduced and the substrate (for example, Si, SiO2, SiN, etc. Some of them agree, and there is a drawback that the transmittance of energy rays is poor.However, as mentioned above, this energy ray entrance window (2) is polished to an optically flat surface. In addition, in some cases, anti-reflective coating is applied to increase the transmittance, and in order to remove this stain, it is not recommended to repeatedly perform re-polishing and etching. The drawback was that it required the use of commercially available materials.
この発明は上記従来のものの欠点金除去するためンこな
され1こもので、反応部を有する気密容器、気密性を1
呆持する裏つに上記容器に設け、エネルギー線を上記容
器内に入射させるエネルギー線入射窓、上記容器内を排
気する排気手段、上記容器i8に反応ガスを供給する反
応カス供給手段および上記反応カスに対して不活性なガ
スを上記エネルギー線入射窓の内面を被うようvcl!
Aき出す不活性ガス供給手段を備えたものを用いること
に工り、高価なエネルギー線入射窓を汚すことなく薄膜
金蝦造する薄膜製造装置を提供することを目的とする。This invention has been made to eliminate the drawbacks of the above-mentioned conventional products.
In addition, an energy beam entrance window provided in the container to allow the energy beam to enter the container, an exhaust means to exhaust the inside of the container, a reaction scum supply means to supply a reaction gas to the container i8, and the reaction Vcl so that the inner surface of the energy beam entrance window is covered with a gas that is inert to debris!
It is an object of the present invention to provide a thin film manufacturing apparatus which uses an apparatus equipped with an inert gas supply means for ejecting A, and which can manufacture thin film metal without contaminating an expensive energy beam entrance window.
〔発明の実/1lli例〕
第214)1この発り」の−実施例を不す薄膜製造装置
の一1面図であり、図において、ill〜(8)は第1
図と同様であり、(91は上記反応ガスに対して不活性
な、例えば窒素ガス等の不活性ガスを供給する不活性ガ
ス供給手段で、パルプ1101 金言んでいる。[Acts of the Invention/1lli Example] No. 214) 1 This is a side view of a thin film manufacturing apparatus that does not include the embodiment of ``This Origin'', and in the figure, ill~(8) indicates the
91 is an inert gas supply means for supplying an inert gas such as nitrogen gas, which is inert to the above reaction gas, and refers to the pulp 1101.
上記のように購成された薄膜製造装装置において、第1
図に示す従来例と同様に、気活容器+tlの中の基板ホ
ルダ(6)の上に、例えばシリコン、石英ガラス等の基
板+51を乗せ、排気管18)を通して気密容器fll
内を真空排気する。この時、パルプ1101 !d閉じ
ておく。一方、基板(51は従来例と同様に、例えば、
200〜300′Cに加熱する。気密容器(l:内が必
要真空度に到達した後、排気管(8)にエリ排気を続け
ながら反応ガス供給管(71Kより、例えばSiH4,
NH3゜N20等の反応ガスを導入し、同時にパルプ(
101を開傘、Mlえは窒素ガス号の不活性カスを不活
性ガス供給手段i91 +Cよりエネルギー線入射窓(
2)して唄き出す。次に、気密容4.viII内のガス
圧を、例えばilo。In the thin film manufacturing equipment purchased as described above, the first
Similar to the conventional example shown in the figure, a substrate +51 made of, for example, silicon or quartz glass is placed on the substrate holder (6) in the air-tight container +tl, and then passed through the exhaust pipe 18) to the airtight container full.
Evacuate the inside. At this time, Pulp 1101! d Keep it closed. On the other hand, the substrate (51 is similar to the conventional example, for example,
Heat to 200-300'C. After reaching the required degree of vacuum inside the airtight container (L), while continuing to exhaust the air to the exhaust pipe (8), add the reaction gas supply pipe (from 71K, e.g. SiH4,
A reactive gas such as NH3゜N20 is introduced, and at the same time pulp (
101 is opened, and the inert gas of the nitrogen gas is passed through the energy beam entrance window (
2) Then start singing. Next, airtight volume 4. The gas pressure in viii, for example, ilo.
m’rorr−叔Torr K調整した後、エネルギー
線入射窓f21 k 迎して、エネルギー線(3)を入
射させ、例えはSi r S i N + 0102寺
の薄膜を基板+51上に堆積させる。そう1−ることV
こより、エネルギー線入射窓(2)に吹きつけ之窒素カ
ス等の不活性ガスけOVD反応に寄与せず、基板(51
上1cH必要な薄膜が堆積しt上、エネルギー線入射窓
(2)の内側表面な例えは窒素ガス等の不活性ガスの吹
きつけKより反応物の付着による汚れを防ぐことができ
る薄膜製造装+q f得ることができる。After adjusting m'rorr - Torr K, the energy beam (3) is made incident through the energy beam entrance window f21 k, and a thin film, for example, Si r Si N + 0102, is deposited on the substrate +51. So 1- thing V
Therefore, the inert gas such as nitrogen scum blown onto the energy beam entrance window (2) does not contribute to the OVD reaction, and the substrate (51
After the required thin film is deposited for 1 cH, the inner surface of the energy beam entrance window (2) is sprayed with an inert gas such as nitrogen gas to prevent contamination due to adhesion of reactants. +q f can be obtained.
