JPS5975642A - Positioning device for parts - Google Patents

Positioning device for parts

Info

Publication number
JPS5975642A
JPS5975642A JP18699882A JP18699882A JPS5975642A JP S5975642 A JPS5975642 A JP S5975642A JP 18699882 A JP18699882 A JP 18699882A JP 18699882 A JP18699882 A JP 18699882A JP S5975642 A JPS5975642 A JP S5975642A
Authority
JP
Japan
Prior art keywords
positioning
pellet
pedestal
component
pawls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18699882A
Other languages
Japanese (ja)
Inventor
Yoshio Terasaka
寺坂 良夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP18699882A priority Critical patent/JPS5975642A/en
Publication of JPS5975642A publication Critical patent/JPS5975642A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To position the parts regardless of the size of the parts only by providing a pair of positioning means by installing a position detector detecting the quantity of displacement of the part on a cradle to a reference position and a moving means, which moves the part only by the quantity of displacement and conforms the center of the part to the reference position. CONSTITUTION:Pawls 3 for positioning are brought into contact with the opposite side surfaces of an IC pellet 1 to position the pellet. The quantity of the IC pellet 1 displaced to the reference position is measured indirectly by the position detector consisting of a beam irradiator 13, a light-receptor 12 and a position detecting circuit 14 in the direction orthogonal in the direction of advance or retreat of a drive base 4, and a sucking base 2 sucking the IC pellet 1 is slid and positioned. Accordingly, even IC peelets extending over a large size from a small size can be positioned by using the pawls 3 of one kind because they can be positioned by the pawls 3, two thereof are paired, the nose sections of the pawls 3 need not be made small, and the damage of the IC pellets 1 can be prevented.

Description

【発明の詳細な説明】 U発明の技術分野] 本発明は部品例えばICCペッツ〜をダイポンプイング
ツる工程に好適する部品の位置決め装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a component positioning device suitable for the process of die pumping components such as ICC PETZ.

[発明の技術的背鎮1 1cベレッ1−をハイブリッドIC用回路基板またはリ
ードフレーム等にダイボンディングづる場合、このダイ
ボンディング位置精度を十分なしのと覆るために、IC
ベレン1〜を一度位置決め装置に移送して正確な位置出
しをしたうえC1回路基板やリードフレーム上に八〇 
−3i :・(品法や樹脂接着剤法等によりダイボンデ
ィングすることか行われている。
[Technical backbone of the invention 1 When die bonding the 1c bellet 1- to a hybrid IC circuit board or lead frame, it is necessary to
Once Belen 1~ is transferred to the positioning device for accurate positioning, it is placed on the C1 circuit board or lead frame.
-3i:・(Die bonding is performed using the product law or the resin adhesive method.

従来、このようなダイボンディング上程におい−C用い
られる位置決め装置としCは、第1図に示す゛ように、
ICペレット1を載せる吸着台2の周囲にこの吸着台2
を挾んで対向づる位置決め用爪3を二組直交するように
配置1q−3するとともにこの位置決め用爪3を駆動台
4に取付G〕、この位置決め用爪3をaいに吸着台2十
のICペレット1の対向側面に向り−C当接および隙間
りるように進退動iす能に構成したものが知られCいる
Conventionally, the positioning device C used in the die bonding process is as shown in FIG.
This suction table 2 is placed around the suction table 2 on which the IC pellet 1 is placed.
Arrange two pairs of positioning claws 3 facing each other in a perpendicular manner 1q-3, and attach the positioning claws 3 to the drive base 4 (G). There is a known structure in which the IC pellet 1 can be moved forward and backward so as to come into contact with the opposite side surface of the IC pellet 1 and to make a gap therebetween.

なお、祠号5は吸着台2上の位置決めされたlCCベン
ツ−1を吸着しC回路基板(図示省略)等に移送Jる搬
送ピックアップである。
Incidentally, numeral 5 is a transport pickup that picks up the ICC Benz-1 positioned on the suction stand 2 and transfers it to a C circuit board (not shown) or the like.

