JPS5991790U - Printed board mounting equipment for semiconductor devices - Google Patents
Printed board mounting equipment for semiconductor devicesInfo
- Publication number
- JPS5991790U JPS5991790U JP18704782U JP18704782U JPS5991790U JP S5991790 U JPS5991790 U JP S5991790U JP 18704782 U JP18704782 U JP 18704782U JP 18704782 U JP18704782 U JP 18704782U JP S5991790 U JPS5991790 U JP S5991790U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- semiconductor devices
- board mounting
- mounting equipment
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置のプリント板の取付装置を示
す斜視図、第２図は本考案の実施例によるプリント板取
付装置の外観斜視図、第３図はそのＸ−Ｘ断面図である
。
１・・・・・・半導体素子、２・・・・・・導体バー、
３・・・・・・プリント板、４・・・・・・スペーサ、
５・・・・・・ねじ、６・・・・・・ナツト、７・・・
・・・装着ナツト、８・・パ・・・ねじ。FIG. 1 is a perspective view showing a conventional printed board mounting device for a semiconductor device, FIG. 2 is an external perspective view of a printed board mounting device according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line X-X. . 1... Semiconductor element, 2... Conductor bar,
3...Printed board, 4...Spacer,
5...Screw, 6...Nut, 7...
... Mounting nut, 8... Pa... screw.
Claims (1)
あけ、その穴にバーの下方より装着ナツトを取付け、こ
の装着ナツトにプリント板を、そのランド部を貫通させ
るねじによって取付けるようにしたことを特徴とする半
導体装置のプリント板取付装置。A hole is made in a conductor bar arranged between semiconductor elements of a semiconductor device, a mounting nut is attached to the hole from below the bar, and a printed circuit board is attached to this mounting nut with a screw passing through the land part. A printed board mounting device for semiconductor devices, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18704782U JPS5991790U (en) | 1982-12-10 | 1982-12-10 | Printed board mounting equipment for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18704782U JPS5991790U (en) | 1982-12-10 | 1982-12-10 | Printed board mounting equipment for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5991790U true JPS5991790U (en) | 1984-06-21 |
Family
ID=30403854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18704782U Pending JPS5991790U (en) | 1982-12-10 | 1982-12-10 | Printed board mounting equipment for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5991790U (en) |
-
1982
- 1982-12-10 JP JP18704782U patent/JPS5991790U/en active Pending
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