JPS5970000A - Device for replacing tape electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for recombining tape electronic components, and more specifically, the present invention relates to an apparatus for recombining tape electronic components, and more specifically, a plurality of types of tape electronic components each having a plurality of one type of electronic components fixed with thermocompression tape are arranged, and several types of these electronic components are arranged. The present invention relates to a tape electronic component reassembly device that removes electronic components one by one from tape electronic components and reassembles them according to a preset order.

Conventional - As shown in Figure 1, Chi 7°1 and hot pressure M'
During step 7-4, the electronic component 2 is removed from the tape electronic component in which multiple electronic components 2 of one type are arranged, the multiple types of electronic components are rearranged in a predetermined order, and the tape electronic component 2 is placed on the printed board. In order to supply electronic components to the automatic component insertion machine, as shown in FIG. This is transferred onto a belt having a function of positioning and fixing electronic components, and is fed to the automatic electronic component insertion machine by being conveyed by the core belt.

However, this conventional technology not only requires a dedicated bell tray that has the function of positioning and fixing electronic components, but also cannot be applied to the automatic insertion system for electronic components that is currently widely used.
It has the disadvantage of lack of versatility.

An object of the present invention is to remove electronic components from a tape without cutting them from their leads, and to automatically rearrange multiple types of electronic components according to a preset order.
'@ K provides a recombination device for tape electronic components that can be assembled into tape electronic components compatible with an automatic insertion machine for child components.

A feature of the present invention is the JI' of electronic parts in tape electronic parts fixed with heat-press tape! A plurality of rows of transfer/holding means are arranged to transfer the tape electronic component at a constant pitch to the removal position and hold the tape electronic component against the removal force when the electronic component is removed, and to the removal position of the front electronic component. , a heating means for heating the fixing part of the electronic component in the tape component to a temperature that reduces the bonding ability of the thermopressure M tape, and a removal means for removing the electronic component from the tape are installed, and the removed electronic component is removed. The receiver is provided with taping means for picking up the electronic components from the removing means, arranging and fixing the electronic components between the tapes according to a preset order, and this configuration ensures that the above purpose is achieved. This is what we were able to achieve.

Hereinafter, the present invention will be explained based on the drawings.

3 to 8 show an embodiment of the present invention, in which a plurality of rows of tape electronic component transfer/holding means and a heating means 1 for a fixing part of an electronic component installed at an electronic component removal position are shown.
6, a removing means 19 for removing the electronic component from the tape, and a taping means 30 for receiving the electronic component from the removing means 19 and fixing it with tape.

The child component transfer/holding means of the Chi 71 are arranged in a plurality of rows depending on the type of electronic components in the tape electronic components to be newly assembled.
Only the holding means 6, 7', and 8 are shown representatively. Each transporting and holding means 6.7. 1o, and a driving gear 12 attached to the same shaft 9.

On the outer periphery of the sprocket wheel 10, protrusions 11≠2 are provided at intervals, and the feed holes 5 of the tape electronic components are fitted into the protrusions 11.
0 fully engages the protrusion 11 and the feed hole 5 to ensure that the tape electronic component is moved and fed to the electronic component removal position, and also to resist the removal force when the electronic component is removed by JI7. The tape is designed to hold electronic components. The gear 12 is connected to a drive unit (not shown) at the electronic component removal position, and is adapted to intermittently drive the sprocket wheel 10 to rotate in the direction of arrow a in FIG. 4. In addition, each transfer-holding means 6, 7.8 is connected to a conveying means (not shown), and is conveyed by the conveying means at pitches in the direction of the arrow in FIG. 3, and is sequentially sent to the electronic component removal position, It is then conveyed by pitch in the direction of arrow C in FIG. 3 and returned to its original position.