このような位置決め装置は、吸着台2」−にICペレッ
ト11を載置しにの吸着台2に取付1ノられだ吸気パイ
プ(図示省略)の吸気によっC吸着台21゜−にICペ
レッ]・1を吸着さμ、対向りる二相の117同決め用
爪3をICベレット11の4側面に向かつ(前進さけ1
4個の位置決め用爪3の先端をICCベンツ−1の側面
に当接させることによりIOベレット1を所定の位置に
位置決めJる。その後、吸気パイプの吸気を停止さけ一
1吸着台2」−のICペレット11を搬送ピックアップ
!5にJ、っ(゛吸着しζ回路基板」−に移送する。
Such a positioning device is attached to the suction table 2 to place the IC pellet 11 on the suction table 2, and then the IC pellet is placed on the C suction table 21° by suction from an intake pipe (not shown). ]・1 is sucked μ, and the opposing two-phase 117 determining claws 3 are directed toward the 4 sides of the IC pellet 11 (advance hook 1
The IO pellet 1 is positioned at a predetermined position by bringing the tips of the four positioning claws 3 into contact with the side surface of the ICC vent-1. After that, stop the intake of air from the intake pipe, and transport and pick up the IC pellet 11 on the suction table 2! 5. Transfer it to J ('adsorb and ζ circuit board').

1背M技fljの問題点1 しかしながら、このにうに構成された従来の部品の位置
決め装置は、4個の位置決め用爪3を2組直交づるよう
に配置して4方向から位置決めするよう構成されCいる
のC゛、位置決めしようとりるICペレッ]〜1の形状
が変ると、それぞれのICCペッツ−1の寸法に応じた
位置決め用爪3をそれぞれ駆動台4に(lt〕換えなり
れぽならない。
Problem 1 of 1 Back M Technique Flj However, the conventional component positioning device configured in this manner is configured to position two sets of four positioning claws 3 perpendicularly to each other and perform positioning from four directions. When the shape of the IC pellets to be used for positioning changes, the positioning claws 3 corresponding to the dimensions of each ICC pellets 1 are replaced with drive bases 4 (lt). .

そのため、取扱いが煩雑となって作業性が向上しないば
かりか、複数種類の位置決め用爪3を予め用意しなりれ
ばならないので′:1ストの上昇を招き易い欠点がある
Therefore, not only is handling complicated and workability not improved, but also a plurality of types of positioning pawls 3 must be prepared in advance, which has the disadvantage of easily causing an increase in stroke length.

なiJ3.4個の位置決め用爪3の先端部を小さくする
ことにより、小形から人形のICペレット1まひ1種類
の11′L置決め用爪3によっC位置決め可能に構成り
ることも提案されCいるが、ぞれぞれの位置決め用爪ご
3の先端部を小さくすると、大形のICペレット1の位
置決め操作時に、ICペレット1の側面に極部的な力が
加わってICCペッツへ1が欠ける等の損傷が生じ易く
、歩留りを低下させるIII点がある。
It is also proposed that by making the tips of the four positioning claws 3 smaller, it is possible to position IC pellets from small to dolls using one type of 11'L positioning claw 3. However, if the tip of each positioning claw 3 is made smaller, when positioning the large IC pellet 1, a local force is applied to the side of the IC pellet 1, causing the IC pellet to fall into the ICC pellet. There is a point III where damage such as chipping of 1 is likely to occur and the yield is reduced.

[発明の1]的] 本発明はこのJ、うな従来の欠点を解決づるためになさ
れたもので、小形から人形の部品まで正確かつ部品にt
f140をIjえることなく部品の位置決めがぐきる部
品の位置決め装置の提供を目的どりる。
[Objective 1 of the Invention] The present invention has been made to solve the above-mentioned drawbacks of the conventional technology.
It is an object of the present invention to provide a component positioning device that can position the component without changing f140.

