JPS597267B2 - Manufacturing method of solid-state imaging device - Google Patents
Manufacturing method of solid-state imaging deviceInfo
- Publication number
- JPS597267B2 JPS597267B2 JP51159616A JP15961676A JPS597267B2 JP S597267 B2 JPS597267 B2 JP S597267B2 JP 51159616 A JP51159616 A JP 51159616A JP 15961676 A JP15961676 A JP 15961676A JP S597267 B2 JPS597267 B2 JP S597267B2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- adhesive
- imaging device
- recess
- state imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003384 imaging method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 9
- 238000000605 extraction Methods 0.000 description 7
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
【発明の詳細な説明】 本発明は固体撮像装置の製造方法に関するものである。[Detailed description of the invention] The present invention relates to a method for manufacturing a solid-state imaging device.
固体撮像素子にフィルタまたは、表面を保護する透明膜
等を接着する場合に、フィルタと固体撮 。When attaching a filter or a transparent film to protect the surface of a solid-state image sensor, the filter and solid-state image sensor are used.
像素子表面との間に、接着剤を入れなくてはならない。
この時、余分の接着剤が、フィルタ下部よりはみ出し、
フィルタの上部や、周囲のリード取出し用パッドに付着
する。フィルタは、受光面との位置合せが非常に重要で
あり、上部に付着した、余分の接着剤をふきとることは
不可能に近い。また、リード取出し用パッド上に付着し
たものは、リードを取り出す際に不都合を生じ不良の原
因となる。第１図に従来の固体撮像装置の上記欠点を示
す。An adhesive must be placed between the image element and the surface of the image element.
At this time, excess adhesive will protrude from the bottom of the filter.
It adheres to the top of the filter and the surrounding lead extraction pads. Alignment of the filter with the light-receiving surface is very important, and it is nearly impossible to wipe off excess adhesive that adheres to the top. In addition, anything that adheres to the lead extraction pad causes inconvenience when taking out the lead and causes a defect. FIG. 1 shows the above-mentioned drawbacks of the conventional solid-state imaging device.
１はフィルタ、２は固体撮像素子、３は絶縁膜、４は受
光部、５はリード取出し用パッド、６は接着剤である。1 is a filter, 2 is a solid-state image sensor, 3 is an insulating film, 4 is a light receiving section, 5 is a lead extraction pad, and 6 is an adhesive.
接着剤６を固体撮像素子２の受光面の一部に塗布してお
き、上からフィルタ１を圧着するわけであるから、余分
の接着剤６を押し出す力の差から、フィルタ１に傾きが
生じ望ましい事ではない。本発明は、余分の接着剤をは
み出させず、フィルタと固体撮像素子表面とを正確に密
着させる固体撮像装置の製造方法を提供するものである
。Since the adhesive 6 is applied to a part of the light-receiving surface of the solid-state image sensor 2 and the filter 1 is pressed from above, the filter 1 is tilted due to the difference in the force used to push out the excess adhesive 6. It's not a desirable thing. The present invention provides a method for manufacturing a solid-state imaging device that accurately brings a filter and the surface of a solid-state imaging device into close contact without causing excess adhesive to ooze out.
以下図面とともに本発明を実施例に基いて説明する。第
２図は本発明にかかる固体撮像素子の平面図であり、第
３図ａ、ｂおよびａ’、ｂ’は本発明の一実施例を示す
工程断面図および要部工程斜視図である。The present invention will be explained below based on examples together with the drawings. FIG. 2 is a plan view of a solid-state image sensing device according to the present invention, and FIGS. 3 a, b, a', b' are process cross-sectional views and essential process perspective views showing one embodiment of the present invention.
本発明において用いられる固体撮像素子は、第２図に示
すように、その表面には、中央部に受光部４が形成され
、周辺部にリード゛取出し用パッド５が設けられ、接着
剤６が注入される孔部Ｔは大きい開口を有する凹部７’
とこれより小さい凹部ｉ’とを備えている。As shown in FIG. 2, the solid-state image sensing device used in the present invention has a light-receiving portion 4 formed in the center on its surface, a lead extraction pad 5 in the periphery, and an adhesive 6. The hole T to be injected is a recess 7' having a large opening.
and a recess i' smaller than this.
そして、フィルタは受光部４と孔部Ｔとを覆うように設
置される。次に本発明の接着の方法について第３図ａ、
ｂおよびａ’、ｂ’を用いて述べる。Then, the filter is installed so as to cover the light receiving section 4 and the hole T. Next, regarding the adhesion method of the present invention, Fig. 3a,
This will be explained using b, a', and b'.
まず大きい凹部Ｔ’に比較的粘度の高い接着剤６を、凹
部Ｔ内に余裕をもたせてかつ固体撮像素子の表面より上
部に接着剤６がのぞ＜ように注入する（同図ａ、ａ’）
。First, a relatively high-viscosity adhesive 6 is injected into the large recess T', leaving enough space in the recess T so that the adhesive 6 is exposed above the surface of the solid-state image sensor (Fig. ')
.