又、不活性カス供給手段(9)によりエネルギー線入射
窓+21 K噴き出し定年活性ガスを不活性カス供給手
段に対応した位置に設けた排気手段(でより排気するい
わゆるエアーカーテンによっても上記と同様の効果が得
られる。In addition, the same method as above can also be used by using a so-called air curtain that exhausts the energy ray entrance window +21 K by the inert scum supply means (9) and exhausts the retirement active gas by means of an exhaust means (located at a position corresponding to the inert scum supply means). Effects can be obtained.
以上説IJシたとおり、この発明は反応部を有する気密
容器、気密性を1呆侍するように上記容器に設け、エネ
ルギー線を上記容器内に入射させるエネルギー線入射窓
、上7尼容器内を排気するJJI’気手段、上記容器1
/4 i7こ反応ガスを供給する反応カス供給手!およ
び上記反応ガスに対して不l占性なガスを上記入射窓の
内面を被うように嘔さ出す不活性ガス供給手段を備えた
ものを用いることにより、高価なエネルギー線入射窓を
汚すことなく薄膜全製造する薄膜製造装置を得ることが
できる0As stated above, the present invention relates to an airtight container having a reaction section, an energy beam entrance window provided in the container to ensure airtightness and for allowing energy rays to enter the container, and an energy beam entrance window in the container. JJI' air means to exhaust the above container 1
/4 i7 This is the reaction waste supplier who supplies the reaction gas! and contaminating the expensive energy beam entrance window by using a device equipped with an inert gas supply means that discharges a gas that is non-occupying with respect to the reaction gas so as to cover the inner surface of the entrance window. It is possible to obtain a thin film manufacturing apparatus that can manufacture all thin films without
第1図は従来の薄)J14製造装置の…「面図、第2図
μこの発14の一実施例の薄膜製造装置の断面図である
。
図において、(11は気密容器、(2)にエネルギー線
入射窓、:3)けエネルギー線、(4)に気密性を保持
するための0リング、(5)け表面K flj膜荀形成
する時用いられる基板、+61 f′i基版i51を補
助的に加熱するためのヒータを備えた基板ホルダ、(7
1は反応カス供給手段、+S+ f′i排気手段、(9
)ケ不活性ガス供給手段、(10)はパルプである。
f−お、谷国中同−付りけ同−又け1(]当当部分水す
ものとする。
代理人 大 宕 墳 雄Figure 1 is a side view of a conventional thin film manufacturing apparatus, and Figure 2 is a sectional view of a thin film manufacturing apparatus according to an embodiment of this invention. Energy ray entrance window: 3) Energy ray, (4) O-ring for maintaining airtightness, (5) Substrate used when forming surface K flj film, +61 A substrate holder equipped with a heater for supplementary heating (7)
1 is a reaction scum supply means, +S+f'i exhaust means, (9
) Inert gas supply means (10) is pulp. f-O, Tanikuni Junior High School-Duke-Dou-Matake 1 () The current portion shall be watered down. Agent: Ogo Tsumuo
Claims (1)
ように上、i!、容器に設け、エネルギー線を上記容器
内に入射させる工不ルキー線入射窓、上記容器内金排気
する排気手段および上記容器内に反応ガスを供給する反
応カス供給手段全歯え友ものVC君いて、上記反応カス
に対して不活性なガス全上記入射窓の内面を被うように
噴き出す不活性ガス供給手段を具備し7こことを特徴と
1″る薄膜製造装置。(1: An airtight container for the reaction part+i, an airtight container provided on the top to maintain airtightness, an input window for energy rays to enter the container, and an exhaust means for exhausting the inside of the container. and a reaction scum supply means for supplying a reaction gas into the container, and an inert gas supply means for blowing out an inert gas against the reaction scum so as to cover the inner surface of the upper entrance window. A thin film manufacturing device equipped with 7 features and 1".
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20943683A JPS60101927A (en) | 1983-11-07 | 1983-11-07 | Apparatus for producing thin film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20943683A JPS60101927A (en) | 1983-11-07 | 1983-11-07 | Apparatus for producing thin film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60101927A true JPS60101927A (en) | 1985-06-06 |
Family
ID=16572826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20943683A Pending JPS60101927A (en) | 1983-11-07 | 1983-11-07 | Apparatus for producing thin film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60101927A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100511599B1 (en) * | 2003-07-08 | 2005-08-31 | 동부아남반도체 주식회사 | Preliminary maintenance of rapid thermal process chamber |
JP2010177239A (en) * | 2009-01-27 | 2010-08-12 | Tatsumo Kk | Semiconductor wafer treatment apparatus |
-
1983
- 1983-11-07 JP JP20943683A patent/JPS60101927A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100511599B1 (en) * | 2003-07-08 | 2005-08-31 | 동부아남반도체 주식회사 | Preliminary maintenance of rapid thermal process chamber |
JP2010177239A (en) * | 2009-01-27 | 2010-08-12 | Tatsumo Kk | Semiconductor wafer treatment apparatus |
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