[発明のIK要] この目的を達成JるICめに本発明は、部品の載置され
る受台と、この受台上の部品を挟接可能にIjいに進退
動りる一組の位置決め手段と、この位置決め手段の進退
動方向と自交する方向におい−(予め定められi: 阜
fllG位置に対りる上記受台上の部品の偏位量を検出
する位置検出装置と、この位置検出装置によつで上記受
台を前記偏位01だ(〕移動さけ〔上記も’i ’1’
 t<lviに上記部品を一致さlる移動1一段とを具
備1)(なることを特徴とりる。
[Key Points of the Invention] In order to achieve this object, the present invention provides a pedestal on which components are placed, and a set of pedestals that move forward and backward in order to clamp the components on the pedestal. a positioning means, a position detection device for detecting the amount of deviation of the component on the pedestal with respect to a predetermined position in a direction orthogonal to the forward and backward movement direction of the positioning means; The position detection device moves the pedestal to the deviation 01.
1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (characterized in that it is) that the above-mentioned parts are moved 1 and 1 that match t<lvi;

「発明の実施例1 」メト本発明の訂細を図面を参照しU 12明する。“Embodiment 1 of the invention The details of the present invention will be explained with reference to the drawings.

なJ5従来例を共通づる部分には同一の符号を(=J 
?l’。
The same reference numerals are given to the parts that are common to the J5 conventional example (=J
? l'.

り)2図は本発明の部品の位置決め装置の一実施例を、
部品としてICCベンツ−を例にしで示づ斜視図ひある
。図において基台6上には移動台7がスラrド1−iJ
能に配置されCいる。この移動台7は、基台6上に間隔
をおい゛C0段ミノれた一対の平行なガイド部8上に移
動台7+部に設()られた支持杆9を嵌合けC1支持柱
9がガイド部8を移動することによりスライド可能にな
つ′(いる。
Figure 2 shows an embodiment of the component positioning device of the present invention.
This is a perspective view showing an example of an ICC Benz as a part. In the figure, a movable table 7 is placed on the base 6 to slide the slider 1-iJ.
It is placed in the function C. This movable base 7 is constructed by fitting support rods 9 provided on the movable base 7+ onto a pair of parallel guide portions 8 spaced apart from each other by C0 steps on the base 6. becomes slidable by moving the guide section 8.

移動台7の中央部子方には、例えはガラス材料等からな
る透光性の良好な吸着台2が移動台7と所定の間隔をお
い【載置されている。この吸着台2の中火部には表裏面
を貝通りる吸気孔10が穿設されC’J3す、吸着台2
の側面に取イ」りられた吸気パイプ11とその吸気孔1
0の内壁面が連通しCいる。
A suction table 2 made of, for example, a glass material and having good translucency is placed on the central side of the movable table 7 at a predetermined distance from the movable table 7 . The medium heat part of this suction table 2 is provided with an intake hole 10 that passes through the shell on the front and back surfaces.
Intake pipe 11 and its intake hole 1 taken out on the side of
The inner wall surface of 0 is in communication with C.

移動台7ど吸着台2間には、吸着台2の]−面に向かい
かつ吸気孔10を横切るJ、うに直線的に配置された受
光装置12が配置されCいる。この受光装置12は、直
線的に配列されたノ第1−1〜ランジスタ等からなり、
後述−リ゛るJ、うに光熱In装置13から照射された
光によつ(生ずるICペレット1の陰影に什う信号を出
力りる構成をイjしCいる。
A light receiving device 12 is disposed between the movable table 7 and the suction table 2, and is arranged linearly toward the negative side of the suction table 2 and across the intake hole 10. This light receiving device 12 is composed of linearly arranged transistors, etc.
As will be described later, a configuration is described in which a signal corresponding to the shadow of the IC pellet 1 produced by the light irradiated from the photothermal In device 13 is output.

吸着台2上側には搬送ピックアップ5が、また搬送ピッ
クツ2ツブ5上方には光照IJJ装置13がイれぞれ吸
着台2の吸気孔10と共軸的に支持部段(図示せず)に
よつζ配置され−Cいる。
A transport pickup 5 is mounted above the suction table 2, and a light IJJ device 13 is mounted above the transport pick 2 knob 5, coaxially with the suction hole 10 of the suction table 2 on a support stage (not shown). It is arranged as ζ and -C.