この上から、フィルタ等の光透過板７を圧着することに
より、固体撮像素子表面より上にでていた接着剤６を、
フイルタ１により卦しつけ、大きい凹部７内に広げる（
同図Ｂ，ｂ′）この時、過剰の接着剤６は小さい凹部で
内にも広がる。ただし接着剤６の量は、大きい凹部７′
外にはみ出さない程度に注入しておく必要がある。接着
剤６が大きい凹部７′からはみ出して注入されていると
、フイルタ１を圧着した際に、接着剤６はフイルタ１の
上面やリード取り出し用パツド５にまで広がつたりする
。また、小さい凹部ｆが無い場合も、フイルタ１を圧着
した際に過剰の接着剤は固体撮像素子の表面からはみ出
してしまう。以上説明したように本発明の固体撮像装置
の製造方法は、接着剤注入用の第１の凹部と、これより
も小さい第２の凹部とを有する固体撮像素子の第１の凹
部に接着部が表面から盛り上がるように注入し、その後
該素子表面から光透過板を圧接するものであるため、接
着剤は光透過板の表面や、リード取り出し用バツドにま
で広がらないので、光透過板の正確な設置や、リードの
取り出しが容易にできる。また、光透過板と固体撮像素
子とは両者間に何も介することなく接着されるため、そ
の間に卦ける光の散乱は生じず、光の干渉のない精度の
高い固体撮像装置が得られる。By pressing a light transmitting plate 7 such as a filter on top of this, the adhesive 6 that was protruding above the surface of the solid-state image sensor is removed.
Apply a hexagram with the filter 1 and spread it into the large recess 7 (
Figures B and b') At this time, the excess adhesive 6 also spreads inside the small recess. However, the amount of adhesive 6 is
It is necessary to inject it to the extent that it does not protrude outside. If the adhesive 6 is injected so as to protrude from the large recess 7', the adhesive 6 will spread to the top surface of the filter 1 and the lead extraction pad 5 when the filter 1 is pressed. Furthermore, even if there is no small recess f, excess adhesive will protrude from the surface of the solid-state image sensor when the filter 1 is pressed. As explained above, in the method for manufacturing a solid-state imaging device of the present invention, an adhesive portion is formed in a first recess of a solid-state image sensor, which has a first recess for adhesive injection and a second recess smaller than the first recess. Since the adhesive is injected so that it rises from the surface and then the light transmitting plate is pressed from the element surface, the adhesive does not spread to the surface of the light transmitting plate or the lead extraction butts, so the accuracy of the light transmitting plate is determined. Easy to install and take out leads. Furthermore, since the light transmitting plate and the solid-state imaging device are bonded together without anything intervening between them, no light scattering occurs between them, and a highly accurate solid-state imaging device without light interference can be obtained.
第１図は従来の固体撮像装置の欠点を示す構造断面図、
第２図は本発明にかかる固体撮像素子の平面図、第３図
Ａ，ｂ卦よびａ′，ｂ′は本発明の一実施例を示す工程
断面図ち・よび要部工程斜視図である。
１・・・フイルタ、２・・・固体撮像素子、３・・・絶
縁膜、４・・・受光部、５・・・リード取出し用パツド
、６・・・接着剤、７・・・凹部、７（・・第１の凹部
、ｒ・・・第２の凹部。Figure 1 is a structural cross-sectional view showing the drawbacks of a conventional solid-state imaging device.
FIG. 2 is a plan view of a solid-state image sensor according to the present invention, and FIG. 3 is a cross-sectional view of a process and a perspective view of a principal part of the process showing an embodiment of the present invention. . DESCRIPTION OF SYMBOLS 1... Filter, 2... Solid-state image sensor, 3... Insulating film, 4... Light receiving part, 5... Pad for lead extraction, 6... Adhesive, 7... Recessed part, 7 (...first recess, r...second recess.
Claims (1)
よりも小さくかつ前記第１の凹部に連通する第２の凹部
とを有する固体撮像素子の前記第１の凹部内に、前記接
着剤を、前記固体撮像素子の平面から盛り上がるように
注入し、その後前記固体撮像素子の表面より光透過板を
圧接することを特徴とする固体撮像装置の製造方法。1. The adhesive is injected into the first recess of a solid-state imaging device, which has a first recess into which an adhesive is to be injected, and a second recess that is smaller than the first recess and communicates with the first recess. A method for manufacturing a solid-state imaging device, characterized in that an adhesive is injected so as to rise from the plane of the solid-state imaging device, and then a light transmitting plate is pressed against the surface of the solid-state imaging device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51159616A JPS597267B2 (en) | 1976-12-29 | 1976-12-29 | Manufacturing method of solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51159616A JPS597267B2 (en) | 1976-12-29 | 1976-12-29 | Manufacturing method of solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5384414A JPS5384414A (en) | 1978-07-25 |
| JPS597267B2 true JPS597267B2 (en) | 1984-02-17 |
Family
ID=15697597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51159616A Expired JPS597267B2 (en) | 1976-12-29 | 1976-12-29 | Manufacturing method of solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS597267B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5654174A (en) * | 1979-10-09 | 1981-05-14 | Toshiba Corp | Solidstate image sensor |
| JPS5864892A (en) * | 1981-10-13 | 1983-04-18 | Matsushita Electronics Corp | Image pickup device for color solid-state |
| JPS611856U (en) * | 1984-06-08 | 1986-01-08 | 松下電器産業株式会社 | optical reader |
-
1976
- 1976-12-29 JP JP51159616A patent/JPS597267B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5384414A (en) | 1978-07-25 |
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