JP2600048Y2 - High precision IC alignment mechanism - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-precision IC alignment mechanism capable of accurately positioning an IC to be measured with respect to an IC socket in an IC handler for transferring and pressing an IC to an IC socket.

[0002]

2. Description of the Related Art The configuration of a conventional IC alignment mechanism is as follows.
This will be described with reference to FIGS. First, the IC hand 1 is mounted on the XY table 4 and the IC hand 2
Is sucked, conveyed to the IC socket 10, and pressed against the IC socket 10 to inspect the electrical characteristics of the IC 2. The IC hand 1 sucks the IC 2 and moves onto the device camera 11, and the camera 11 and the center position of the IC 2
Is calculated with respect to the center position.

[0003] Next, as shown in FIG.
The hand camera 12 moves onto the C socket 10 and at this position, the hand camera 12 obtains the position of the mark on the mark plate 13 below the camera by image processing, and calculates the stop position of the IC hand 1. The data obtained here is converted into the same coordinate system as the data of the deviation amount obtained earlier, and combined data of both data is created. Then, by comparing this combined data with that of the basic registration data, the correction amount of IC2 is determined. IC2
Is corrected by moving the IC hand 1,
It is aligned at the same position as when it was registered.

[0004]

In the conventional IC alignment mechanism, the position correction is performed using two cameras, so that the coordinate systems of the two cameras must be unified. In addition, it is necessary to convert the coordinate system of one camera into the coordinate system of the other camera. As a result, a conversion error occurs, the measurement accuracy is degraded, and the processing time is increased. Moreover, the use of two cameras tends to make the device expensive.

According to the present invention, high-precision IC positioning can be performed at low cost by performing image processing on both the position of the IC held by the IC hand and the stop position of the IC hand using a single camera. It is an object to provide a precision IC alignment mechanism.

[0006]

According to the present invention, there is provided an IC hand 1 which is placed on an XY table 4 and is capable of gripping an IC 2 and moving with freedom in XYZθ directions. And a contact head 6 provided with a mark 6a as a guide for detecting the center position of the IC hand 1 and the mark 6a and the IC 2 adsorbed to the hand 1 are image-recognized from below to thereby realize the center of the IC hand 1. A camera 3 for calculating the amount of displacement between the camera 3 and the center of the IC 2, and an XY table 4 so that when the IC hand 1 is stopped over the measurement center, the marked mark is located just above the camera 3.
A stop position of the IC hand 1 is calculated from a mark attached to the mark plate 5 whose image has been recognized by the camera 3, and this data is placed in the same coordinate system as the data of the displacement amount. After conversion, the synthesized data is created, and this is compared with the corresponding initial registration data to determine a correction amount.
The C hand 1 is moved by this correction amount to the measurement position.

[0007]

The present invention has a degree of freedom in the XYZθ directions,
An IC hand capable of transporting C and pressing the socket against a socket, etc .; and a contact head provided with a mark provided as a guide for confirming the position of the IC hand.
The amount of deviation between the center of the IC hand and the center of the IC is measured with a camera from below. When the IC hand stops at the center of the measurement, a mark plate is installed above the camera to measure the stop point, and the shift amount of the stop position of the IC hand is measured. Thus, the displacement when the IC hand sucks the IC and the displacement at the stop position of the IC hand are measured using one camera.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of a high-precision IC alignment mechanism according to an embodiment of the present invention will be described with reference to FIGS. First, in FIGS. 1 and 2, the IC hand 1 is on an XY table 4 and its lower end has a structure capable of adsorbing IC. The IC suction unit can be driven in the Z direction and the θ direction.
Can freely move in the Zθ direction.

The contact head 6 has a function of pressing the lead of the IC 2 attracted to the IC hand 1 against the contact for IC inspection, and has a mark for detecting the center position of the IC hand 1.

The camera 3 recognizes the mark and the IC 2 from below, so that the center of the IC hand 1 and the IC 2 can be recognized.
The amount of deviation from the center of is calculated.

The mark plate 5 is provided on the XY table 4 so that when the IC hand 1 stops above the measurement center as shown in FIG.
The stop position of the IC hand 1 is measured by the camera 3 being fixed on the upper side and recognizing the mark by the image. In particular,
Here, the mark plate 5 is mounted at the same height as the IC 2 so that the focal point of the camera 3 is at the same distance as the IC 2 whose image has been recognized earlier.