搬送ビックシフツブ5は降下し−(吸着台2上に吸着さ
れたICCペッツ−1を吸着し−C上昇し、図示を省略
しIC回路基板やリードフレームにI Cペレット1を
移送する(幾重を有し、また光照銅装置13は十ツノか
ら吸着台2に向【〕°C光を照射りる構成を右しCいる
The transport big shifter 5 descends, adsorbs the ICC pellets 1 on the suction table 2, and rises to transfer the IC pellets 1 to an IC circuit board or lead frame (not shown). In addition, the light illumination device 13 is configured to irradiate the suction table 2 with []°C light from a tenth point.

移動台7上におい゛C吸着台2を挾むように一対の駆動
台4が配置されCおり、この駆動(′14には位置決め
用爪33がそれぞれ取(=J&〕られて位置決め手段を
構成し’CA3つ、各位置決め用爪3の失明は吸着台2
に吸着されたICCペレッ1〜1対向側面に当接可能に
なつCいる。
A pair of drive bases 4 are arranged on the movable base 7 so as to sandwich the suction base 2, and a positioning claw 33 is attached to each of the drive bases 14 (=J&) to constitute a positioning means. 3 CAs, blindness of each positioning claw 3 is suction table 2
It becomes possible for the ICC pellets 1 to 1 to come into contact with the opposite side surface.

41’?同決め用爪3を取(=J IJだ一対の駆動台
4は、に記吸着台2の下に配置された受光装置12と直
交りる方向に進退動可能になっており、Hいに連動しC
矢↑qのように位置決め用爪3先端がICぺ1ノット1
の対向側面を挾むJ、うに当接(挟接)し、またICC
ペレット1ら離間Jるにうに構成されくいる。l 受光装置12の出力端には位置検出回路14が接続され
−(おり、位置検出回路14の出力端にはモータ15が
接続されCいる。位置検出回路14は、受光装置612
からのICCペッツ−1の陰影に伴う信号を処理し、例
えば吸気孔10を基準位置どした場合にICCペッツ−
1の中心を演算しCそ    ゛の中心との偏位的を演
痒処理し、制御信号を出力づる構成を右しCいる。
41'? Remove the determining claw 3 (= J IJ). Interlocking C
As shown by arrow ↑q, the tip of positioning claw 3 is IC pin 1 knot 1
J sandwiching the opposite side of the sea urchin (pinching contact), and also the ICC
The pellets 1 and 1 are arranged in a uniform manner. A position detection circuit 14 is connected to the output end of the light receiving device 12, and a motor 15 is connected to the output end of the position detection circuit 14.
For example, when the intake hole 10 is placed in the reference position, the signal accompanying the shadow of ICC Pez-1 is processed.
The center of C is calculated, the deviation from the center of C is calculated, and a control signal is output.

モータ15は、位置検出回路14からの一位量に伴う制
御信号にj、って動作軸16を前接方向の微少進退動に
変換づる。その動作@16は移動台7F面に設りられた
ゾラケツ1〜17にねじ込まれ℃いる。
The motor 15 converts the operating axis 16 into minute forward and backward movements in the forward direction in response to a control signal associated with the one-place quantity from the position detection circuit 14. The operation @16 is performed by screwing into the brackets 1 to 17 provided on the surface of the moving table 7F.

動作軸16とカイト部8は平行に配置され’C83す、
位置検出回路14からの制御信号によるモータ15の動
作にイ゛:′つC1動作軸16の回転を介しC移動台7
がスライド動作する。
The operating axis 16 and the kite section 8 are arranged in parallel,
The motor 15 operates according to the control signal from the position detection circuit 14.
slides.

次に、このように構成された位置決め装動の操作を説明
する。
Next, the operation of the positioning device configured as described above will be explained.

まず、ICペレット1を吸着台2上に吸気孔10が隠れ
るJ、うに載置し、吸気パイプ10′c吸気孔10内を
吸気(〕(10ペレツ]〜1を吸着台2圭に吸iさUる
First, place the IC pellet 1 on the suction table 2 in a position where the intake hole 10 is hidden, and suck air (10 pellets) into the suction table 2 through the intake pipe 10'c. Let's go.

