JPS5982755A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5982755A
JPS5982755A JP57192455A JP19245582A JPS5982755A JP S5982755 A JPS5982755 A JP S5982755A JP 57192455 A JP57192455 A JP 57192455A JP 19245582 A JP19245582 A JP 19245582A JP S5982755 A JPS5982755 A JP S5982755A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealing plate
sealing
cooling body
cylindrical body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57192455A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258664B2 (enExample
Inventor
Satoshi Mikami
三上　訓
Kenji Iimura
飯村　健二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57192455A priority Critical patent/JPS5982755A/ja
Publication of JPS5982755A publication Critical patent/JPS5982755A/ja
Publication of JPS6258664B2 publication Critical patent/JPS6258664B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57192455A 1982-11-04 1982-11-04 半導体装置 Granted JPS5982755A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57192455A JPS5982755A (ja) 1982-11-04 1982-11-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57192455A JPS5982755A (ja) 1982-11-04 1982-11-04 半導体装置

Publications (2)

Publication Number Publication Date
JPS5982755A true JPS5982755A (ja) 1984-05-12
JPS6258664B2 JPS6258664B2 (enExample) 1987-12-07

Family

ID=16291582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57192455A Granted JPS5982755A (ja) 1982-11-04 1982-11-04 半導体装置

Country Status (1)

Country Link
JP (1) JPS5982755A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920119A (en) * 1996-02-22 1999-07-06 Hitachi, Ltd. Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920119A (en) * 1996-02-22 1999-07-06 Hitachi, Ltd. Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability

Also Published As

Publication number Publication date
JPS6258664B2 (enExample) 1987-12-07

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