JPS5972794U - 集積回路部品整列支持用の治具 - Google Patents
集積回路部品整列支持用の治具Info
- Publication number
- JPS5972794U JPS5972794U JP16758282U JP16758282U JPS5972794U JP S5972794 U JPS5972794 U JP S5972794U JP 16758282 U JP16758282 U JP 16758282U JP 16758282 U JP16758282 U JP 16758282U JP S5972794 U JPS5972794 U JP S5972794U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- jig
- aligning
- frame
- circuit components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16758282U JPS5972794U (ja) | 1982-11-05 | 1982-11-05 | 集積回路部品整列支持用の治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16758282U JPS5972794U (ja) | 1982-11-05 | 1982-11-05 | 集積回路部品整列支持用の治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5972794U true JPS5972794U (ja) | 1984-05-17 |
JPH0124937Y2 JPH0124937Y2 (enrdf_load_stackoverflow) | 1989-07-27 |
Family
ID=30366595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16758282U Granted JPS5972794U (ja) | 1982-11-05 | 1982-11-05 | 集積回路部品整列支持用の治具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5972794U (enrdf_load_stackoverflow) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
-
1982
- 1982-11-05 JP JP16758282U patent/JPS5972794U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
Also Published As
Publication number | Publication date |
---|---|
JPH0124937Y2 (enrdf_load_stackoverflow) | 1989-07-27 |
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