The heating means 13 for the fixing part of the electronic component is arranged at the electronic component removal position. Moreover, this heating means 16
As shown in FIG. 5, there are a heat block 15 attached to the shank 14 and a heater 16 wrapped around the shank 14. It has a power source 17 and a temperature controller 18. The front heating block 15 is heated by a heater 16 and is heated by a temperature controller 18. It is designed to be adjusted 8 degrees. Further, the heating means 13i is heated in the direction of arrow d in FIG. 4 from a position away from the sprocket wheel 10, that is, as it approaches the sprocket wheel 1oK. At that position, the area around the lead portion 30, which is the fixing portion of the electronic component, can be heated to a temperature at which the contact ability of the tape 4 before hot pressing is reduced.

Removal of the electronic components - f, stage 19 (rJ, as clearly shown in FIG. A casing 23 connected via a rotating shaft 22, and a pair of yoke 2 provided in the casing 23 so as to be openable and closable.
4,2A', and an operating device for the chuck 24 and 24'. The block 21 is moved from a position away from the sprocket wheel 1o to a position approaching the sprocket wheel 10, in the direction of arrow e in FIG. 4, by a drive unit such as a hydraulic cylinder (not shown). It has become. When the electronic components are removed, the casing 23 is ready for one operation #! 1 part (not shown) rotates approximately 180 degrees in the direction of arrow f in FIG. The chucks 24, 24' are always open. The operating mechanism of the chuck 24.24' includes a tension spring 26 for operating the chuck 24.24' to close and an opening operating section. As shown in FIG. 4, the opening operation part is a fluid pressure cylinder 27. A piston rod 28 is attached to the piston rod 71, and a button 29 is provided at the end of the piston rod 28. Chatter 24 by pushing against spring 26
．． 24' can be opened. Then, when the heating means 13 heats the lead portion 3, which is the fixing portion of the electronic component, the electronic component removal means 19 moves the blocks 21J&? and is operated to approach the sprocket wheel 10 through the casing 23, and at 2 the chuck 2a,
24' is operated to close and grips the lead part 3 of the 7E+ component, and at this point the chucks 24, 24'd are operated in the direction away from the sprocket wheel 10 to pull out the electronic component from the tape and rotate the first axis. 4-yak 2' + 24'd through 22 gold and 26k gold casing;
18υ0, rotated, then chuck 24,2
4'y5: Opening operation is performed, and the electronic component that has been pulled out is transferred to the next taping means 30.

As shown in FIGS. 3 and 4, the taping means 60 is provided with a receiver for the removed electronic components at a transfer position, and an I-node 33 of the tape 31 as a mount,
Guide roller 35 of this, reel 3 of thermocompression tape 62
4. It's guide roller 56, tape positioning block 37, guide rollers 38 for both tapes, rubbing block 39, hole punch 40-pitch feed roller 4
1. The tape positioning block 7 chucks the tape 31 and the hot pressure JR tape 32 pieces with a chuck 24.
The tape 31 and the thermocompression bonding tape 62 are positioned at the position where the lead wire 39 of the V electronic component is inserted through 24'.

The taping professional 39 (c) is equipped with a heater similar to the heat block 15 of the heating means 13;
is heated to apply pressure jW to the tape 31. The bread 4-40 is.

Feed holes 43 are inserted into the reorganized taped electronic components 42 at intervals suitable for an automatic electronic component insertion machine (not shown).
It is configured to reveal the following. Then, the tape 31 is pulled out from this taping means 60il''1l17 and 63, and the thermocompression bonding tape 32 is pulled out from the other 11-rule 34, and the tape positioning program 37 ensures that the tape 31 and the thermocompression bonding tape 32 are properly overlapped. At the same time, when the lead part 3 of the electronic component is inserted between the two tapes, temporary taping is performed, and the thermocompression adhesive tape 32 is further heated by the taping block 39 and pressed to the tape 31, thereby forming the main chip 7. ° The tape electronic components 42 are knitted into electronic components 42, and then the punch 40 is used to punch holes 43 in the tape electronic components 42 at intervals suitable for an automatic electronic component insertion machine, and the pitch feed rollers 41 are used to feed the tape electronic components storage box 41. It is composed of

The tape electronic component recombination apparatus of the above embodiment operates as follows.

