JPS5967932U - Semiconductor device manufacturing equipment - Google Patents

Semiconductor device manufacturing equipment

Info

Publication number
JPS5967932U
JPS5967932U JP16378982U JP16378982U JPS5967932U JP S5967932 U JPS5967932 U JP S5967932U JP 16378982 U JP16378982 U JP 16378982U JP 16378982 U JP16378982 U JP 16378982U JP S5967932 U JPS5967932 U JP S5967932U
Authority
JP
Japan
Prior art keywords
semiconductor device
device manufacturing
solder tape
manufacturing equipment
tape feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16378982U
Other languages
Japanese (ja)
Inventor
園部　正
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP16378982U priority Critical patent/JPS5967932U/en
Publication of JPS5967932U publication Critical patent/JPS5967932U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の半導体製造装置の一例を示す側面図、第
２図乃至第４図は第１図の一部の動作状態を説明するた
めの部分側面図、第５図及び第６図は本考案の一実施例
を示す各反転状態での側面図である。 ２・・・・・・金属基板、９・・・・・・半田テープ、
１２・・・・・・半導体ペレット、１３・・・・・・半
田テープ送り部、１４・・・・・・反転駆動部。FIG. 1 is a side view showing an example of a conventional semiconductor manufacturing apparatus, FIGS. 2 to 4 are partial side views for explaining the operating state of a part of FIG. 1, and FIGS. 5 and 6 are FIG. 3 is a side view of an embodiment of the present invention in each inverted state; 2...Metal board, 9...Solder tape,
12... Semiconductor pellet, 13... Solder tape feeding section, 14... Reversing drive section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 加熱された金属基板の半導体ペレットマウント位置に定
方向より半田テープを定寸ずつ間歇供給する半田テープ
送り部と、半田テープ送り部を前記半田テープの送り方
向を回転中心として適宜１８０°反転させる反転駆動部
とを具備したことを特徴とする半導体装置製造装置。A solder tape feeding section that intermittently supplies solder tape by a fixed size from a fixed direction to a semiconductor pellet mounting position of a heated metal substrate, and an inversion that appropriately turns the solder tape feeding section 180 degrees around the solder tape feeding direction as a rotation center. A semiconductor device manufacturing apparatus comprising: a driving section.
JP16378982U 1982-10-27 1982-10-27 Semiconductor device manufacturing equipment Pending JPS5967932U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16378982U JPS5967932U (en) 1982-10-27 1982-10-27 Semiconductor device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16378982U JPS5967932U (en) 1982-10-27 1982-10-27 Semiconductor device manufacturing equipment

Publications (1)

Publication Number Publication Date
JPS5967932U true JPS5967932U (en) 1984-05-08

Family

ID=30359274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16378982U Pending JPS5967932U (en) 1982-10-27 1982-10-27 Semiconductor device manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS5967932U (en)

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