次いひ、対向りる駆動台4を動作さU(位li9決め用
爪3を吸着台2上の1(ンペレツト1の対向側面に向り
(jU接さμ、Icベレツ1へ1の対向側面に位置決め
用爪3をくれぞれ挟接さU゛る。
Next, operate the opposing drive stand 4 and move the positioning claw 3 to the opposite side surface of the sample plate 1 on the suction table 2 (jU contact μ, Ic plate 1 to the opposite side surface of 1) The positioning claws 3 are sandwiched between them.

1i(=つく、対向°りる位置決め用爪3が所定の割合
(゛ICベレッ]・1の対向側面に挟接ずれば、ICべ
IノッI・1は駆動台4の進退動方向におりる所定位置
に位置されることとなる。
1i (=attached, opposing degrees) If the positioning pawl 3 is shifted to the opposite side of the IC bevel 1 by a predetermined ratio, the IC bevel I notch 1 will be in the forward/backward movement direction of the drive base 4. It will be located at a predetermined position.

ての俊、光熱用装置13から光を照射さけ、受光装置゛
12によつC駆動台4の進退動方向に直交りる方向にa
31JるICCペッツ−1の陰影を測定し電気信号に変
換しC位U検出回路140信号処理さμる。
At the same time, the light is emitted from the photothermal device 13, and the light receiving device 12 is used to move a direction perpendicular to the forward and backward movement direction of the C drive base 4.
The shading of ICC PETZ-1 at 31J is measured and converted into an electrical signal, which is then processed by the C position U detection circuit 140.

(r/it’?検出回路14 k: d3 (、N ’
CIJ I CヘLi y h 1 (7)陰影に伴う
信号を処理しCICペレツ1へ1の中心を演9i L/
、吸気孔10に対りるI Cペレット1の中心の一位量
に応じた゛電気信号を制御信号とじてモータ15に出力
づる。モータ15は制御信号によっ′C動作軸16を正
逆回転し、移動台7が前進もしくは後退しCスライドす
る。
(r/it'? Detection circuit 14 k: d3 (,N'
(7) Process the signal associated with the shadow and transfer the center of 1 to CIC Perez 1 (9i L/
, an electrical signal corresponding to the amount of the center of the IC pellet 1 relative to the intake hole 10 is outputted to the motor 15 as a control signal. The motor 15 rotates the C operation shaft 16 forward and backward in response to a control signal, and the movable table 7 moves forward or backward and slides.

ぞの結果、吸む台2」二のICベレン1〜1は、駆動台
4の進退動方向と直交りる方向においCも基準位置と一
奴することとなり、ICペレット1の位置決めが完了す
る。
As a result, the IC pellets 1 to 1 on the suction stand 2'2 are also aligned with the reference position C in the direction orthogonal to the forward and backward movement direction of the drive stand 4, and the positioning of the IC pellet 1 is completed. .

ICペレット1の位置決めが完了すると、吸気バイブ1
1の吸気を停止さけ、110送ピツクアツプ5を降下さ
t! ’U I Cペレット1を吸着し−C上昇し、回
路基板等に移送する。
When the positioning of IC pellet 1 is completed, the intake vibe 1
Avoid stopping the intake of 1, and lower the 110 feed pick-up 5! 'U I C pellet 1 is adsorbed, -C is lifted, and transferred to a circuit board, etc.

このように本発明の部品の位置決め装置は、ICCペッ
ツへ1の対向する側面に位置決め用爪3を当接させて位
1ri決めりるどどもに、イの位置決め方向に直交づる
方向りなわら駆動台4の進退動方向に直交りる方向にお
いCは、光熱用装置13、受光装置13および位置検出
回路14からなる位置検出回路によって間接的に基準位
置に対震るICCペレット1の(財)位置を測定し、I
CCペッツ−1を吸着した吸着台2をスライドさけるこ
とによ−)c位置決めする。
In this way, the component positioning device of the present invention is configured such that the positioning claw 3 is brought into contact with the opposing side surface of the ICC PET and the positioning claw 3 is positioned. In the direction perpendicular to the forward and backward movement direction of the platform 4, the ICC pellet 1 is indirectly vibrated against the reference position by a position detection circuit consisting of a photothermal device 13, a light receiving device 13, and a position detection circuit 14. Measure the position, I
By sliding the suction table 2 that has adsorbed the CC PETZ-1, the position is determined.