That is, one type of electronic component 2a, 2b,
The tape electronic component taped with 2C is passed by fitting the feed hole 5 formed in the tape electronic component into the protrusion 11 provided on the sprocket wheel 10, and then passing it through each transfer/holding means 6, 7, 8. 3, and when the transport holding means 6 is moved to the electronic component removal position, it is temporarily stopped, and at this position, the gear 12 of the transport/holding means 6 is moved in the direction of the arrow a in Fig. 4. The sprocket wheel 1o-q is rotated at a constant pitch to set the electronic component 2a at its removal position as shown in FIG.

Next, move the heat block 15 of the heating means 18 by the arrow d in FIG.
The thermocompression tape 4 is bonded around the lead portion 60, which is the fixing portion of the electronic component 2a, in the tape electronic component at a position close to the subrocket wheel 10 as shown in FIG. Heat to a temperature that reduces performance.

Meanwhile, the chuck 24.24' is moved in the direction of arrow e in FIG. 4 via the block 21 and casing 26 of the electronic component removal means 19, and the chuck 24.24' is closed at a position where it can grip the electronic component 2a. When operated, the electronic component 2a is gripped as shown in FIG.

The heat block 15 of the 7JO heating means 16 heats the thermocompression tape 4 to a temperature that reduces its adhesion ability, and the electronic component 2 is removed by the electronic component removal means 190 chuck 24Q24'.
At the point when the C4-yoke 24, 2 is gripped, the block 21 and the casing 23 are held as shown in FIG.
4' is moved in a direction away from the sprocket wheel 10, and one electronic component 2a is pulled out from between the tape 1 and the thermocompression tape 4. When the electronic component 2 is pulled out, the tape electronic component is exposed to the protrusions provided in the feed hole 5 and the sprocket wheel 10! It is securely held through fitting with 11.

When the electronic component 2a is pulled out, the electronic component 2a in the tape electronic component is heated by the heating block 15 of the heating means 13.
The thermocompression adhesive tape 4 is attached around the lead part 3 of fj if
Since it is heated to a temperature at which f; decreases, the lead portion 3
The electronic component 2a can be easily pulled out without cutting the
Can be removed.

Meanwhile, the heating hand 13's 15;
It is moved and returned to a fixed position.

After pulling out one electronic component 2a, chuck 24°24'
is rotated once by 180° in the direction of arrow f of the fourth (/1) through the rotating shaft 22 and the casing 23, and the electronic component 28 is transferred in the direction of the nine taping stages 30 as shown in FIG.

The taping means 30 receives the tape 31 from the +1/min 33 and the thermocompression tape 32 from the other reel 34.
A: The tape 31 and the thermocompression tape 52 are brought together and positioned by the tape positioning block 37, and the 4-Year 24.24'
As a result, the lead portion 3 of the electronic component 2a is inserted between both tapes. When the lead part 3 of the electronic component 2a is inserted between both tapes, the tape is placed at position 1 and the professional
Temporary taping is performed using the hook 67. Further, the chatter 24° 24' is opened when the electronic component 2a is delivered to the taping means 30, and then rotated approximately 180° through the rotary shaft 22 and the casing 23, so that the chatter 24' is opened as shown in FIG. He is returned to his position.

Subsequently, in the taping means 30, the electronic component 2a temporarily taped with the tape positioning block 67 and both tapes are sent to the position of the taping block 39, and the taping block 39 places the thermocompression bonding tape 32fr:
While being heated, it is crimped and fixed to the tape 31,
Then it is sent to the position of the punch 40, and the punch 4-40
The feed holes 4 have a spacing that matches the automatic insertion machine for electronic components.
3 is opened and organized into 'th' tape electronic components 42.