The data obtained here is converted into the same coordinate system as the data of the adsorption center obtained earlier, and combined data of both data is created. This is compared with that of the initial registration data, and the correction amount is calculated. It is determined. When the IC hand 1 moves to the correction position, the IC 2 is aligned at the same position as at the time of registration.

Next, details of an embodiment of the IC high-precision alignment mechanism according to the present invention will be described with reference to FIGS.

First, the contact state between the lead 2a of the IC 2 and the contact 10a for IC inspection is confirmed by using a monitor camera 8 as shown in FIG.
Stop position of hand 1, center of IC hand 1 and IC2
Is registered as basic data.

Next, this alignment procedure will be described with reference to FIGS.
This will be described with reference to FIG. First, IC2 is supplied by supply stage 7.
Is supplied, and the IC hand 1
Remove 2. The taken-out IC 2 is conveyed to the camera 3 as shown in FIG. 6, where the amount of deviation between the center position of the IC hand 1 and the center position of the IC 2 is calculated. In order to measure the center position of the IC hand 1, for example, as shown in FIG. 7, a mark 6a is attached to a diagonal position on the bottom surface of the contact head 6, and respective coordinates are measured by image processing, and It can be obtained by calculating coordinates. I to inspect
When the contact head 6 is replaced due to a change in the shape of C, the center of the IC hand 1 with respect to the mark 6a is shifted. You can find the center. Further, in order to measure the center position of the IC 2, as shown in FIG. 8, an intersection point connecting the four sides of the tip end of the lead of the IC 2 can be obtained, and the diagonal points can be connected respectively.

Next, as shown in FIG.
It is moved onto the C socket 10. Camera 3 at this position
Calculates the stop position of the IC hand 1 by performing image processing on the image of the mark attached to the mark plate 5 above the camera. The data obtained here is combined with the data of the deviation amount of the suction position previously obtained to calculate the correction amount. When the IC hand 1 moves by the correction amount, I
C2 is aligned at the same position as at the time of basic registration.

[0017]

According to the present invention, the displacement amount when the IC hand sucks the IC and the displacement amount at the stop position of the IC hand are measured using a single camera.
It is not necessary to convert the coordinate system of one camera into the coordinate system of the other camera as when using one camera. Further, an apparatus having the same or higher performance can be configured at low cost.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

FIG. 2 is a block diagram showing an embodiment of the present invention.

FIG. 3 is a block diagram showing an embodiment of the present invention.

FIG. 4 is a block diagram showing an embodiment of the present invention.

FIG. 5 is a block diagram showing an embodiment of the present invention.

FIG. 6 is a block diagram showing an embodiment of the present invention.

FIG. 7 is a bottom view of the mark plate used in the present invention.

FIG. 8 is a bottom view of the mark plate used in the present invention.

FIG. 9 is a block diagram showing an embodiment of the present invention.

FIG. 10 is a configuration diagram of a conventional IC alignment mechanism.

FIG. 11 is a configuration diagram of a conventional IC alignment mechanism.

[Explanation of symbols]

 Reference Signs List 1 IC hand 2 IC 2a IC lead 3 camera 4 XY table 5 mark plate 5a mark 6 contact head 6a mark 7 supply stage 8 monitor camera 9 cylinder 10 IC socket 10a IC inspection contact 11 device camera 12 hand camera 13 mark Board

Continued on the front page (58) Fields surveyed (Int.Cl. ⁶ , DB name) G01R 31/26 H01L 21/66 H01L 21/68

Claims (1)

(57) [Scope of request for utility model registration] An IC mounted on an XY table (4)
(2) An IC hand (1) that can be moved in the X, Y, and Z directions with a degree of freedom while holding the IC hand, and an IC hand attached to the tip of the IC hand (1).
Image recognition of the contact head (6) provided with a mark (6a) as a guide for detecting the center position of (1), and the mark (6a) and the IC (2) adsorbed on the hand (1) from below. The center of the IC hand (1)
The camera (3) that calculates the amount of deviation from the center of C (2), and the mark attached is positioned just above the camera (3) when the IC hand (1) stops above the measurement center. XY
A mark plate (5) mounted on the table (4) is provided, and the stop position of the IC hand (1) is calculated based on the mark on the mark plate (5) recognized by the camera (3). The data is converted into the same coordinate system as the data of the deviation amount to create composite data, and this is compared with the corresponding initial registration data to determine a correction amount, and the IC hand (1) is moved by this correction amount. High accuracy I characterized by moving to the measurement position
C alignment mechanism.