そのため、従来のJ、うに4個の位置決め用爪33を用
いることなく2個−相の位置決め用爪3にJ、つ(IC
ペレット−1の位置決めが可能eあるから、小形から人
形のICCペッツへ1の位置出しにおいく、1種類の位
1m決め用爪ご3を用い(°位置決めがiiJ能となり
、位置決め用爪3の先端部を小さくする必要がないので
、ICCペッツ〜1の損11を防止Jることが可能とな
る。
Therefore, instead of using the conventional four positioning claws 33, the two-phase positioning claws 3 can be
Since it is possible to position the pellet-1, use the positioning claw 3 for positioning one type of 1m position from the small to the doll's ICC Pez. Since there is no need to reduce the size of the tip, it is possible to prevent the loss 11 of ICC PETZ~1.

また、−1−)ホの実施例にa3い−(は、ICペレッ
ト1の基準位置に対りる偏位量を検出づる位置検出装置
としで、光照用装置13、受光装置12a3よび位置検
出回路1/lによっ【構成する例を説明したが、吸着台
2のICCペッツ−1との当接面に多数の独立したセン
勺−電極を形成し、ICCペッツ〜1の載14位置おJ
、び形状tこ応じた電気16号を取出しく位置検出回路
14ぐ処理する構成も可能ぐある。
In addition, in the embodiment of -1-)E, a3-(A) is a position detection device that detects the amount of deviation of the IC pellet 1 with respect to the reference position, and includes a light illumination device 13, a light receiving device 12a3, and a position detection device. Although we have explained an example of the configuration using the circuit 1/l, a large number of independent sensing electrodes are formed on the contact surface of the suction table 2 with the ICC PET-1, and the ICC PET-1 is placed at 14 positions. J
A configuration is also possible in which the position detection circuit 14 processes the electric number 16 according to the shape of the electric wire.

なお、本発明の実施にあたっ(は、上)ホのICCペッ
ツ〜1に限らず電子部品その他一般的な部品の位置出し
に広く応用可能ぐある。
In carrying out the present invention, the present invention is not limited to the ICC PET-1 mentioned above, but can be widely applied to the positioning of electronic components and other general components.

[発明の効果1 以上説明したように本発明の部品の位置決め装置は、部
品の戟]6される受台」二の部品を挟接可能にnいに進
退動り−る一組の位置決め手段と、この位置決め手段の
進退動方向と直交づる方向においC予め定められtc基
fit位問に対する上記受台上の部品の偏位量を検出J
−る位置検出装置dと、この位置検出装置によっC上記
受台を上記偏位量だけ移動させC上記基準位置に上記部
品の中心を一致さける移動手段とを具備したので、位置
決め用爪等からなる一組の位置決め手段を尚えるだけC
部品の(i’!置決めが可能となる。
[Effects of the Invention 1] As explained above, the component positioning device of the present invention includes a set of positioning means that moves forward and backward in order to be able to clamp the components. Then, detect the amount of deviation of the component on the pedestal with respect to the predetermined position C in a direction perpendicular to the forward and backward movement direction of the positioning means.
- a position detecting device d, and a moving means for moving the pedestal by the amount of deviation using the position detecting device, and aligning the center of the component with the reference position, so that the positioning claw etc. C
Parts can be placed (i'!).

また、位置決め手段の先端部を小形化する必要がないか
ら、人形の部品の位置決めにおいC部品の損1ねを防止
づることがnI能となる。
Further, since there is no need to downsize the tip of the positioning means, it is possible to prevent damage to the C part when positioning the parts of the doll.

さらに、位置決め手段の進退勤力向に直交りる方向にあ
っては、位置決め手段J:りも速く位置決めが可能どな
るのC゛、位置決め能率が向上°りる。
Furthermore, in the direction perpendicular to the direction of movement of the positioning means, the positioning efficiency can be improved because positioning can be performed more quickly than the positioning means J.