As mentioned above, the electronic component 2a is removed from the tape electronic component, and a new tape 51 and thermocompression tape 32)+1 are attached.
1, the transfer/holding means 7, 8°...all the electronic components are taken out one after another into the first generation, and the electronic components 2b, 20.・
. . are removed one by one in the same process as the electronic component 2a, and then fixed to the tape 31 and thermocompression tape 3211II, thereby rearranging different types of electronic components according to a preset order, and creating electronic components. The tape can be assembled into electronic components that are compatible with automatic insertion machines.

゛ Still different from the above! ! ? After assembling one tape electronic component in which electronic components are arranged according to a preset order, move the transfer/holding means 6, 7, 8°, etc. in the direction of arrow C in FIG. By repeating the above two steps, a new tape electronic component can be assembled.

In addition, in the present invention, the tape as a material is used for transporting and
Holding means 6, 7, 8. . . . - Heating means 13 for the fixed part of the electronic component in the tape electronic component, means 19 for removing the electronic component, and taping means 30tr for rearranging and fixing the removed electronic component! However, the present invention is not limited to the one shown in the illustrated embodiment, and any other material that can fulfill the intended function may be used.

The present invention has the above-described configuration 1.According to the present invention, tape cord parts of different types are transferred one by one to the removal position by the transfer/holding means arranged in a plurality of rows. At the same time, the tape holds the electronic component against the removal force when removing the electronic component.
The fixed part of the electronic component is heated by heating means to a temperature at which the adhesion ability of the thermocompression tape is reduced, and the heated electronic component is removed by the removing means and delivered to the taping means. Since the electronic components are removed from the receiver, arranged between the tapes according to a preset order, and fixed, the electronic components can be easily removed from the tape without cutting the electronic components at their leads. This has the effect of automatically rearranging a plurality of types of electronic components according to a preset order and organizing them into tape electronic components that are compatible with an automatic electronic component insertion machine.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a tape electronic component as a material, Figure 2I
A is an explanatory diagram of the prior art, FIGS. 3 to 8 show an embodiment of the present invention, FIG. 3 is a perspective view showing the arrangement of each member, FIG. 4 is a partially enlarged perspective view, FIG. 5 is an enlarged perspective view of the heating means, and FIGS. 6, 7, and 8 are explanatory diagrams, respectively. DESCRIPTION OF SYMBOLS 1... Tape, 2... Electronic component, 3... Lead part, 4... mLEt# tape-6, 7, B... Tape electronic component transfer/holding means, 10... Transfer - Sprocket wheel of holding means, 16... Heating means [1, Death... Heat block of heating means, 19... Means for removing electronic parts. 24, 24'... Removal means knob, 25~
29... Member constituting the chuck opening/closing operation mechanism, 3
0... Taping means, 5.1... Tape for recombining and organizing electronic components, 32... Same thermopressure 5d tape, 35
~41... Taping means +1iJ & evil kidnapping, 4
2...Chi71 child parts made by rearranging and organizing electronic parts. Agent Patent Attorney Susuki 1) Profit P%. May:,:++i! Sword 4 Figure 5/3 (Figure 6 Figure 7 M Figure 8 445

Claims (1)

[Claims] Transfer/holding means for transferring the tape electronic component fixed with a thermocompression tape to a removal position of the electronic component at a constant rate and holding the tape electronic component against the removal force when the electronic component is removed. A plurality of rows of heating means are arranged at one of the electronic component removal positions, heating means for heating the fixed part of the electronic component on the tape electronic component to a temperature that reduces the adhesion ability of the thermocompression tape, and a removal means for removing the electronic component from the tape. The receiver for installed and removed electronic components is provided with taping means at the transfer position for picking up the electronic components from the removing means, arranging and fixing the electronic components between the tapes according to a preset order. A device for recombining tape electronic components.