【図面の簡単な説明】[Brief explanation of drawings]

第′1図は従来の部品の位置決め装置を7J(づ斜視図
、第2図は本発明の部品の位置決め装置の一実施例を示
1斜視図ひある。 1・・・・・・・・・・・・部品(ICペレット)2・
・・・・・・・・・・・吸着台 3・・・・・・・・・・・・位置決め手段(位置決め用
爪)4・・・・・・・・・・・・駆動台 5・・・・・・・・・・・・1般送ピツクアツプ6・・
・・・・・・・・・・基台 7・・・・・・・・・・・・移動台 8・・・・・・・・・・・・ガイド部 9・・・・・・・・・・・・支持杆 11・・・・・・・・・・・・吸気パイプ12・・・・
・・・・・・・・位1rイ検出装置(受光装置)13・
・・・・・・・・・・・位置検出装置(光照射装置)1
/l・・・・・・・・・・・・位置検出装置(位置検出
装置)15・・・・・・・・・・・・移動手段(モータ
)代理人弁理十   須 山 仏 − 第1図 (ミ
Fig. 1 is a perspective view of a conventional parts positioning device, and Fig. 2 is a perspective view of an embodiment of the parts positioning device of the present invention.・・・・Parts (IC pellet) 2・
......... Suction table 3 ...... Positioning means (positioning claw) 4 ...... Drive table 5・・・・・・・・・・・・1 General pick up 6...
......Base 7...Movement table 8...Guide section 9... ...Support rod 11...Intake pipe 12...
・・・・・・・・・Position 1r A detection device (light receiving device) 13・
......Position detection device (light irradiation device) 1
/l・・・・・・・・・Position detecting device (position detecting device) 15・・・・・・・・・・・・Transportation means (motor) attorney Patent attorney Jusuyama Buddha - 1st Figure (mi)

Claims (2)

【特許請求の範囲】[Claims] (1)部品の載置される受台と、この受台上の部品を挟
接可能にUいに進退動する一相の位置決め手段と、この
位置決め手段の進退動方向と直交りるIノ向にa3い(
予め定められたI Qu位置に対りる前記受台上の部品
の偏位量を検出づる位置検出装首ど、この位圓検出装侃
にJ、っで前記受台を前記偏位…だ【J移動させC前記
基準位置に前記部品を一致さける移動手段とを具備しC
なることを特徴と覆る部品の位置決め装置。
(1) A pedestal on which a component is placed, a one-phase positioning means that moves forward and backward in a U direction so that the component on the pedestal can be clamped, and an I-phase positioning device that moves orthogonally to the direction of movement of this positioning means. A3 in the direction (
A position detection device that detects the amount of deviation of the component on the pedestal with respect to a predetermined IQ position is used to detect the deviation of the component on the pedestal. [Moving means for moving the part to align the part with the reference position;
A positioning device for covering parts.
(2)受台が透光性の良好な材料からなり、位置検出装
置が前記受台を挾んぐ対設された光照射装置ど受光装置
を備えるとともに、前記光照射装置からの光照射によっ
−C前記受光装置で検出された前記受台上の部品の陰影
から偏位量を検出りるよう構成されCなることを特徴と
する特n請求の範囲第1項記載の部品の位置決め!!i
同。
(2) The pedestal is made of a material with good translucency, and the position detection device is provided with a light irradiation device and a light receiving device installed oppositely to hold the pedestal, and the pedestal is made of a material with good translucency. The positioning of a component according to claim 1, characterized in that it is configured to detect the amount of deviation from the shadow of the component on the pedestal detected by the light receiving device! ! i
same.
JP18699882A 1982-10-25 1982-10-25 Positioning device for parts Pending JPS5975642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18699882A JPS5975642A (en) 1982-10-25 1982-10-25 Positioning device for parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18699882A JPS5975642A (en) 1982-10-25 1982-10-25 Positioning device for parts

Publications (1)

Publication Number Publication Date
JPS5975642A true JPS5975642A (en) 1984-04-28

Family

ID=16198410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18699882A Pending JPS5975642A (en) 1982-10-25 1982-10-25 Positioning device for parts

Country Status (1)

Country Link
JP (1) JPS5975642A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5485678A (en) * 1977-12-20 1979-07-07 Canon Inc High accuracy alignment method for air bearing guide system xy stage

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5485678A (en) * 1977-12-20 1979-07-07 Canon Inc High accuracy alignment method for air bearing guide system xy stage

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